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81. 发明授权

US5703285A Diagnosis apparatus and method for an exhaust gas recirculation unit of an internal combustion engine 失效
标题翻译：内燃机废气再循环装置的诊断装置和方法
公开(公告)号：US5703285A
公开(公告)日：1997-12-30
申请号：US674415
申请日：1996-07-02
申请人： Hirokazu Shimizu , Kenichi Machida
发明人： Hirokazu Shimizu , Kenichi Machida
IPC分类号： F02D45/00 , F02M25/07 , G01M15/00
CPC分类号： F02D35/023 , F02M26/49 , F02M26/57
摘要： A difference is obtained between a cylinder pressure during the compression stroke when an exhaust gas recirculation control valve is opened, and a cylinder pressure during the compression stroke when the exhaust gas recirculation control valve is closed. An estimated value for this difference is set from a cylinder pressure detected under the closed conditions and an exhaust gas recirculation proportion. When the difference is smaller than the estimated value, it is assumed that the exhaust gas recirculation quantity is not changing in accordance with open/close control, and the occurrence of a fault in the exhaust gas recirculation unit is thus judged.
摘要翻译：当排气再循环控制阀打开时在压缩冲程期间的气缸压力与排气再循环控制阀关闭时在压缩冲程期间的气缸压力之间获得差异。该差异的估计值是根据在关闭条件下检测的气缸压力和废气再循环比例设定的。当差值小于估计值时，假设排气再循环量根据打开/关闭控制不改变，并且因此判断排气再循环单元中的故障的发生。

82. 发明授权

US5632257A Diagnosis apparatus and method for an exhaust gas recirculation unit of an internal combustion engine 失效
标题翻译：内燃机废气再循环装置的诊断装置和方法
公开(公告)号：US5632257A
公开(公告)日：1997-05-27
申请号：US603146
申请日：1996-02-20
申请人： Kenichi Machida , Hirokazu Shimizu
发明人： Kenichi Machida , Hirokazu Shimizu
IPC分类号： F02M25/07
CPC分类号： F02D35/023 , F02M26/49 , F02M26/57
摘要： A exhaust gas recirculation control value is forcibly open/close controlled at the time of steady operation. An estimation of whether or not the actual exhaust gas recirculation quantity has changed with open/close control of the exhaust gas recirculation control valve, is then made based on whether or not a change in combustion pressure accompanying the open/close is a value estimated for the operating conditions.
摘要翻译：排气再循环控制值在稳定运行时被强制打开/关闭。然后，根据排气再循环控制阀的开/关控制是否实际排气再循环量发生变化的估计是基于与开/关相关的燃烧压力的变化是否为操作条件。

83. 发明授权

US5475670A Deflection plate for optical pick-up device 失效
标题翻译：用于光学拾取装置的偏转板
公开(公告)号：US5475670A
公开(公告)日：1995-12-12
申请号：US129547
申请日：1993-09-29
申请人： Ken Hamada , Hideyuki Nakanishi , Hirokazu Shimizu
发明人： Ken Hamada , Hideyuki Nakanishi , Hirokazu Shimizu
IPC分类号： G02B5/18 , G02B27/10 , G02B27/42 , G11B7/09 , G11B7/135 , G11B7/00
CPC分类号： G02B27/1013 , G02B27/1086 , G11B7/1353
摘要： A deflection plate for deflecting laser beams includes a transparent plate on which two grating areas are formed on the same surface. The first grating area has a plurality of parallel grooves. The second grating area has a plurality of grooves in a predetermined pattern. The depth and/or the duty ratio of the grooves in the first grating area differs from that in the second grating area.
摘要翻译：用于偏转激光束的偏转板包括在同一表面上形成有两个光栅区域的透明板。第一光栅区域具有多个平行凹槽。第二光栅区域具有预定图案的多个凹槽。第一光栅区域中的凹槽的深度和/或占空比不同于第二光栅区域中的凹槽的深度和/或占空比。

84. 发明授权

US4673188A Boot with bracing boss portion for universal joint 失效
标题翻译：用于万向节的支撑凸台部分
公开(公告)号：US4673188A
公开(公告)日：1987-06-16
申请号：US891729
申请日：1986-07-29
申请人： Yutaka Matsuno , Yasunori Hatanaka , Hirokazu Shimizu , Masahiro Ishigaki , Hiroshi Harada , Michihiro Kawada , Yasukuni Wakita
发明人： Yutaka Matsuno , Yasunori Hatanaka , Hirokazu Shimizu , Masahiro Ishigaki , Hiroshi Harada , Michihiro Kawada , Yasukuni Wakita
IPC分类号： F16J3/04 , F16D3/16 , F16D3/84 , F16J15/52
CPC分类号： F16D3/845
摘要： A bellows-form boot for universal joint which is formed integrally of a le-diameter cylindrical portion and a small-diameter cylindrical portion at both ends, the former being adapted to be fitted to a joint case housing therein the universal joint and the latter to a driving shaft, a central annular bellows portion having ridge portions whose diameters are tapered down toward the small-diameter portion, and a bracing boss portion extending between the large-diameter portion and the bellows portion. The boss portion has a wall thickness of 2 to 3 times the average wall thickness of the bellows portion and is profiled so that the inner face thereof may abuttingly contact with the edge face of the joint case and the outer face thereof is flush with the outer face of the bellows portion in the mutual joining area. The bellows portion has, at its zone adjacent to the boss portion extending from the end to the crest of the first ridge portion thereof, wall thicknesses gradually increasing from the latter to the former, whose maximum is a half the wall thickness of the boss portion.
摘要翻译：一种用于万向接头的波纹管形护罩，其由两端的大直径圆筒部和小直径圆筒部形成为一体，前者适于安装在万向接头的接头壳体上，后者与驱动轴，具有直径朝向小直径部分逐渐变细的脊部的中央环形波纹管部分，以及在大直径部分和波纹管部分之间延伸的支撑凸台部分。凸台部分的壁厚是波纹管部分的平均壁厚的2至3倍，并且成形为使得其内表面可以与接头壳体的边缘面邻接接触，并且其外表面与外部相互连接区域中的波纹管部分的表面。波纹管部分在其从其第一脊部的端部延伸到其顶部的凸起部分的区域处具有从后者到前者的壁厚度逐渐增加，其最大值是凸起部分的壁厚的一半。

85. 发明授权

US4546478A Semiconductor laser 失效
标题翻译：半导体激光器
公开(公告)号：US4546478A
公开(公告)日：1985-10-08
申请号：US614390
申请日：1984-05-25
申请人： Hirokazu Shimizu , Kunio Itoh , Takashi Sugino , Masaru Wada
发明人： Hirokazu Shimizu , Kunio Itoh , Takashi Sugino , Masaru Wada
IPC分类号： H01S5/00 , H01L21/60 , H01S5/02 , H01S3/19
CPC分类号： H01S5/02252 , H01L2224/32057 , H01L2224/83385 , H01L2224/83801 , H01L24/31 , H01L24/83 , H01L2924/01014 , H01L2924/12042
摘要： A mounting of semiconductor laser chip on a heat sink or metal mount is improved so as to enable high accuracy of position and direction. A heat sink or metal mount, on which a semiconductor laser chip is mounted, comprises two parts, namely a main mount or larger portion and a sub-mount or smaller portion. The semiconductor laser chip is soldered by a solder layer on the sub-mount utilizing a microscope so as to assure an accurate position and an accurate direction with respect to the sub-mount. Then, the sub-mount is soldered on the main mount by a solder layer with an accurate relation both in position and direction by engaging a linear ridge as a first engaging means provided on the upper face of the main mount with a straight groove and a rear end face as a second engaging means, or by engaging a square recess as a first engaging means and the square bottom of the sub-mount as a second engaging means with each other. As a result of the above-mentioned structure, accurate position and direction of the semiconductor laser chip with respect to the mount is easily obtainable with a high yield.
摘要翻译：提高半导体激光芯片在散热片或金属安装座上的安装，以实现高精度的位置和方向。安装有半导体激光芯片的散热器或金属安装件包括两部分，即主安装件或更大部分和副安装件或更小部件。利用显微镜将半导体激光芯片通过焊接层焊接在子座上，以确保相对于子安装座的精确位置和准确的方向。然后，通过将位于主要安装座的上表面上设置的第一接合装置的直线状脊线与直槽相啮合，通过焊接层将焊接层焊接在主安装座上，焊接层的位置和方向都精确，后端面作为第二接合装置，或者通过将作为第一接合装置的方形凹槽和副安装座的方形底部彼此接合作为第二接合装置。作为上述结构的结果，可以容易地以高产率获得半导体激光器芯片相对于安装座的精确位置和方向。

86. 发明授权

US4371967A Semiconductor laser 失效
标题翻译：半导体激光器
公开(公告)号：US4371967A
公开(公告)日：1983-02-01
申请号：US215665
申请日：1980-12-12
申请人： Masaru Wada , Hirokazu Shimizu , Takashi Sugino , Kunio Itoh
发明人： Masaru Wada , Hirokazu Shimizu , Takashi Sugino , Kunio Itoh
IPC分类号： H01S5/00 , H01S5/30 , H01S5/323 , H01S3/19
CPC分类号： H01S5/305 , H01S5/32308 , Y10S438/916
摘要： In a semiconductor laser which has epitaxial layers including an active layer on a semiconductor substrate, a buffer layer is formed neighboring the active layer, in order to prevent undesirable diffusion of a highly diffusing dopant (Zn) into the active layer from an adjacent layer such as the second clad layer. The buffer layer has the same conductivity as that of the adjacent layer, has a broader energy gap than the active layer, and the dopant of the buffer layer is less diffusing than that of the adjacent layer.
摘要翻译：在半导体衬底上具有包括有源层的外延层的半导体激光器中，形成与有源层相邻的缓冲层，以便防止高度扩散的掺杂剂（Zn）从相邻层（例如作为第二包覆层。缓冲层具有与相邻层相同的导电性，具有比有源层更宽的能隙，并且缓冲层的掺杂剂比相邻层的扩散更少。

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