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81. 发明申请

US20060046528A1 Electrical connector design and contact geometry and method of use thereof and methods of fabrication thereof 失效
标题翻译：电连接器设计和接触几何及其使用方法及其制造方法
公开(公告)号：US20060046528A1
公开(公告)日：2006-03-02
申请号：US10928473
申请日：2004-08-27
申请人： Brian Beaman , George Chiu , Keith Fogel , Paul Lauro , Daniel Morris , Da-Yuan Shih
发明人： Brian Beaman , George Chiu , Keith Fogel , Paul Lauro , Daniel Morris , Da-Yuan Shih
IPC分类号： H01R12/00
CPC分类号： H01R13/2464 , G01R1/06716 , G01R1/06727 , G01R1/07314 , G01R1/07357 , H01R12/714
摘要： A probe or an electrical connector comprises a substrate with a surface having a plurality of electrical contact locations. A shaped elongated electrical conductor has a first end coupled to one of the electrical contact locations and a second end thereof which projects away from the electrical contact location and through an aperture in a sheet of material. The sheet is disposed to be spaced apart from the surface of the substrate. At the second end of the elongated electrical conductor there is a tip structure, which is larger than the aperture in the sheet of material. The tip structure has a pointed portion thereof. The tip structure is disposed against contact locations of a contact surface. The electronic structure is moved towards the contact surface permitting the tip structure to penetrate into the surface of the electrical contact location thereon and to move, wipe, or vibrate across the surface thereof as the shaped elongated electrical conductor flexes as a result of being compressed by the movement of the electronic structure toward the contact surface.
摘要翻译：探针或电连接器包括具有多个电接触位置的表面的基底。成形细长的电导体具有联接到电接触位置之一的第一端和其第二端，其突出远离电接触位置并穿过材料片中的孔。片材被设置成与衬底的表面间隔开。在细长电导体的第二端，有一个尖端结构，其大于该材料片中的孔。尖端结构具有其尖端部分。尖端结构设置成抵靠接触表面的接触位置。电子结构朝向接触表面移动，允许尖端结构穿过其中的电接触位置的表面并且随着成形细长电导体由于被...的压缩而弯曲而在其表面上移动，擦拭或振动电子结构向接触表面移动。

82. 发明授权

US06805974B2 Lead-free tin-silver-copper alloy solder composition 有权
标题翻译：无铅锡银铜合金焊料组成
公开(公告)号：US06805974B2
公开(公告)日：2004-10-19
申请号：US10078020
申请日：2002-02-15
申请人： Won K. Choi , Charles C. Goldsmith , Timothy A. Gosselin , Donald W. Henderson , Sung K. Kang , Karl J. Puttlitz, Sr. , Da-Yuan Shih
发明人： Won K. Choi , Charles C. Goldsmith , Timothy A. Gosselin , Donald W. Henderson , Sung K. Kang , Karl J. Puttlitz, Sr. , Da-Yuan Shih
IPC分类号： B23K3526
CPC分类号： C22C13/00 , B23K35/262 , B23K2101/36 , H01L24/11 , H01L24/16 , H01L2224/05568 , H01L2224/05573 , H01L2924/01322 , H01L2924/14 , H05K3/3436 , H05K3/3463 , Y10T428/12708 , Y10T428/12715 , Y10T428/12722 , H01L2924/00
摘要： A solder composition and associated method of formation. The solder composition comprises a substantially lead-free alloy that includes tin (Sn), silver (Ag), and copper. The tin has a weight percent concentration in the alloy of at least about 90%. The silver has a weight percent concentration X in the alloy. X is sufficiently small that formation of Ag3Sn plates is substantially suppressed when the alloy in a liquefied state is being solidified by being cooled to a lower temperature at which the solid Sn phase is nucleated. This lower temperature corresponds to an undercooling &dgr;T relative to the eutectic melting temperature of the alloy. Alternatively, X may be about 4.0% or less, wherein the liquefied alloy is cooled at a cooling rate that is high enough to substantially suppress Ag3Sn plate formation in the alloy. The copper has a weight percent concentration in the alloy not exceeding about 1.5%.
摘要翻译：焊料组成及相关的形成方法。焊料组合物包括基本上无铅的合金，其包括锡（Sn），银（Ag）和铜。锡在合金中的重量百分比浓度至少为约90％。银在合金中具有重量百分比浓度X. X足够小，当液态的合金通过冷却至固相Sn相成核的较低温度而固化时，基本上抑制了Ag 3 Sn板的形成。该较低温度对应于相对于合金的共晶熔融温度的过冷度差ΔT。或者，X可以为约4.0％以下，其中液化合金以足够高的冷却速度被冷却，以基本上抑制合金中的Ag 3 Sn板的形成。铜在合金中的重量百分比浓度不超过约1.5％。

83. 发明授权

US06528984B2 Integrated compliant probe for wafer level test and burn-in 有权
标题翻译：用于晶圆级测试和老化的集成兼容探头
公开(公告)号：US06528984B2
公开(公告)日：2003-03-04
申请号：US09254768
申请日：1999-03-11
申请人： Brian Samuel Beaman , Keith Edward Fogel , Paul Alfred Lauro , Da-Yuan Shih
发明人： Brian Samuel Beaman , Keith Edward Fogel , Paul Alfred Lauro , Da-Yuan Shih
IPC分类号： G01R1073
CPC分类号： G01R1/0735 , G01R1/06738 , G01R1/0675 , G01R1/06761 , G01R1/07307 , G01R1/07342 , G01R1/07357 , H01L2224/1134 , H01L2924/00013 , H01L2924/01033 , H01L2924/09701 , H01L2924/14 , H01L2224/13099
摘要： The present invention is directed to a structure comprising a substrate having a surface; a plurality of elongated electrical conductors extending away from the surface; each of said elongated electrical conductors having a first end affixed to the surface and a second end projecting away from the surface; there being a plurality of second ends; and a means for maintaining the plurality of the second ends in substantially fixed positions with respect to each other. The structure is useful as a probe for testing and burning in integrated circuit chips at the wafer level.
摘要翻译：本发明涉及包括具有表面的基板的结构; 多个细长电导体，远离表面延伸; 每个所述细长电导体具有固定到表面的第一端和远离表面突出的第二端; 存在多个第二端; 以及用于将多个第二端保持在相对于彼此基本上固定的位置的装置。该结构可用作晶圆级集成电路芯片中测试和刻录的探头。

84. 发明授权

US06329827B1 High density cantilevered probe for electronic devices 失效
标题翻译：用于电子设备的高密度悬臂式探头
公开(公告)号：US06329827B1
公开(公告)日：2001-12-11
申请号：US09208529
申请日：1998-12-09
申请人： Brian Samuel Beaman , Keith Edward Fogel , Paul Alfred Lauro , Maurice Heathcote Norcott , Da-Yuan Shih
发明人： Brian Samuel Beaman , Keith Edward Fogel , Paul Alfred Lauro , Maurice Heathcote Norcott , Da-Yuan Shih
IPC分类号： G01R1073
CPC分类号： G01R1/06727 , G01R1/06744 , G01R1/07342 , G01R3/00 , H05K3/326 , H05K3/4015
摘要： Connectors for electronic devices are described. The connector is formed by ball bonding a plurality of wires to contact locations on a fan out substrate surface. The wires are cut off leaving stubs. A patterned polymer sheet having electrical conductor patterns therein is disposed over the stubs which extend through holes in the sheet. The ends of the wires are flattened to remit the polymer sheet in place. The wire is connected to an electrical conductor on the polymer sheet which is converted to a contact pad on the polymer sheet. A second wire is ball bonded to the pad on the polymer sheet and cut to leave a second stub. The polymer sheet is laser cut so that each second stub is free to move independently of the other second studs. The ends of the second stubs are disposed against contact locations of an electronic device, such as an FC chip, to test the electronic device.
摘要翻译：描述用于电子设备的连接器。连接器通过将多根电线球焊接在扇形基板表面上的接触位置而形成。电线被切断留下残留物。其中具有电导体图案的图案化聚合物片材设置在延伸穿过片材中的孔的短截线上。电线的端部被压扁以将聚合物片材放置在适当位置。导线连接到聚合物片上的电导体，该电导体转换成聚合物片上的接触垫。将第二根线球焊接到聚合物片上的垫上并切割以留下第二个短截线。聚合物片材被激光切割，使得每个第二短截线自由地独立于其它第二螺柱移动。第二短截线的端部设置在诸如FC芯片的电子设备的接触位置，以测试电子设备。

85. 发明授权

US06286208B1 Interconnector with contact pads having enhanced durability 失效
标题翻译：具有接触垫的互连器具有增强的耐用性
公开(公告)号：US06286208B1
公开(公告)日：2001-09-11
申请号：US08739343
申请日：1996-10-28
申请人： Da-Yuan Shih , Paul Lauro , Keith Edward Fogel , Brian Beaman , Maurice Norcott
发明人： Da-Yuan Shih , Paul Lauro , Keith Edward Fogel , Brian Beaman , Maurice Norcott
IPC分类号： H01R4302
CPC分类号： H01R13/2414 , H01L2224/16 , H01L2224/45144 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/15311 , H01L2924/16195 , H01R12/714 , H05K3/325 , Y10S29/029 , Y10T29/49158 , Y10T29/49162 , Y10T29/49213 , H01L2924/00
摘要： A structure of an enhanced durability interconnector to reliably interconnect modules having high density type contacts, such as found in modules having solder ball connections (SBC), to a connecting article such as a printed circuit board. The structure comprising a means to provide the SBC type contact a mating surface having a wide contact area. Furthermore, the electrical connecting medium within the interconnector, which is embedded in an elastomeric material to provide compliance, is strengthened by using two or more embedded wires in combination for each wide contact area contact. The interconnector is incorporated into a fixture to compress the interconnector between the SBC module and the connecting article. The fixture having further capability to align the connections, control the compression pressure and to prevent over-compression.
摘要翻译：一种增强耐久性互连器的结构，用于将诸如在具有焊球连接（SBC）的模块中发现的具有高密度类型触点的模块可靠地互连到诸如印刷电路板的连接件。所述结构包括提供SBC型接触具有宽接触面积的配合表面的装置。此外，嵌入在弹性体材料中以提供顺应性的互连器内的电连接介质通过组合使用两个或更多个嵌入式线来加强每个宽接触区域接触。互连器被并入夹具中以压缩SBC模块和连接件之间的互连器。夹具具有进一步的对接连接的能力，控制压缩压力并防止过度压缩。

86. 发明授权

US6054651A Foamed elastomers for wafer probing applications and interposer connectors 失效
标题翻译：用于晶圆探测应用和插入式连接器的发泡弹性体
公开(公告)号：US6054651A
公开(公告)日：2000-04-25
申请号：US752469
申请日：1996-11-19
申请人： Keith Edward Fogel , James Lupton Hedrick , Paul Alfred Lauro , Yun-Hsin Liao , Da-Yuan Shih
发明人： Keith Edward Fogel , James Lupton Hedrick , Paul Alfred Lauro , Yun-Hsin Liao , Da-Yuan Shih
IPC分类号： H01B3/46 , H01B7/00
CPC分类号： H01B3/46
摘要： The present invention is directed to a new foamed elastomer composition including elastomer, hollow fillers, and reinforced fillers for supporting the conducting wires in the test probes for wafer level testing and burn in and interposer connector applications. The thermally stable elastomer resin is mixed with hollow fillers and reinforced fillers before filling into the probe or connector mold with an array of elongated conducting wires, then is crosslinked by a crosslinking agent and a catalyst. The use of compressible hollow fillers to foam the elastomer has been successful to enhance the compliance and resilience, and to reduce the thermal expansion, density, and dielectric constant of the elastomer.
摘要翻译：本发明涉及一种新的泡沫弹性体组合物，其包括弹性体，中空填料和增强填料，用于在用于晶片级测试和烧录和插入件连接器应用的测试探针中支撑导线。将热稳定的弹性体树脂与中空填料和增强填料混合，然后用细长的导线阵列填充到探针或连接器模具中，然后通过交联剂和催化剂进行交联。使用可压缩中空填料来弹性弹性体已经成功地提高了弹性体的顺应性和弹性，并降低了弹性体的热膨胀，密度和介电常数。

87. 发明授权

US5810607A Interconnector with contact pads having enhanced durability 失效
标题翻译：具有接触垫的互连器具有增强的耐用性
公开(公告)号：US5810607A
公开(公告)日：1998-09-22
申请号：US527733
申请日：1995-09-13
申请人： Da-Yuan Shih , Paul Lauro , Keith Edward Fogel , Brian Beaman , Maurice Norcott
发明人： Da-Yuan Shih , Paul Lauro , Keith Edward Fogel , Brian Beaman , Maurice Norcott
IPC分类号： H01L23/50 , H01R12/71 , H01R13/24 , H05K3/32 , H01R9/09
CPC分类号： H01R13/2414 , H01R12/714 , H01L2224/16 , H01L2224/45144 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/15311 , H01L2924/16195 , H05K3/325 , Y10S29/029 , Y10T29/49158 , Y10T29/49162 , Y10T29/49213
摘要： A structure of an enhanced durability interconnector to reliably interconnect modules having high density type contacts, such as found in modules having solder ball connections (SBC), to a connecting article such as a printed circuit board. The structure comprising a means to provide the SBC type contact a mating surface having a wide contact area. Furthermore, the electrical connecting medium within the interconnector, which is embedded in an elastomeric material to provide compliance, is strengthened by using two or more embedded wires in combination for each wide contact area contact. The interconnector is incorporated into a fixture to compress the interconnector between the SBC module and the connecting article. The fixture having further capability to align the connections, control the compression pressure and to prevent over-compression.
摘要翻译：一种增强耐久性互连器的结构，用于将诸如在具有焊球连接（SBC）的模块中发现的具有高密度类型触点的模块可靠地互连到诸如印刷电路板的连接件。所述结构包括提供SBC型接触具有宽接触面积的配合表面的装置。此外，嵌入在弹性体材料中以提供顺应性的互连器内的电连接介质通过组合使用两个或更多个嵌入式线来加强每个宽接触区域接触。互连器被并入夹具中以压缩SBC模块和连接件之间的互连器。夹具具有进一步的对接连接的能力，控制压缩压力并防止过度压缩。

88. 发明授权

US4880684A Sealing and stress relief layers and use thereof 失效
标题翻译：密封和应力消除层及其用途
公开(公告)号：US4880684A
公开(公告)日：1989-11-14
申请号：US167290
申请日：1988-03-11
申请人： David W. Boss , Timothy W. Carr , Derry J. Dubetsky , George M. Greenstein , Warren D. Grobman , Carl P. Hayunga , Amanda H. Kumar , Walter F. Lange , Robert H. Massey , Paul H. Palmateer , John A. Romano , Da-Yuan Shih
发明人： David W. Boss , Timothy W. Carr , Derry J. Dubetsky , George M. Greenstein , Warren D. Grobman , Carl P. Hayunga , Amanda H. Kumar , Walter F. Lange , Robert H. Massey , Paul H. Palmateer , John A. Romano , Da-Yuan Shih
IPC分类号： H05K9/00 , H01L23/498 , H05K3/46
CPC分类号： H01L23/49827 , H01L2924/0002 , H01L2924/09701 , H01L2924/15312 , Y10S428/901 , Y10T29/49155 , Y10T29/49163 , Y10T29/49165 , Y10T428/12396 , Y10T428/24917 , Y10T428/24926 , Y10T428/31681
摘要： Sealing and stress relief are provided to a low-fracture strength glass-ceramic substrate. Hermeticity is addressed through the use of capture pads in alignment with vias and through polymer overlays with interconnection between the underlying via or pad metallurgy and the device, chip, wire or pin bonded to the surface of the layer. Multilevel structures are taught along with a self-aligned sealing and wiring process.

89. 发明授权

US4751349A Zirconium as an adhesion material in a multi-layer metallic structure 失效
标题翻译：锆作为多层金属结构中的粘合材料
公开(公告)号：US4751349A
公开(公告)日：1988-06-14
申请号：US919530
申请日：1986-10-16
申请人： Jungihl Kim , Walter F. Lange , Da-Yuan Shih , Sheree H. Wen
发明人： Jungihl Kim , Walter F. Lange , Da-Yuan Shih , Sheree H. Wen
IPC分类号： H01L23/52 , H01L21/3205 , H01L23/498 , H05K1/03 , H05K3/24 , H05K3/38 , H05K1/00
CPC分类号： H01L23/49866 , H01L2224/16225 , H01L2924/09701 , H01L2924/15312 , H01L2924/19107 , H05K1/0306 , H05K1/0346 , H05K3/38 , Y10T428/12743 , Y10T428/12806 , Y10T428/12903
摘要： A layer of zirconium can be used as an adhesion layer between a ceramic or polyimide substrate and subsequently applied metallic layers. Following the zirconium layer, copper can be deposited followed by a reaction barrier layer and a wettable surface layer such as gold. This type of structure can be used for pin bracing, chip joining, and/or wire connections.
摘要翻译：可以使用一层锆作为陶瓷或聚酰亚胺基底之间的粘合层和随后施加的金属层。在锆层之后，可以沉积铜，接着是反应阻挡层和可润湿的表面层如金。这种类型的结构可用于针脚支撑，芯片接合和/或线连接。

90. 发明申请

US20150147846A1 NO FLOW UNDERFILL OR WAFER LEVEL UNDERFILL AND SOLDER COLUMNS 有权
标题翻译：没有流量下降或水平下降和焊接柱
公开(公告)号：US20150147846A1
公开(公告)日：2015-05-28
申请号：US14525069
申请日：2014-10-27
申请人： Claudius FEGER , Michael A. Gaynes , Jae-Woong Nah , Da-Yuan Shih
发明人： Claudius FEGER , Michael A. Gaynes , Jae-Woong Nah , Da-Yuan Shih
IPC分类号： H01L23/00 , H01L21/56
CPC分类号： H01L24/81 , H01L21/463 , H01L21/563 , H01L23/49816 , H01L23/544 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/743 , H01L24/83 , H01L24/92 , H01L2223/54426 , H01L2223/54473 , H01L2223/54486 , H01L2224/11462 , H01L2224/13082 , H01L2224/13147 , H01L2224/1605 , H01L2224/16225 , H01L2224/16227 , H01L2224/16238 , H01L2224/2741 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/8113 , H01L2224/81132 , H01L2224/81192 , H01L2224/81193 , H01L2224/81203 , H01L2224/814 , H01L2224/81801 , H01L2224/81815 , H01L2224/83192 , H01L2224/83856 , H01L2224/9211 , H01L2224/94 , H01L2924/01029 , H01L2924/10253 , H01L2924/1461 , H01L2924/00 , H01L2924/00014 , H01L2924/00012 , H01L2924/014 , H01L2224/11 , H01L2224/27 , H01L2224/81 , H01L2224/83
摘要： A preassembly semiconductor device comprises chip soldering structures on a semiconductor chip and substrate soldering structures on a substrate corresponding to the chip soldering structures. The substrate soldering structures extend toward the chip soldering structures for forming solder connections with the chip soldering structures. The chip and the substrate are in preassembly positions relative to one another. The height of the substrate soldering structures is greater than the height of the chip soldering structures. A pre-applied underfill is contiguous with the substrate and is sufficiently thick so as to extend substantially no further than the full height of the substrate soldering structures. In another embodiment the height of the chip soldering structures is greater than the height of the substrate soldering structures and the pre-applied underfill is contiguous with the semiconductor chip and sufficiently thick so as to extend substantially no further than the full height of the chip soldering structures. A process comprises manufacturing semiconductor assemblies from these devices by soldering the chip and the substrate to one another
摘要翻译：预组装半导体器件包括半导体芯片上的芯片焊接结构和对应于芯片焊接结构的衬底上的衬底焊接结构。衬底焊接结构朝着芯片焊接结构延伸，以形成与芯片焊接结构的焊接连接。芯片和衬底相对于彼此处于预组装位置。基板焊接结构的高度大于芯片焊接结构的高度。预先施加的底部填充物与基底相邻并且足够厚以便基本上不超过基底焊接结构的全高度延伸。在另一个实施例中，芯片焊接结构的高度大于衬底焊接结构的高度，并且预先施加的底部填充物与半导体芯片邻接并且足够厚以便基本上不超过芯片焊接的全部高度结构。一种方法包括通过将芯片和衬底彼此焊接来从这些器件制造半导体组件

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