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81. 发明申请

US20100279521A1 LAND GRID ARRAY (LGA) INTERPOSER UTILIZING METAL-ON-ELASTOMER HEMI-TORUS AND OTHER MULTIPLE POINTS OF CONTACT GEOMETRIES 有权
标题翻译：土地网阵列（LGA）利用金属激光器热电偶和其他多点接触几何
公开(公告)号：US20100279521A1
公开(公告)日：2010-11-04
申请号：US12061774
申请日：2008-04-03
申请人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
发明人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
IPC分类号： H01R12/00
CPC分类号： H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要： A method of producing a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane.
摘要翻译：一种制造包括电绝缘载体平面的平面栅格阵列（LGA）插入器结构以及安装在所述载体平面的第一表面上的至少一个插入件的方法。插入件在横截面中具有半环形结构，并由介电弹性体材料构成。多个导电元件围绕至少一个半环形插入器的表面布置，并且从其最上端向内和向下自由地延伸，与位于电绝缘载体平面相反侧的至少一个部件电接触。

82. 发明授权

US07658616B2 Groups of land grid interposers of different heights having metal-on elastomer hemi-torus shapes providing for electrical contact with at least one component on an opposite side of an electrically insulating carrier plate mounting interposers 失效
标题翻译：具有不同高度的地面栅格插入件组具有金属弹性体半环形状，其提供与电绝缘载板安装插入件的相对侧上的至少一个部件的电接触
公开(公告)号：US07658616B2
公开(公告)日：2010-02-09
申请号：US12328026
申请日：2008-12-04
申请人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
发明人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
IPC分类号： H01R12/00
CPC分类号： H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要： A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and interposer groupings of different height being mounted on a first surface of said carrier plane. Each interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of each hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane.
摘要翻译：包括电绝缘载体平面和不同高度的插入物分组的平面栅格阵列（LGA）插入器结构安装在所述载体平面的第一表面上。每个插入件在横截面中具有半环形结构并且由介电弹性体材料构成。多个导电元件围绕每个半环形插入器的表面布置，并且从其最上端向内和向下自由地延伸，与位于电绝缘载体平面相反侧的至少一个部件电接触。

83. 发明授权

US07491067B2 Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries 失效
标题翻译：利用金属弹性体半环和其他多点接触几何形式的土地栅格阵列（LGA）插入器
公开(公告)号：US07491067B2
公开(公告)日：2009-02-17
申请号：US11865383
申请日：2007-10-01
申请人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
发明人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
IPC分类号： H01R12/00
CPC分类号： H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要： A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.
摘要翻译：包括电绝缘载体平面的平面栅格阵列（LGA）插入器结构以及安装在所述载体平面的第一表面上的至少一个插入器。插入件在横截面中具有半环形结构，并由介电弹性体材料构成。多个导电元件围绕至少一个半环形插入器的表面布置并且从其最上端向内和向下自由地延伸至与位于电绝缘载体的相对侧上的至少一个部件的电接触飞机还提供了一种制造焊盘栅格阵列中介层结构的方法。

84. 发明授权

US07488182B2 Land grid array (LGA) interposer structure providing for electrical contacts on opposite sides of a carrier plane 失效
标题翻译：在栅极阵列（LGA）插入器结构中，提供载体平面相对侧上的电接触
公开(公告)号：US07488182B2
公开(公告)日：2009-02-10
申请号：US11865327
申请日：2007-10-01
申请人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
发明人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
IPC分类号： H01R12/00
CPC分类号： H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要： A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.
摘要翻译：包括电绝缘载体平面的平面栅格阵列（LGA）插入器结构以及安装在所述载体平面的第一表面上的至少一个插入器。插入件在横截面中具有半环形结构，并由介电弹性体材料构成。多个导电元件围绕至少一个半环形插入器的表面布置并且从其最上端向内和向下自由地延伸至与位于电绝缘载体的相对侧上的至少一个部件的电接触飞机还提供了一种制造焊盘栅格阵列中介层结构的方法。

85. 发明授权

US07484966B2 Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries 失效
公开(公告)号：US07484966B2
公开(公告)日：2009-02-03
申请号：US11865458
申请日：2007-10-01
申请人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
发明人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
IPC分类号： H01R12/00
CPC分类号： H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要： A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.

86. 发明申请

US20090006808A1 ULTRASCALABLE PETAFLOP PARALLEL SUPERCOMPUTER 失效
标题翻译：超声波PETAFLOP并行超级计算机
公开(公告)号：US20090006808A1
公开(公告)日：2009-01-01
申请号：US11768905
申请日：2007-06-26
申请人： Matthias A. Blumrich , Dong Chen , George Chiu , Thomas M. Cipolla , Paul W. Coteus , Alan G. Gara , Mark E. Giampapa , Shawn Hall , Rudolf A. Haring , Philip Heidelberger , Gerard V. Kopcsay , Martin Ohmacht , Valentina Salapura , Krishnan Sugavanam , Todd Takken
发明人： Matthias A. Blumrich , Dong Chen , George Chiu , Thomas M. Cipolla , Paul W. Coteus , Alan G. Gara , Mark E. Giampapa , Shawn Hall , Rudolf A. Haring , Philip Heidelberger , Gerard V. Kopcsay , Martin Ohmacht , Valentina Salapura , Krishnan Sugavanam , Todd Takken
IPC分类号： G06F15/80 , G06F9/06
CPC分类号： G06F15/17337
摘要： A novel massively parallel supercomputer of petaOPS-scale includes node architectures based upon System-On-a-Chip technology, where each processing node comprises a single Application Specific Integrated Circuit (ASIC) having up to four processing elements. The ASIC nodes are interconnected by multiple independent networks that optimally maximize the throughput of packet communications between nodes with minimal latency. The multiple networks may include three high-speed networks for parallel algorithm message passing including a Torus, collective network, and a Global Asynchronous network that provides global barrier and notification functions. These multiple independent networks may be collaboratively or independently utilized according to the needs or phases of an algorithm for optimizing algorithm processing performance. Novel use of a DMA engine is provided to facilitate message passing among the nodes without the expenditure of processing resources at the node.
摘要翻译： petaOPS规模的一种新型大规模并行超级计算机包括基于片上系统技术的节点架构，其中每个处理节点包括具有多达四个处理元件的单个专用集成电路（ASIC）。 ASIC节点通过多个独立网络互连，以最小的延迟最大化节点之间的数据包通信的吞吐量。多个网络可以包括用于并行算法消息传递的三个高速网络，包括Torus，集合网络和提供全局障碍和通知功能的全球异步网络。这些多个独立网络可以根据用于优化算法处理性能的算法的需求或阶段来协同或独立地利用。提供了新的使用DMA引擎来促进节点之间的消息传递，而不需要节点处理资源。

87. 发明申请

US20080215790A1 Memory systems for automated computing machinery 失效
标题翻译：自动计算机的存储系统
公开(公告)号：US20080215790A1
公开(公告)日：2008-09-04
申请号：US12102034
申请日：2008-04-14
申请人： Paul W. Coteus , Kevin C. Gower , Robert B. Tremaine
发明人： Paul W. Coteus , Kevin C. Gower , Robert B. Tremaine
IPC分类号： G06F13/36
CPC分类号： G06F13/1684 , Y02D10/14
摘要： Design structures embodied in machine readable medium are provided. Embodiments of the design structure include a memory system comprising: a memory controller; a memory bus terminator; a high speed memory bus that interconnects the memory controller, the memory bus terminator, and at least one memory module; and the at least one memory module, the memory module comprising at least one memory hub device, high speed random access memory served by the memory hub device, two bus signal ports, and a segment of the high speed memory bus fabricated on the memory module so as to interconnect the bus signal ports and the memory hub device, the high speed memory bus connected to the memory hub device by a negligible electrical stub.
摘要翻译：提供体现在机器可读介质中的设计结构。设计结构的实施例包括存储器系统，包括：存储器控制器; 一个内存总线终端; 将存储器控制器，存储器总线终端器和至少一个存储器模块互连的高速存储器总线; 和所述至少一个存储器模块，所述存储器模块包括至少一个存储器集线器设备，由所述存储器集线器设备服务的高速随机存取存储器，两个总线信号端口以及在所述存储器模块上制造的所述高速存储器总线的段以便将总线信号端口和存储器集线器设备互连，高速存储器总线通过可忽略的电接头连接到存储器集线器设备。

88. 发明申请

US20080212282A1 METHOD AND APPARATUS FOR COOLING AN EQUIPMENT ENCLOSURE THROUGH CLOSED-LOOP LIQUID-ASSISTED AIR COOLING IN COMBINATION WITH DIRECT LIQUID COOLING 审中-公开
公开(公告)号：US20080212282A1
公开(公告)日：2008-09-04
申请号：US12042596
申请日：2008-03-05
申请人： Shawn A. Hall , Shurong Tian , Paul W. Coteus , John P. Karidis , Evan G. Colgan , Robert W. Guernsey
发明人： Shawn A. Hall , Shurong Tian , Paul W. Coteus , John P. Karidis , Evan G. Colgan , Robert W. Guernsey
IPC分类号： H05K7/20
CPC分类号： H05K7/20754 , G06F1/20 , G06F2200/201
摘要： A method and an apparatus for cooling, preferably within an enclosure, a diversity of heat-generating components, with at least some of the components having high-power densities and others having low-power densities. Heat generated by the essentially relatively few high-power-density components, such as microprocessor chips for example, is removed by direct liquid cooling, whereas heat generated by the more numerous low-power or low-watt-density components, such as memory chips for example, is removed by liquid-assisted air cooling in the form of a closed loop comprising a plurality of heating and cooling zones that alternate along the air path.

89. 发明申请

US20080176419A1 LAND GRID ARRAY (LGA) INTERPOSER UTILIZING METAL-ON-ELASTOMER HEMI-TORUS AND OTHER MULTIPLE POINTS OF CONTACT GEOMETRIES 失效
公开(公告)号：US20080176419A1
公开(公告)日：2008-07-24
申请号：US11865436
申请日：2007-10-01
申请人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
发明人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
IPC分类号： H01R12/00
CPC分类号： H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要： A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.

90. 发明申请

US20080163487A1 LAND GRID ARRAY (LGA) INTERPOSER UTILIZING METAL-ON-ELASTOMER HEMI-TORUS AND OTHER MULTIPLE POINTS OF CONTACT GEOMETRIES 有权
公开(公告)号：US20080163487A1
公开(公告)日：2008-07-10
申请号：US12047622
申请日：2008-03-13
申请人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
发明人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
IPC分类号： H05K3/00 , H01R9/00
CPC分类号： H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要： A method of producing a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane.

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