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    • 89. 发明授权
    • Method and apparatus for shaping spring elements
    • 用于成形弹簧元件的方法和装置
    • US06836962B2
    • 2005-01-04
    • US09753188
    • 2000-12-29
    • Igor Y. KhandrosThomas H. DozierGary W. GrubeGaetan L. Mathieu
    • Igor Y. KhandrosThomas H. DozierGary W. GrubeGaetan L. Mathieu
    • B21D39/00B23K31/02H01R9/00
    • B21D39/00B23K31/02H01R9/00Y10T29/49147Y10T29/49149Y10T29/49151Y10T29/49208Y10T29/49211Y10T29/49213
    • Interconnection elements for electronic components, exhibiting desirable mechanical characteristic (such as resiliency, for making pressure contacts) are formed by using a shaping tool (512) to shape an elongate core element (502) of a soft material (such as gold or soft copper wire) to have a springable shape (including cantilever beam, S-shape, U-shape), and overcoating the shaped core element with a hard material (such as nickel and its alloys), to impart to desired spring (resilient) characteristic to the resulting composite interconnection element. A final overcoat of a material having superior electrical qualities (e.g., electrical conductivity and/or solderability) may be applied to the composite interconnection element. The resulting interconnection elements may be mounted to a variety of electronic components, including directly to semiconductor dies and wafers (in which case the overcoat material anchors the composite interconnection element to a terminal (or the like) on the electronic component), may be mounted to support substrates for use as interposers and may be mounted to substrates for use as probe cards or probe card inserts. The shaping tool may be an anvil (622) and a die (624), and may nick or sever successive shaped portions of the elongate elements, and the elongate element may be of an inherently hard (springy) material. Methods of fabricating interconnection elements on sacrificial substrates are described. Methods of fabricating tip structures (258) and contact tips at the end of interconnection elements are also described.
    • 通过使用成形工具(512)来形成软质材料(例如金或软铜)的细长芯元件(502),形成用于电子部件的互连元件,其具有期望的机械特性(例如弹性,用于形成压力接触) 电线)具有弹性形状(包括悬臂梁,S形,U形),并用硬质材料(例如镍及其合金)涂覆成形芯元件,以赋予期望的弹簧(弹性)特性 所得到的复合互连元件。 可以对复合互连元件施加具有优异电气质量(例如导电性和/或可焊性)的材料的最终外涂层。 所得到的互连元件可以安装到各种电子部件,包括直接连接到半导体管芯和晶片(在这种情况下,外罩材料将复合互连元件锚定到电子部件上的端子等),可以被安装 以支撑用作内插件的基板,并且可以安装到用作探针卡或探针卡插入件的基板。 成型工具可以是砧座(622)和模具(624),并且可以切割或切断细长元件的连续成形部分,并且细长元件可以是固有的硬(弹性)材料。 描述了在牺牲基板上制造互连元件的方法。 还描述了在互连元件的末端处制造尖端结构(258)和接触尖端的方法。