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    • 84. 发明授权
    • Integrated electro-optical package with independent menu bar
    • 集成电光封装,独立菜单栏
    • US5748161A
    • 1998-05-05
    • US610533
    • 1996-03-04
    • Michael S. LebbyRonald J. Nelson
    • Michael S. LebbyRonald J. Nelson
    • G09F9/33H01L25/16H01L51/50G09G3/34
    • H01L25/167H01L2224/16225H01L2224/48091H01L2224/48227H01L2924/12044
    • An integrated electro-optical package (50) including a first light emitting device (LED) display chip (28) and at least one additional LED display chip (30), each composed of an optically transparent substrate (10) with an array (15) of LEDs (12) formed thereon and cooperating to generate a complete image. The LEDs (12) of the first LED display chip (28) are constructed to emit light of a wavelength different than the light emitted by the additional LED display chip(s) (30), thereby creating a different color menu or object bar (156) within the view (150) generated. A mounting substrate (25), having connection pads (32), bump bonded to the pads on the optically transparent substrate (10). A driver substrate (55) having connections to the pads (32) on the mounting substrate (25). A plurality of driver and control circuits (57) connected to the LED display chips (28) and (30) through electrodes on the driver substrate (55). A lens (73) in alignment with the LED display chips (28) and (30) to magnify the complete images and produce an easily viewable virtual image.
    • 一种包括第一发光器件(LED)显示芯片(28)和至少一个附加的LED显示芯片(30)的集成电光学封装(50),每个由具有阵列(15)的光学透明衬底(10) )形成在其上的LED(12)并且协作以产生完整的图像。 第一LED显示芯片(28)的LED(12)被构造成发射与由附加的LED显示芯片(30)发射的光不同的波长的光,由此产生不同的颜色菜单或对象条( 156)在视图(150)内生成。 具有连接焊盘(32)的安装基板(25),凸块接合到光学透明基板(10)上的焊盘。 驱动器基板(55),其具有与安装基板(25)上的焊盘(32)的连接。 通过驱动器基板(55)上的电极连接到LED显示芯片(28)和(30)的多个驱动器和控制电路(57)。 与LED显示芯片(28)和(30)对准的透镜(73),以放大完整的图像并产生容易观看的虚像。
    • 88. 发明授权
    • VCSEL having a self-aligned heat sink and method of making
    • VCSEL具有自对准散热器和制造方法
    • US5654228A
    • 1997-08-05
    • US407061
    • 1995-03-17
    • Chan-Long ShiehJohn LungoMichael S. Lebby
    • Chan-Long ShiehJohn LungoMichael S. Lebby
    • H01S5/024H01S5/042H01S5/183H01L21/20
    • H01S5/18344H01S5/0425H01S2301/176H01S5/02476H01S5/2081
    • A substrate (102) having a surface (103) with a first stack of distributed Bragg reflectors (106), a first cladding region (107), an active region (108), a second cladding region (109), a second stack of distributed Bragg reflectors (110), and a contact region (111) is provided. A mesa (131) with a surface (133) and a trench (136) is formed. A first dielectric layer (122) is formed overlying substrate (102) and covering a portion of trench (136). A second dielectric layer (128) is formed on surface (133) of mesa (131). A seed layer (126) having a pattern is formed, with the pattern of seed layer (126) having an opening on a portion of second dielectric layer (128) of mesa (131). A metal is selectively plated on seed layer (126), thereby generating a layer (204) on seed layer (126) for removal of heat from VCSEL (101).
    • 具有表面(103)的基板(102)具有分布布拉格反射器(106)的第一叠层,第一包层区域(107),有源区域(108),第二包层区域(109) 分布式布拉格反射器(110)和接触区域(111)。 形成具有表面(133)和沟槽(136)的台面(131)。 覆盖衬底(102)并覆盖沟槽(136)的一部分的第一介电层(122)形成。 在台面(131)的表面(133)上形成第二电介质层(128)。 形成具有图案的种子层(126),种子层(126)的图案在台面(131)的第二介电层(128)的一部分上具有开口。 金属被选择性地电镀在种子层(126)上,从而在种子层(126)上产生用于从VCSEL(101)去除热量的层(204)。