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81. 发明申请

US20080063258A1 Defect inspection apparatus 审中-公开
标题翻译：缺陷检查装置
公开(公告)号：US20080063258A1
公开(公告)日：2008-03-13
申请号：US11979143
申请日：2007-10-31
申请人： Toshifumi Kimba
发明人： Toshifumi Kimba
IPC分类号： G06K9/00
CPC分类号： G01N21/95607 , G03F7/7065 , H01J37/222 , H01J37/265 , H01J2237/2487
摘要： A controller determines, in response to a position coordinate from an X/Y interferometer, which algorism should be used for current inspection, and controls a connection status of a switch to store a reference image corresponding thereto in an image memory. The reference image is one of an image of a sample surface obtained by an image data acquisition unit, an image provided from a cell reference image generation unit, and an image provided from a CAD data reference image generation unit. The controller further controls a connection status of a second switch to provide the reference image associated with the current inspection algorism to an image comparator, where the provided reference image is compared with a currently obtained image. On the basis of a result of the comparison, a defect determination unit determines the presence/absence of a defect. Therefore, an utilization efficiency of a defect inspection apparatus which is capable of performing a plurality of defect inspection algorism, can be improved.
摘要翻译：控制器响应于来自X / Y干涉仪的位置坐标来确定应当用于当前检查的算法，并且控制开关的连接状态以将与其对应的参考图像存储在图像存储器中。参考图像是由图像数据获取单元获得的样本表面的图像，从单元参考图像生成单元提供的图像和从CAD数据参考图像生成单元提供的图像之一。控制器进一步控制第二开关的连接状态，以将与当前检查算法相关联的参考图像提供给图像比较器，其中将所提供的参考图像与当前获得的图像进行比较。基于比较的结果，缺陷确定单元确定缺陷的存在/不存在。因此，可以提高能够执行多个缺陷检查算法的缺陷检查装置的利用效率。

82. 发明授权

US07072050B2 Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus 失效
公开(公告)号：US07072050B2
公开(公告)日：2006-07-04
申请号：US10854330
申请日：2004-05-27
申请人： Toshifumi Kimba , Shunsuke Nakai
发明人： Toshifumi Kimba , Shunsuke Nakai
IPC分类号： G01B11/28
CPC分类号： B24B37/013 , B08B1/04 , B24B49/12 , G01B11/0625 , G01B11/0683
摘要： A jet of water in a cylindrical form is supplied from a jet nozzle onto a measurement surface of a substrate to form a column of the water extending between the nozzle and the measurement surface. Light is emitted from an irradiation fiber and transmitted through the column of water to the measurement surface. The light reflected by the measurement surface is received by a light-receiving fiber through the column of water. A measurement calculation unit measures the thickness of a film formed on the substrate, based on the intensity of the reflected light.

83. 发明授权

US08414355B2 Substrate processing apparatus 有权
标题翻译：基板加工装置
公开(公告)号：US08414355B2
公开(公告)日：2013-04-09
申请号：US12458814
申请日：2009-07-23
申请人： Toshifumi Kimba , Hiroaki Kusa
发明人： Toshifumi Kimba , Hiroaki Kusa
IPC分类号： B24B49/00 , B24B51/00 , G01B11/00
CPC分类号： B24B9/065 , B24B21/004 , B24B37/013 , B24B49/12
摘要： A substrate processing apparatus having a polishing unit for polishing a periphery of a substrate. The substrate processing apparatus includes: a polishing unit configured to polish a periphery of a substrate; an imaging module configured to take an image of the periphery of the substrate polished by the polishing unit; and an image processing section configured to inspect a polished state of the substrate based on the image taken by the imaging module. The imaging module is configured to take the image of the periphery of the substrate when the polishing unit is not polishing the periphery of the substrate.
摘要翻译：一种基板处理装置，具有用于研磨基板周边的研磨单元。基板处理装置包括：抛光单元，被配置为抛光基板的周边; 成像模块，被配置为拍摄由所述抛光单元抛光的所述基板的周边的图像; 以及图像处理部，其被配置为基于由所述成像模块拍摄的图像来检查所述基板的抛光状态。成像模块被配置为当抛光单元不抛光基板的周边时拍摄基板的周边的图像。

84. 发明授权

US08115912B2 Polishing end point detection method, polishing end point detection apparatus, and polishing apparatus 有权
标题翻译：抛光终点检测方法，抛光终点检测装置和抛光装置
公开(公告)号：US08115912B2
公开(公告)日：2012-02-14
申请号：US13237125
申请日：2011-09-20
申请人： Toshifumi Kimba
发明人： Toshifumi Kimba
IPC分类号： G01J4/04 , B24B49/00
CPC分类号： G01N21/211 , B24B37/013 , B24B49/12 , G01N2021/215
摘要： A polishing end point detection method is to detect a polishing end point of a workpiece having a multilayer structure. The method is performed by emitting a first light and a second light to a surface of the workpiece at a first angle of incidence and a second angle of incidence, respectively, receiving the first light and the second light reflected from the surface through a polarizing filter, performing a first analyzing process of analyzing a brightness and a saturation of the surface from the first light received, performing a second analyzing process of analyzing a brightness and a saturation of the surface from the second light received, and determining removal of the upper layer based on changes in the brightness and the saturation of the surface.
摘要翻译：抛光终点检测方法是检测具有多层结构的工件的抛光终点。该方法通过以第一入射角和第二入射角分别向工件的表面发射第一光和第二光，通过偏振滤光器接收第一光和从表面反射的第二光，执行从接收的第一光分析表面的亮度和饱和度的第一分析处理，执行从接收的第二光分析表面的亮度和饱和度的第二分析处理，并且确定上层的去除基于表面的亮度和饱和度的变化。

85. 发明申请

US20100282956A1 XY-COORDINATE COMPENSATION APPARATUS AND METHOD IN SAMPLE PATTERN INSPECTION APPARATUS 有权
标题翻译： XY坐标补偿装置和样本样式检查装置的方法
公开(公告)号：US20100282956A1
公开(公告)日：2010-11-11
申请号：US12226683
申请日：2007-04-25
申请人： Toshifumi Kimba , Keisuke Mizuuchi
发明人： Toshifumi Kimba , Keisuke Mizuuchi
IPC分类号： G01D18/00 , G06F19/00
CPC分类号： H01J37/3045 , G01N23/00 , H01J37/28 , H01J2237/2817 , H01L21/681
摘要： Stage orthogonal error and position errors caused by mirror distortion are reduced. A CPU 10-2 calculates a coordinate error (Δx,Δy) between a measured XY coordinate (x,y) of each of arbitrary reference points on a wafer W0 loaded on a XY stage 10-1 which is measured by a laser interferometer 10-4 and a calculated ideal position XY coordinate of the reference point, calculates an orthogonal error of the XY coordinates on the bases of the calculated coordinate errors (Δx,Δy) and an error due to mirror distortion, and stores them in a storage device 10-5. When a wafer W is actually inspected, the CPU 10-2 corrects the measured position coordinates (x,y) from the laser interferometer 10-4 on the basis of the calculated orthogonal error, and corrects beam deflector 10-7 for deflection on the basis of the calculated error due to mirror distortion.
摘要翻译：由镜面失真引起的阶段正交误差和位置误差降低。 CPU10-2计算在载置在XY平台10-1上的晶片W0上的任意基准点的测量XY坐标（x，y）之间的坐标误差（＆Dgr; x，＆Dgr; y）激光干涉仪10-4和参考点的计算的理想位置XY坐标，基于计算的坐标误差（＆Dgr; x，＆Dgr; y）计算XY坐标的正交误差和由于镜像失真引起的误差并将它们存储在存储设备10-5中。当实际检查晶片W时，CPU10-2根据计算出的正交误差校正来自激光干涉仪10-4的测量位置坐标（x，y），并且修正光束偏转器10-7以使其偏转由于镜面失真导致计算误差的基础。

86. 发明申请

US20090051939A1 Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus 有权
标题翻译：基板膜厚测定方法，基板膜厚测定装置及基板处理装置
公开(公告)号：US20090051939A1
公开(公告)日：2009-02-26
申请号：US12222631
申请日：2008-08-13
申请人： Toshifumi Kimba , Shunsuke Nakai
发明人： Toshifumi Kimba , Shunsuke Nakai
IPC分类号： G01B11/06
CPC分类号： B24B37/013 , B08B1/04 , B24B49/12 , G01B11/0625 , G01B11/0683
摘要： A jet of water in a cylindrical form is supplied from a jet nozzle onto a measurement surface of a substrate to form a column of the water extending between the nozzle and the measurement surface. Light is emitted from an irradiation fiber and transmitted through the column of water to the measurement surface. The light reflected by the measurement surface is received by a light-receiving fiber through the column of water. A measurement calculation unit measures the thickness of a film formed on the substrate, based on the intensity of the reflected light.
摘要翻译：将圆柱形的水射流从喷嘴供应到基板的测量表面上，以形成在喷嘴和测量表面之间延伸的水柱。光从照射纤维发射并通过水柱传递到测量表面。由测量表面反射的光被受光纤通过水柱接收。测量计算单元基于反射光的强度来测量形成在基板上的膜的厚度。

87. 发明授权

US07428064B2 Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus 有权
标题翻译：基板膜厚测定方法，基板膜厚测定装置及基板处理装置
公开(公告)号：US07428064B2
公开(公告)日：2008-09-23
申请号：US11430976
申请日：2006-05-10
申请人： Toshifumi Kimba , Shunsuke Nakai
发明人： Toshifumi Kimba , Shunsuke Nakai
IPC分类号： G01B11/06
CPC分类号： B24B37/013 , B08B1/04 , B24B49/12 , G01B11/0625 , G01B11/0683
摘要： A jet of water in a cylindrical form is supplied from a jet nozzle onto a measurement surface of a substrate to form a column of the water extending between the nozzle and the measurement surface. Light is emitted from an irradiation fiber and transmitted through the column of water to the measurement surface. The light reflected by the measurement surface is received by a light-receiving fiber through the column of water. A measurement calculation unit measures the thickness of a film formed on the substrate, based on the intensity of the reflected light.
摘要翻译：将圆柱形的水射流从喷嘴供应到基板的测量表面上，以形成在喷嘴和测量表面之间延伸的水柱。光从照射纤维发射并通过水柱传递到测量表面。由测量表面反射的光被受光纤通过水柱接收。测量计算单元基于反射光的强度来测量形成在基板上的膜的厚度。

88. 发明申请

US20060209308A1 Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus 有权
公开(公告)号：US20060209308A1
公开(公告)日：2006-09-21
申请号：US11430976
申请日：2006-05-10
申请人： Toshifumi Kimba , Shunsuke Nakai
发明人： Toshifumi Kimba , Shunsuke Nakai
IPC分类号： G01B11/02
CPC分类号： B24B37/013 , B08B1/04 , B24B49/12 , G01B11/0625 , G01B11/0683
摘要： A jet of water in a cylindrical form is supplied from a jet nozzle onto a measurement surface of a substrate to form a column of the water extending between the nozzle and the measurement surface. Light is emitted from an irradiation fiber and transmitted through the column of water to the measurement surface. The light reflected by the measurement surface is received by a light-receiving fiber through the column of water. A measurement calculation unit measures the thickness of a film formed on the substrate, based on the intensity of the reflected light.

89. 发明申请

US20050205781A1 Defect inspection apparatus 审中-公开
标题翻译：缺陷检查装置
公开(公告)号：US20050205781A1
公开(公告)日：2005-09-22
申请号：US11030320
申请日：2005-01-07
申请人： Toshifumi Kimba
发明人： Toshifumi Kimba
IPC分类号： G01N21/956 , G03F7/20 , G21K7/00
CPC分类号： G01N21/95607 , G03F7/7065 , H01J37/222 , H01J37/265 , H01J2237/2487
摘要： A controller determines, in response to a position coordinate from an X/Y interferometer, which algorism should be used for current inspection, and controls a connection status of a switch to store a reference image corresponding thereto in an image memory. The reference image is one of an image of a sample surface obtained by an image data acquisition unit, an image provided from a cell reference image generation unit, and an image provided from a CAD data reference image generation unit. The controller further controls a connection status of a second switch to provide the reference image associated with the current inspection algorism to an image comparator, where the provided reference image is compared with a currently obtained image. On the basis of a result of the comparison, a defect determination unit determines the presence/absence of a defect. Therefore, an utilization efficiency of a defect inspection apparatus which is capable of performing a plurality of defect inspection algorism, can be improved.
摘要翻译：控制器响应于来自X / Y干涉仪的位置坐标来确定应当用于当前检查的算法，并且控制开关的连接状态以将与其对应的参考图像存储在图像存储器中。参考图像是由图像数据获取单元获得的样本表面的图像，从单元参考图像生成单元提供的图像和从CAD数据参考图像生成单元提供的图像之一。控制器进一步控制第二开关的连接状态，以将与当前检查算法相关联的参考图像提供给图像比较器，其中将所提供的参考图像与当前获得的图像进行比较。基于比较的结果，缺陷确定单元确定缺陷的存在/不存在。因此，可以提高能够执行多个缺陷检查算法的缺陷检查装置的利用效率。

90. 发明授权

US06785010B2 Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus 有权
标题翻译：基板膜厚测定方法，基板膜厚测定装置及基板处理装置
公开(公告)号：US06785010B2
公开(公告)日：2004-08-31
申请号：US09734737
申请日：2000-12-13
申请人： Toshifumi Kimba , Shunsuke Nakai
发明人： Toshifumi Kimba , Shunsuke Nakai
IPC分类号： G01B1106
CPC分类号： B24B37/013 , B08B1/04 , B24B49/12 , G01B11/0625 , G01B11/0683
摘要： A jet of water in a cylindrical form is supplied from a jet nozzle onto a measurement surface of a substrate to form a column of the water extending between the nozzle and the measurement surface. Light is emitted from an irradiation fiber and transmitted through the column of water to the measurement surface. The light reflected by the measurement surface is received by a light-receiving fiber through the column of water. A measurement calculation unit measures the thickness of a film formed on the substrate, based on the intensity of the reflected light.
摘要翻译：将圆柱形的水射流从喷嘴供应到基板的测量表面上，以形成在喷嘴和测量表面之间延伸的水柱。光从照射纤维发射并通过水柱传递到测量表面。由测量表面反射的光被受光纤通过水柱接收。测量计算单元基于反射光的强度来测量形成在基板上的膜的厚度。

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