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81. 发明申请

US20070153841A1 Multi-output harmonic laser and methods employing same 审中-公开
标题翻译：多输出谐波激光器及其使用方法
公开(公告)号：US20070153841A1
公开(公告)日：2007-07-05
申请号：US11603969
申请日：2006-11-21
申请人： Yunlong Sun
发明人： Yunlong Sun
IPC分类号： H01S3/11 , H01S3/10
CPC分类号： H01S3/109 , H01S3/005 , H01S3/07 , H01S3/0813 , H01S3/09415 , H01S3/117
摘要： A solid-state laser (10) has a laser resonator (20) with output ports (22) at both ends to provide two separate laser micromachining beams (42). A set of wavelength converters (26) can be employed to convert the laser machining beams (42) to harmonic wavelength outputs, thus reducing the risk of damage to the wavelength converters and enabling higher total average harmonic power to be generated from a single laser. The laser machining beams (42) can be different to perform different laser operations independently or can be adapted to have substantially identical parameters to permit simultaneous parallel high-quality laser operations on substantially identical workpieces (54), or the laser machining beams (42) can be combined to provide a single laser system output (42e). The two laser machining beams (42) can be further split or multiplexed to suit particular applications.
摘要翻译：固体激光器（10）具有在两端具有输出端口（22）的激光谐振器（20），以提供两个单独的激光微加工光束（42）。可以使用一组波长转换器（26）将激光加工光束（42）转换成谐波波长输出，从而降低损坏波长转换器的风险，并且能够从单个激光器产生更高的总平均谐波功率。激光加工光束（42）可以不同，以独立地执行不同的激光操作，或者可以适于具有基本上相同的参数，以允许在基本上相同的工件（54）上的同时并行的高质量激光操作或激光加工光束（42）可以组合提供单个激光系统输出（42e）。两个激光加工光束（42）可进一步分割或多路复用以适合特定应用。

82. 发明授权

US07139294B2 Multi-output harmonic laser and methods employing same 有权
标题翻译：多输出谐波激光器及其使用方法
公开(公告)号：US07139294B2
公开(公告)日：2006-11-21
申请号：US10893148
申请日：2004-07-16
申请人： Yunlong Sun
发明人： Yunlong Sun
IPC分类号： H01S3/11 , H01S3/10 , B23K26/00
CPC分类号： H01S3/109 , H01S3/005 , H01S3/07 , H01S3/0813 , H01S3/09415 , H01S3/117
摘要： A solid-state laser (10) has a laser resonator (20) with output ports (22) at both ends to provide two separate laser micromachining beams (42). A set of wavelength converters (26) can be employed to convert the laser machining beams (42) to harmonic wavelength outputs, thus reducing the risk of damage to the wavelength converters and enabling higher total average harmonic power to be generated from a single laser. The laser machining beams (42) can be different to perform different laser operations independently or can be adapted to have substantially identical parameters to permit simultaneous parallel high-quality laser operations on substantially identical workpieces (54), or the laser machining beams (42) can be combined to provide a single laser system output (42e). The two laser machining beams (42) can be further split or multiplexed to suit particular applications.
摘要翻译：固体激光器（10）具有在两端具有输出端口（22）的激光谐振器（20），以提供两个单独的激光微加工光束（42）。可以使用一组波长转换器（26）将激光加工光束（42）转换成谐波波长输出，从而降低了损坏波长转换器的风险，并且使得能够从单个激光器产生更高的总平均谐波功率。激光加工光束（42）可以不同，以独立地执行不同的激光操作，或者可以适于具有基本上相同的参数，以允许在基本上相同的工件（54）上的同时并行的高质量激光操作或激光加工光束（42）可以组合提供单个激光系统输出（42e）。两个激光加工光束（42）可进一步分割或多路复用以适合特定应用。

83. 发明申请

US20050254530A1 Multi-output harmonic laser and methods employing same 有权
标题翻译：多输出谐波激光器及其使用方法
公开(公告)号：US20050254530A1
公开(公告)日：2005-11-17
申请号：US10893148
申请日：2004-07-16
申请人： Yunlong Sun
发明人： Yunlong Sun
IPC分类号： B23K26/00 , H01S3/00 , H01S3/06 , H01S3/07 , H01S3/08 , H01S3/081 , H01S3/0941 , H01S3/109 , H01S3/11 , H01S3/10
CPC分类号： H01S3/109 , H01S3/005 , H01S3/07 , H01S3/0813 , H01S3/09415 , H01S3/117
摘要： A solid-state laser (10) has a laser resonator (20) with output ports (22) at both ends to provide two separate laser micromachining beams (42). A set of wavelength converters (26) can be employed to convert the laser machining beams (42) to harmonic wavelength outputs, thus reducing the risk of damage to the wavelength converters and enabling higher total average harmonic power to be generated from a single laser. The laser machining beams (42) can be different to perform different laser operations independently or can be adapted to have substantially identical parameters to permit simultaneous parallel high-quality laser operations on substantially identical workpieces (54), or the laser machining beams (42) can be combined to provide a single laser system output (42e). The two laser machining beams (42) can be further split or multiplexed to suit particular applications.
摘要翻译：固体激光器（10）具有在两端具有输出端口（22）的激光谐振器（20），以提供两个单独的激光微加工光束（42）。可以使用一组波长转换器（26）将激光加工光束（42）转换成谐波波长输出，从而降低损坏波长转换器的风险，并且能够从单个激光器产生更高的总平均谐波功率。激光加工光束（42）可以不同，以独立地执行不同的激光操作，或者可以适于具有基本上相同的参数，以允许在基本上相同的工件（54）上的同时并行的高质量激光操作或激光加工光束（42）可以组合提供单个激光系统输出（42e）。两个激光加工光束（42）可进一步分割或多路复用以适合特定应用。

84. 发明申请

US20050041976A1 Generating sets of tailored laser pulses 有权
标题翻译：生成一组定制的激光脉冲
公开(公告)号：US20050041976A1
公开(公告)日：2005-02-24
申请号：US10921765
申请日：2004-08-18
申请人： Yunlong Sun , Robert Hainsey
发明人： Yunlong Sun , Robert Hainsey
IPC分类号： B23K20060101 , B23K26/06 , B23K26/38 , H01S20060101 , H04J14/02
CPC分类号： H01L23/5258 , B23K26/0613 , B23K26/0622 , B23K2101/40 , H01L2924/0002 , H01L2924/00
摘要： In a master oscillator power amplifier, a driver (208) of a diode laser (202) is specially controlled to generate a set of two or more injection laser pulses that are injected into a power amplifier (204) operated in an unsaturated state to generate a set (50) of laser pulses (52) that replicate the temporal power profile of the injection laser pulses to remove a conductive link (22) and/or its overlying passivation layer (44) in a memory or other IC chip. Each set (50) includes at least one specially tailored pulse (52) and/or two or more pulses (50) having different temporal power profiles. The duration of the set (50) is short enough to be treated as a single “pulse” by conventional positioning systems (380) to perform on-the-fly link removal without stopping.
摘要翻译：在主振荡器功率放大器中，特别地控制二极管激光器（202）的驱动器（208），以产生注入到以不饱和状态操作的功率放大器（204）中的两个或更多个注入激光脉冲的集合，以产生一组（50）激光脉冲（52），其复制所述注入激光脉冲的时间功率分布以去除存储器或其它IC芯片中的导电连接（22）和/或其上覆钝化层（44）。每个组（50）包括具有不同时间功率分布的至少一个特别定制的脉冲（52）和/或两个或更多个脉冲（50）。集合（50）的持续时间足够短以被常规定位系统（380）视为单个“脉冲”，以在不停止的情况下执行即时链路去除。

85. 发明授权

US06806440B2 Quasi-CW diode pumped, solid-state UV laser system and method employing same 失效
标题翻译：准CW二极管泵浦，固态紫外激光系统及其使用方法
公开(公告)号：US06806440B2
公开(公告)日：2004-10-19
申请号：US10096629
申请日：2002-03-12
申请人： Yunlong Sun , Richard S. Harris
发明人： Yunlong Sun , Richard S. Harris
IPC分类号： B23K2638
CPC分类号： H01S3/1022 , B23K26/382 , B23K26/40 , B23K2101/42 , B23K2103/08 , B23K2103/10 , B23K2103/12 , B23K2103/14 , B23K2103/16 , B23K2103/172 , B23K2103/26 , B23K2103/42 , B23K2103/50 , B23K2103/52 , H01S3/094076 , H01S3/0941 , H01S3/10038 , H01S3/10046 , H01S3/1024 , H01S3/109 , H01S3/117 , H05K3/0026 , H05K3/0038
摘要： A quasi-CW diode- or lamp-pumped, A-O Q-switched solid-state UV laser system (10) synchronizes timing of the quasi-CW pumping with movement of the positioning system (36) to reduce pumping while the positioning system (36) is moving from one target area (31) to the next target area (31) to form multiple vias in a substrate at a high throughput. Thus, the available UV power for via formation is higher even though the average pumping power to the laser medium (16), and thermal loading of the laser pumping diodes (14), remains the same as that currently available through conventional CW pumping with conventionally available laser pumping diodes (14). The quasi-CW pumping current profile can be further modified to realize a preferred UV pulse amplitude profile.
摘要翻译：准CW二极管或灯泵浦的AO Q开关固态紫外激光系统（10）使准CW泵浦的定时与定位系统（36）的运动同步，以减少定位系统（36）的泵送）从一个目标区域（31）移动到下一个目标区域（31），以在高通量下在衬底中形成多个通孔。因此，即使通过激光介质（16）的平均泵浦功率和激光泵浦二极管（14）的热负载仍然保持与通过传统CW泵浦现有可用的通常形式的可用UV功率相同可用的激光泵浦二极管（14）。可以进一步修改准CW泵浦电流分布，以实现优选的UV脉冲幅度分布。

86. 发明授权

US06297541B1 Semiconductor device and method for fabricating the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US06297541B1
公开(公告)日：2001-10-02
申请号：US09238171
申请日：1999-01-28
申请人： Taiji Ema , Edward J. Swenson , Thomas W. Richardson , Yunlong Sun
发明人： Taiji Ema , Edward J. Swenson , Thomas W. Richardson , Yunlong Sun
IPC分类号： H01L2358
CPC分类号： H01L23/5258 , H01L2924/0002 , H01L2924/00
摘要： The semiconductor device comprises a blocking layer 12 formed on a substrate 10, an insulation film 14 formed on the blocking layer 12, and a fuse 22 formed on the insulation film 14. The blocking layer 12 is formed below the fuse 22, whereby the fuse is disconnected by laser ablation, and the laser ablation can be stopped by the blocking layer 12 with good controllability without damaging the substrate. The fuses to be disconnected can be arranged at a very small pitch, which can improve integration of the fuse circuit.
摘要翻译：半导体器件包括形成在衬底10上的阻挡层12，形成在阻挡层12上的绝缘膜14和形成在绝缘膜14上的保险丝22。阻挡层12形成在保险丝22的下面，由此熔断器通过激光烧蚀断开，并且激光烧蚀可以通过阻挡层12以良好的可控性而停止，而不损坏衬底。要断开的保险丝可以以非常小的间距布置，这可以提高保险丝电路的集成度。

87. 发明授权

US5685995A Method for laser functional trimming of films and devices 失效
标题翻译：激光功能修整薄膜和器件的方法
公开(公告)号：US5685995A
公开(公告)日：1997-11-11
申请号：US538073
申请日：1995-10-02
申请人： Yunlong Sun , Edward J. Swenson
发明人： Yunlong Sun , Edward J. Swenson
IPC分类号： B23K26/00 , B23K26/06 , H01L21/428
CPC分类号： B23K26/032 , B23K26/06 , B23K26/064 , B23K26/0643 , B23K26/0665 , B23K26/351
摘要： A laser system (50) and processing method exploit a wavelength range (40) in which devices, including any semiconductor material-based devices (10) affected by conventional laser wavelengths and devices having light-sensitive or photo-electronic portions integrated into their circuits, can be effectively functionally trimmed without inducing performance drift or malfunctions in the processed devices. True measurement values of operational parameters of the devices can, therefore, be obtained without delay for device recovery, i.e., can be obtained substantially instantaneously with laser impingement. Accordingly, the present invention allows faster functional laser processing, eases geometric restrictions on circuit design, and facilitates production of denser and smaller devices.
摘要翻译：激光系统（50）和处理方法利用波长范围（40），其中包括受常规激光波长影响的任何基于半导体材料的器件（10）的器件和具有集成到其电路中的光敏或光电子部分的器件，可以有效地进行功能修剪，而不会引起处理器件中的性能漂移或故障。因此，可以无延迟地获得器件的操作参数的真实测量值，用于器件恢复，即可以通过激光冲击基本上瞬间获得。因此，本发明允许更快的功能激光处理，简化了对电路设计的几何限制，并且便于生产更致密和更小的器件。

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