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    • 87. 发明授权
    • Methods for forming line patterns in semiconductor substrates
    • 在半导体衬底中形成线图案的方法
    • US06485895B1
    • 2002-11-26
    • US09533770
    • 2000-03-23
    • Sang-jun ChoiYool KangJoo-tae MoonJeong-hee ChungSang-gyun Woo
    • Sang-jun ChoiYool KangJoo-tae MoonJeong-hee ChungSang-gyun Woo
    • G03F740
    • G03F7/40
    • A method for forming a fine pattern in a semiconductor substrate, comprises the steps of (a) coating a target layer to be etched on a semiconductor substrate with a resist composition comprising at least one compound capable of forming a photoresist pattern by a photolithography process, and a free radical initiator, wherein the free radical initiator is one which is capable of being decomposed by a thermal process at a temperature equal to or higher than the glass transition temperature of the at least one compound, wherein said coating step results in forming a resist compound layer comprising the resist composition; (b) performing a lithography process on the resist compound layer to form a photoresist pattern of at least one opening having a first width, wherein the target layer is exposed through the first width; and (c) heating the resist compound layer having the photoresist pattern formed therein to a temperature equal to or higher than the glass transition temperature of the at least one compound, and wherein a partial cross-linking reaction in the resist composition occurs by the free radicals produced from the free radical initiator resulting in a modified photoresist pattern having at least one opening having a second width which exposes the target layer, wherein the second width is smaller than the first width.
    • 一种用于在半导体衬底中形成精细图案的方法,包括以下步骤:(a)用包含至少一种能够通过光刻工艺形成光致抗蚀剂图案的化合物的抗蚀剂组合物在半导体衬底上涂覆待蚀刻的靶层, 和自由基引发剂,其中所述自由基引发剂是能够在等于或高于所述至少一种化合物的玻璃化转变温度的温度下通过热处理分解的引发剂,其中所述涂布步骤导致形成 抗蚀剂化合物层,其包含抗蚀剂组合物; (b)对抗蚀剂化合物层进行光刻处理以形成具有第一宽度的至少一个开口的光致抗蚀剂图案,其中目标层通过第一宽度暴露; 和(c)将其中形成有光致抗蚀剂图案的抗蚀剂化合物层加热到等于或高于至少一种化合物的玻璃化转变温度的温度,并且其中抗蚀剂组合物中的部分交联反应通过自由基 由自由基引发剂产生的自由基导致具有至少一个具有暴露目标层的第二宽度的开口的改性光致抗蚀剂图案,其中第二宽度小于第一宽度。
    • 90. 发明授权
    • Polymer mixture for photoresist and photoresist composition containing
the same
    • 用于光致抗蚀剂和含有其的光致抗蚀剂组合物的聚合物混合物
    • US6083659A
    • 2000-07-04
    • US218028
    • 1998-12-22
    • Sang-jun Choi
    • Sang-jun Choi
    • H01L21/027C08L25/00C08L25/18C08L33/04G03F7/004G03F7/039
    • G03F7/0045C08L25/18Y10S430/111
    • A polymer mixture for a photoresist composition, and a photoresist composition containing the polymer mixture. The polymer mixture includes a polymer that has two or more different monomers and an acid-labile di-alkylmalonate group bound to the backbone of the polymer; a polymer that has a monomer of (meth)acrylate derivative and one or more other monomers; or a polymer that has a monomer of alkoxystyrene and one or more other monomers. The polymer mixtures are suitable for forming photoresist compositions that generate a pattern having an excellent profile, due to the high contrast and high thermal decomposition temperature of the photoresist composition. The photoresist composition of the present invention further include a photosensitive acid generator.
    • 用于光致抗蚀剂组合物的聚合物混合物和含有聚合物混合物的光致抗蚀剂组合物 聚合物混合物包括具有两个或多个不同单体的聚合物和与聚合物的主链结合的酸不稳定的二烷基丙二酸酯基团; 具有(甲基)丙烯酸酯衍生物单体和一种或多种其它单体的聚合物; 或具有烷氧基苯乙烯和一种或多种其它单体的单体的聚合物。 由于光致抗蚀剂组合物的高对比度和高热分解温度,聚合物混合物适用于形成具有优异外形的图案的光致抗蚀剂组合物。 本发明的光致抗蚀剂组合物还包括光敏酸发生剂。