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81. 发明申请

US20090286429A1 MICROELECTRONIC CONTACT STRUCTURES, AND METHODS OF MAKING SAME 失效
标题翻译：微电子接触结构及其制造方法
公开(公告)号：US20090286429A1
公开(公告)日：2009-11-19
申请号：US12511057
申请日：2009-07-28
申请人： Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu
发明人： Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu
IPC分类号： H01R13/02
CPC分类号： G01R1/07314 , H01H1/0036 , H01L2224/02335 , H01L2924/00013 , Y10T29/49147 , Y10T29/49204 , Y10T29/49218 , Y10T29/49316 , H01L2224/13099
摘要： Microelectronic contact structures are fabricated by separately forming, then joining together, various components thereof. Each contact structure has three components: a “post” component, a “beam” component, and a “tip” component. The resulting contact structure, mounted to an electronic component, is useful for making an electrical connection with another electronic component. The post component can be fabricated on a sacrificial substrate, joined to the electronic component and its sacrificial substrate removed. Alternatively, the post component can be formed on the electronic component. The beam and tip components can each be fabricated on a sacrificial substrate. The beam component is joined to the post component and its sacrificial substrate is removed, and the tip component is joined to the beam component and its sacrificial substrate is removed.
摘要翻译：微电子接触结构通过分别形成，然后连接在一起而制成其各种部件。每个接触结构具有三个部件：“后”部件，“梁”部件和“尖端”部件。安装到电子部件上的所得接触结构对于与另一个电子部件进行电连接是有用的。后部组件可以制造在牺牲基板上，连接到电子部件并且去除其牺牲基板。或者，可以在电子部件上形成柱部件。梁和尖端部件可以分别制造在牺牲衬底上。梁组件连接到柱部件，并且其牺牲基板被移除，并且尖端部件接合到梁部件并且其牺牲基板被移除。

82. 发明申请

US20090197484A1 CARBON NANOTUBE SPRING CONTACT STRUCTURES WITH MECHANICAL AND ELECTRICAL COMPONENTS 有权
标题翻译：碳纳米管弹簧接触结构与机械和电气部件
公开(公告)号：US20090197484A1
公开(公告)日：2009-08-06
申请号：US12421805
申请日：2009-04-10
申请人： Jimmy K. Chen , Treliant Fang , Michael Harburn , Igor Y. Khandros , Rodney I. Martens , Gaetan L. Mathieu , Alexander Slocum , Onnik Yaglioglu
发明人： Jimmy K. Chen , Treliant Fang , Michael Harburn , Igor Y. Khandros , Rodney I. Martens , Gaetan L. Mathieu , Alexander Slocum , Onnik Yaglioglu
IPC分类号： H01R13/02 , H01R43/16
CPC分类号： G01R1/06716 , G01R1/06744 , G01R1/06755 , G01R1/07357 , H01L23/49811 , H01L24/72 , H01L2924/01078 , H01L2924/01079 , H01L2924/19107 , Y10T29/49204
摘要： A composite spring contact structure includes a structural component and a conduction component distinct from each other and having differing mechanical and electrical characteristics. The structural component can include a group of carbon nanotubes. A mechanical characteristic of the composite spring contact structure can be dominated by a mechanical characteristic of the structural component, and an electrical characteristic of the composite spring contact structure can be dominated by an electrical characteristic of the conduction component. Composite spring contact structures can be used in probe cards and other electronic devices. Various ways of making contact structures are also disclosed.
摘要翻译：复合弹簧接触结构包括彼此不同的并具有不同机械和电特性的结构部件和导电部件。结构组分可以包括一组碳纳米管。复合弹簧接触结构的机械特性可以由结构部件的机械特性主导，并且复合弹簧接触结构的电特性可以由导电部件的电特性来支配。复合弹簧接触结构可用于探针卡和其他电子设备。还公开了制备接触结构的各种方式。

83. 发明授权

US07550842B2 Integrated circuit assembly 失效
标题翻译：集成电路组件
公开(公告)号：US07550842B2
公开(公告)日：2009-06-23
申请号：US10317661
申请日：2002-12-12
申请人： Igor Y. Khandros , Benjamin N. Eldridge , Charles A. Miller , A. Nicholas Sporck , Gary W. Grube , Gaetan L. Mathieu
发明人： Igor Y. Khandros , Benjamin N. Eldridge , Charles A. Miller , A. Nicholas Sporck , Gary W. Grube , Gaetan L. Mathieu
IPC分类号： H01L23/34
CPC分类号： H01L23/13 , H01L23/4951 , H01L23/5386 , H01L23/5387 , H01L24/48 , H01L24/49 , H01L24/50 , H01L25/0655 , H01L2224/0401 , H01L2224/05554 , H01L2224/06136 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48137 , H01L2224/48139 , H01L2224/4824 , H01L2224/49 , H01L2224/73215 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/0105 , H01L2924/014 , H01L2924/10161 , H01L2924/14 , H01L2924/15192 , H01L2924/181 , H01L2924/19043 , H01L2924/19107 , H01L2924/3011 , H01L2924/3025 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599 , H01L2924/00
摘要： In an integrated circuit assembly, know good die (KGD) are assembled on a substrate. Interconnect elements electrically connect pads on a die attached to the substrate to traces or other electrical conductors on the substrate or to pads on another die attached to the substrate. The substrate may have one or more openings, exposing pads of the die. The assembly may comprise one or more dice.
摘要翻译：在集成电路组件中，将好的芯片（KGD）组装在基板上。互连元件将附接到衬底的芯片上的焊盘电连接到衬底上的迹线或其它电导体或连接到衬底的另一芯片上的焊盘。衬底可以具有一个或多个开口，暴露管芯的焊盘。组件可以包括一个或多个骰子。

84. 发明申请

US20080231305A1 CONTACT CARRIERS (TILES) FOR POPULATING LARGER SUBSTRATES WITH SPRING CONTACTS 失效
标题翻译：联系人（TILES）用于具有弹簧触点的人口大型基底
公开(公告)号：US20080231305A1
公开(公告)日：2008-09-25
申请号：US12054289
申请日：2008-03-24
申请人： Igor Y. Khandros , Benjamin N. Eldridge , Gaetan L. Mathieu , Thomas H. Dozier , William D. Smith
发明人： Igor Y. Khandros , Benjamin N. Eldridge , Gaetan L. Mathieu , Thomas H. Dozier , William D. Smith
IPC分类号： G01R31/02
CPC分类号： H05K3/4015 , B23K1/0016 , B23K20/004 , B23K2101/40 , C25D5/08 , C25D5/22 , C25D21/02 , G01R1/06711 , G01R1/06716 , G01R1/07342 , G01R1/07378 , G01R3/00 , G01R31/2884 , G01R31/2886 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L22/20 , H01L23/49811 , H01L24/11 , H01L24/16 , H01L24/45 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/1134 , H01L2224/13099 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/49109 , H01L2224/73203 , H01L2224/81801 , H01L2224/85201 , H01L2224/85205 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H05K1/141 , H05K3/20 , H05K3/308 , H05K3/326 , H05K3/3421 , H05K3/3426 , H05K3/368 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , Y02P70/613 , Y10T29/49004 , Y10T29/49126 , Y10T29/49208 , Y10T29/49222 , H01L2924/00 , H01L2224/48
摘要： An interconnection apparatus and a method of forming an interconnection apparatus. Contact structures are attached to or formed on a first substrate. The first substrate is attached to a second substrate, which is larger than the first substrate. Multiple such first substrates may be attached to the second substrate in order to create an array of contact structures. Each contact structure may be elongate and resilient and may comprise a core that is over coated with a material that imparts desired structural properties to the contact structure.
摘要翻译：一种互连装置和形成互连装置的方法。接触结构附着在第一基底上或形成在第一基底上。第一衬底附接到比第一衬底大的第二衬底。可以将多个这样的第一基板附接到第二基板，以便产生接触结构的阵列。每个接触结构可以是细长的和弹性的，并且可以包括在涂覆有向接触结构赋予期望的结构特性的材料的芯上。

85. 发明授权

US07400157B2 Composite wiring structure having a wiring block and an insulating layer with electrical connections to probes 失效
标题翻译：复合布线结构具有布线块和与探针电连接的绝缘层
公开(公告)号：US07400157B2
公开(公告)日：2008-07-15
申请号：US11692035
申请日：2007-03-27
申请人： Gary W. Grube , Igor Y. Khandros , Benjamin N. Eldridge , Gaetan L. Mathieu , Poya Lotfizadeh , Chih-Chiang Tseng
发明人： Gary W. Grube , Igor Y. Khandros , Benjamin N. Eldridge , Gaetan L. Mathieu , Poya Lotfizadeh , Chih-Chiang Tseng
IPC分类号： G01R31/02 , G06F17/50 , H01L29/10 , H05K3/36
CPC分类号： G01R31/2886 , G01R1/07314 , G01R1/07342 , G01R1/07357 , G01R1/07378 , G01R3/00 , Y10T29/49126
摘要： A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.
摘要翻译：一种设计和制造探针卡组件的方法包括将探针卡组件的一个或多个元件预制成一个或多个预定的设计。此后，接收关于新设计的半导体器件的设计数据以及描述用于测试半导体器件的测试器和测试算法的数据。使用接收到的数据，选择一个或多个预制元素。再次使用接收的数据，定制一个或多个所选择的预制元素。然后使用选定和定制的元件构建探针卡组件。

86. 发明授权

US07218127B2 Method and apparatus for probing an electronic device in which movement of probes and/or the electronic device includes a lateral component 失效
标题翻译：用于探测电子设备的方法和装置，其中探针和/或电子设备的移动包括侧向分量
公开(公告)号：US07218127B2
公开(公告)日：2007-05-15
申请号：US10781369
申请日：2004-02-18
申请人： Timothy E. Cooper , Benjamin N. Eldridge , Igor Y. Khandros , Rod Martens , Gaetan L. Mathieu
发明人： Timothy E. Cooper , Benjamin N. Eldridge , Igor Y. Khandros , Rod Martens , Gaetan L. Mathieu
IPC分类号： G01R31/02
CPC分类号： G01R31/2886 , G01R31/2887
摘要： An electronic device is moved into a first position such that terminals of the electronic device are adjacent probes for making electrical contact with the terminals. The electronic device is then moved horizontally or diagonally such that the terminals contact the probes. Test data are then communicated to and from the electronic device through the probes.
摘要翻译：电子设备移动到第一位置，使得电子设备的端子是与端子电接触的相邻探头。然后电子设备水平或对角地移动，使得端子接触探针。然后通过探头将测试数据传送到电子设备和从电子设备传送。

87. 发明授权

US06920689B2 Method for making a socket to perform testing on integrated circuits 失效
标题翻译：一种套接字在集成电路上进行测试的方法
公开(公告)号：US06920689B2
公开(公告)日：2005-07-26
申请号：US10310791
申请日：2002-12-06
申请人： Igor Y. Khandros , Gaetan L. Mathieu , Carl V. Reynolds
发明人： Igor Y. Khandros , Gaetan L. Mathieu , Carl V. Reynolds
IPC分类号： G01R1/04 , G01R1/073 , G01R3/00 , H01R43/02
CPC分类号： G01R3/00 , G01R1/0433 , G01R1/0483 , G01R1/07378 , G01R31/2863 , H01L24/13 , H01L2224/131 , H01L2924/01046 , H01L2924/01055 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T29/49149 , Y10T29/49169 , Y10T29/49179 , Y10T29/49197 , Y10T29/49204 , Y10T29/4921 , Y10T29/49211 , Y10T29/49224 , Y10T29/53217 , Y10T29/53265 , H01L2924/014
摘要： A interconnect structure is inexpensively manufactured and easily insertable into a socket. The interconnect structure is manufactured by forming a sacrificial substrate with cavities that is covered by a masking material having openings corresponding to the cavities. A first plating process is performed by depositing conductive material, followed by coupling wires within the openings and performing another plating process by depositing more conductive material. The interconnect structure is completed by first removing the masking material and sacrificial substrate. Ends of the wires are coupled opposite now-formed contact structures to a board. To complete the socket, a support device is coupled to the board to hold a tested integrated circuit.
摘要翻译：互连结构廉价地制造并且容易地插入到插座中。通过形成具有由具有与空腔对应的开口的掩模材料覆盖的空腔的牺牲衬底来制造互连结构。通过沉积导电材料，然后在开口内连接线并通过沉积更多导电材料进行另一电镀工艺来执行第一电镀工艺。通过首先去除掩模材料和牺牲衬底来完成互连结构。电线的端部与现在形成的接触结构相对联接到电路板。要完成插座，支持设备耦合到电路板以保持测试的集成电路。

88. 发明授权

US06864105B2 Method of manufacturing a probe card 失效
标题翻译：探针卡的制造方法
公开(公告)号：US06864105B2
公开(公告)日：2005-03-08
申请号：US10087081
申请日：2002-03-01
申请人： Gary W. Grube , Igor Y. Khandros , Benjamin N. Eldridge , Gaetan L. Mathieu , Poya Lotfizadeh , Chih-Chiang Tseng
发明人： Gary W. Grube , Igor Y. Khandros , Benjamin N. Eldridge , Gaetan L. Mathieu , Poya Lotfizadeh , Chih-Chiang Tseng
IPC分类号： G01R31/26 , G01R1/073 , G01R31/28 , H01L21/66
CPC分类号： G01R1/07314 , G01R1/07342 , G01R1/07378 , G01R3/00 , G01R31/2886 , G01R31/2889 , Y10T29/49002 , Y10T29/49004 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49453
摘要： A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.
摘要翻译：一种设计和制造探针卡组件的方法包括将探针卡组件的一个或多个元件预制成一个或多个预定的设计。此后，接收关于新设计的半导体器件的设计数据以及描述用于测试半导体器件的测试器和测试算法的数据。使用接收到的数据，选择一个或多个预制元素。再次使用接收的数据，定制一个或多个所选择的预制元素。然后使用选定和定制的元件构建探针卡组件。

89. 发明授权

US06836962B2 Method and apparatus for shaping spring elements 失效
标题翻译：用于成形弹簧元件的方法和装置
公开(公告)号：US06836962B2
公开(公告)日：2005-01-04
申请号：US09753188
申请日：2000-12-29
申请人： Igor Y. Khandros , Thomas H. Dozier , Gary W. Grube , Gaetan L. Mathieu
发明人： Igor Y. Khandros , Thomas H. Dozier , Gary W. Grube , Gaetan L. Mathieu
IPC分类号： B21D39/00 , B23K31/02 , H01R9/00
CPC分类号： B21D39/00 , B23K31/02 , H01R9/00 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49208 , Y10T29/49211 , Y10T29/49213
摘要： Interconnection elements for electronic components, exhibiting desirable mechanical characteristic (such as resiliency, for making pressure contacts) are formed by using a shaping tool (512) to shape an elongate core element (502) of a soft material (such as gold or soft copper wire) to have a springable shape (including cantilever beam, S-shape, U-shape), and overcoating the shaped core element with a hard material (such as nickel and its alloys), to impart to desired spring (resilient) characteristic to the resulting composite interconnection element. A final overcoat of a material having superior electrical qualities (e.g., electrical conductivity and/or solderability) may be applied to the composite interconnection element. The resulting interconnection elements may be mounted to a variety of electronic components, including directly to semiconductor dies and wafers (in which case the overcoat material anchors the composite interconnection element to a terminal (or the like) on the electronic component), may be mounted to support substrates for use as interposers and may be mounted to substrates for use as probe cards or probe card inserts. The shaping tool may be an anvil (622) and a die (624), and may nick or sever successive shaped portions of the elongate elements, and the elongate element may be of an inherently hard (springy) material. Methods of fabricating interconnection elements on sacrificial substrates are described. Methods of fabricating tip structures (258) and contact tips at the end of interconnection elements are also described.
摘要翻译：通过使用成形工具（512）来形成软质材料（例如金或软铜）的细长芯元件（502），形成用于电子部件的互连元件，其具有期望的机械特性（例如弹性，用于形成压力接触）电线）具有弹性形状（包括悬臂梁，S形，U形），并用硬质材料（例如镍及其合金）涂覆成形芯元件，以赋予期望的弹簧（弹性）特性所得到的复合互连元件。可以对复合互连元件施加具有优异电气质量（例如导电性和/或可焊性）的材料的最终外涂层。所得到的互连元件可以安装到各种电子部件，包括直接连接到半导体管芯和晶片（在这种情况下，外罩材料将复合互连元件锚定到电子部件上的端子等），可以被安装以支撑用作内插件的基板，并且可以安装到用作探针卡或探针卡插入件的基板。成型工具可以是砧座（622）和模具（624），并且可以切割或切断细长元件的连续成形部分，并且细长元件可以是固有的硬（弹性）材料。描述了在牺牲基板上制造互连元件的方法。还描述了在互连元件的末端处制造尖端结构（258）和接触尖端的方法。

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