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81. 发明授权

US08796832B2 Wiring device for semiconductor device, composite wiring device for semiconductor device, and resin-sealed semiconductor device 有权
标题翻译：半导体装置用配线装置，半导体装置用复合布线装置以及树脂密封型半导体装置
公开(公告)号：US08796832B2
公开(公告)日：2014-08-05
申请号：US13403616
申请日：2012-02-23
申请人： Susumu Baba , Masachika Masuda , Hiromichi Suzuki
发明人： Susumu Baba , Masachika Masuda , Hiromichi Suzuki
IPC分类号： H01L23/52 , H01L23/498 , H01L23/495
CPC分类号： H01L23/485 , H01L23/36 , H01L23/4827 , H01L23/49503 , H01L23/49531 , H01L23/49816 , H01L23/49833 , H01L23/49838 , H01L23/49883 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/16 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48237 , H01L2224/49171 , H01L2224/73265 , H01L2224/92247 , H01L2924/00011 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10162 , H01L2924/14 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A wiring device for a semiconductor device, a composite wiring device for a semiconductor device and a resin-sealed semiconductor device are provided, each of which is capable of mounting thereon a semiconductor chip smaller than conventional chips and being manufactured at lower cost. The wiring device connects an electrode on a semiconductor chip with an external wiring device, and has an insulating layer, a metal substrate and a copper wiring layer. The wiring device has a semiconductor chip support portion provided on the side of the copper wiring layer with respect to the insulating layer. The copper wiring layer includes a first terminal, a second terminal and a wiring portion. The first terminal is connected with the electrode. The second terminal is connected with the external wiring device. The wiring portion connects the first terminal with the second terminal.
摘要翻译：本发明提供一种半导体装置用布线装置，半导体装置用复合布线装置以及树脂密封型半导体装置，其能够搭载比常规芯片小的半导体芯片，并以低成本制造。布线装置将半导体芯片上的电极与外部布线装置连接，并且具有绝缘层，金属基板和铜布线层。布线装置具有相对于绝缘层设置在铜布线层一侧的半导体芯片支撑部。铜布线层包括第一端子，第二端子和布线部分。第一端子与电极连接。第二端子与外部接线装置连接。布线部将第一端子与第二端子连接。

82. 发明申请

US20120218692A1 ELECTRONIC DEVICE 审中-公开
标题翻译：电子设备
公开(公告)号：US20120218692A1
公开(公告)日：2012-08-30
申请号：US13300366
申请日：2011-11-18
申请人： Takashi Minemura , Hiromichi Suzuki , Yuji Nakajima
发明人： Takashi Minemura , Hiromichi Suzuki , Yuji Nakajima
IPC分类号： H05K7/00
CPC分类号： G06F1/1616 , G06F1/1641 , G06F1/1643 , G06F1/166 , G06F1/1681
摘要： According to one embodiment, an electronic device includes a first housing, a connection portion, and a second housing. The first housing includes a first edge, a first display screen, a first wall located opposite the first display screen, and a first flared portion extending from the periphery of the first wall. The connection portion is connected to the first edge to be rotatable about a first rotation axis. The second housing includes a second edge connected to the connection portion to be rotatable about a second rotation axis parallel to the first rotation axis and extending along the first edge, a second display screen capable of facing the first display screen, a second wall located opposite the second display screen, and a second flared portion extending from the periphery of the second wall.
摘要翻译：根据一个实施例，电子设备包括第一壳体，连接部分和第二壳体。第一壳体包括第一边缘，第一显示屏，与第一显示屏相对的第一壁以及从第一壁的周边延伸的第一扩张部。连接部分连接到第一边缘以围绕第一旋转轴线旋转。所述第二壳体包括连接到所述连接部分的第二边缘，所述第二边缘可绕着平行于所述第一旋转轴线的第二旋转轴线旋转并且沿着所述第一边缘延伸，能够面对所述第一显示屏幕的第二显示屏幕，第二显示屏幕和从第二壁的周边延伸的第二扩口部分。

83. 发明申请

US20120218691A1 ELECTRONIC DEVICE 审中-公开
标题翻译：电子设备
公开(公告)号：US20120218691A1
公开(公告)日：2012-08-30
申请号：US13300361
申请日：2011-11-18
申请人： Takashi Minemura , Hiromichi Suzuki , Yuji Nakajima
发明人： Takashi Minemura , Hiromichi Suzuki , Yuji Nakajima
IPC分类号： H05K5/02
CPC分类号： G06F1/1616 , G06F1/1641 , G06F1/1643 , G06F1/166 , G06F1/1681
摘要： According to one embodiment, an electronic device includes a first housing, a second housing, a connection portion, and a resistance mechanism. The first housing includes a first edge and a first display screen. The second housing includes a second edge extending along the first edge and a second display screen capable of facing the first display screen. The connection portion includes a contact portion that is in contact with a plane when one of the housings is placed on the plane and the other is raised. The connection portion is connected to the first edge to be rotatable about a first rotation axis and the second edge to be rotatable about a second rotation axis parallel to the first rotation axis. The resistance mechanism applies different resistance to the rotation of the first housing and the connection portion and to the rotation of the second housing and the connection portion.
摘要翻译：根据一个实施例，电子设备包括第一壳体，第二壳体，连接部分和电阻机构。第一壳体包括第一边缘和第一显示屏幕。第二壳体包括沿着第一边缘延伸的第二边缘和能够面向第一显示屏幕的第二显示屏幕。连接部分包括当一个壳体放置在平面上而另一个被升高时与该平面接触的接触部分。连接部分连接到第一边缘以围绕第一旋转轴线旋转，并且第二边缘可绕平行于第一旋转轴线的第二旋转轴线旋转。电阻机构对第一壳体和连接部分的旋转以及第二壳体和连接部分的旋转施加不同的阻力。

84. 发明申请

US20110205717A1 MOBILE TERMINAL AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：移动终端及其制造方法
公开(公告)号：US20110205717A1
公开(公告)日：2011-08-25
申请号：US12845960
申请日：2010-07-29
申请人： Hiromichi Suzuki , Natsumi Endo , Makoto Shibuya
发明人： Hiromichi Suzuki , Natsumi Endo , Makoto Shibuya
IPC分类号： H05K1/00 , H05K7/00 , B29C45/14
CPC分类号： B29C45/14639 , B29C45/14778 , B29K2705/00 , B29L2031/3431 , B29L2031/3437 , B29L2031/3456 , H01Q1/38 , H01Q21/28
摘要： According to one embodiment, a mobile terminal is provided. The mobile terminal includes: a board in which an electronic circuit is mounted; a resin frame configured to hold the board; and a sheet metal configured to maintain strength of the resin frame. The resin frame is configured to be integrally molded with the board and the sheet metal.
摘要翻译：根据一个实施例，提供一种移动终端。移动终端包括：安装有电子电路的板; 树脂框架，其构造成保持所述板; 以及被配置为保持树脂框架的强度的金属板。树脂框架被构造成与板和金属板一体地模制。

85. 发明申请

US20100249740A1 SHAPED SHEET AND ABSORBENT ARTICLE USING THE SAME 有权
标题翻译：形状和吸收性使用相同
公开(公告)号：US20100249740A1
公开(公告)日：2010-09-30
申请号：US12675500
申请日：2008-04-30
申请人： Takanobu Miyamoto , Takeshi Miyamura , Taeko Kanai , Hiromichi Suzuki , Wataru Saka , Shinobu Takei
发明人： Takanobu Miyamoto , Takeshi Miyamura , Taeko Kanai , Hiromichi Suzuki , Wataru Saka , Shinobu Takei
IPC分类号： A61F13/53 , B32B5/14 , B32B3/30
CPC分类号： B32B3/30 , A61F13/51104 , A61F13/51305 , B32B3/26 , B32B5/024 , B32B5/26 , B32B7/02 , B32B2262/0253 , B32B2262/0276 , B32B2262/12 , B32B2307/72 , B32B2307/726 , B32B2307/7265 , B32B2555/02 , D04H1/559 , D04H1/76 , Y10T428/24562 , Y10T428/24603
摘要： A shaped sheet, comprising: a plurality of protrusions (3) on one surface side of the shaped sheet formed of fibers; and connecting portions (5) for being barriers and connecting the protrusions (3) to one another, wherein the connecting portion (5) has a fiber density higher than a fiber density of the protrusion (3).
摘要翻译：一种成形片，包括：在由纤维形成的成形片的一个表面侧上的多个突起（3）和连接部分（5），用于阻挡并将突起（3）彼此连接，其中连接部分（5）的纤维密度高于突起（3）的纤维密度。

86. 发明授权

US07528014B2 Semiconductor device and method of manufacturing the same 有权
公开(公告)号：US07528014B2
公开(公告)日：2009-05-05
申请号：US11100437
申请日：2005-04-07
申请人： Yoshinori Miyaki , Hiromichi Suzuki , Kazunari Suzuki , Kunihiko Nishi
发明人： Yoshinori Miyaki , Hiromichi Suzuki , Kazunari Suzuki , Kunihiko Nishi
IPC分类号： H01L21/00
CPC分类号： H01L24/32 , H01L23/49503 , H01L23/49513 , H01L23/49541 , H01L23/49582 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/83 , H01L2224/29007 , H01L2224/29109 , H01L2224/29111 , H01L2224/29139 , H01L2224/2919 , H01L2224/32014 , H01L2224/32055 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48639 , H01L2224/48664 , H01L2224/49171 , H01L2224/73265 , H01L2224/78301 , H01L2224/78983 , H01L2224/8319 , H01L2224/838 , H01L2224/85181 , H01L2224/85439 , H01L2224/85464 , H01L2224/92 , H01L2224/92247 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01083 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/0665 , H01L2924/078 , H01L2924/14 , H01L2924/15738 , H01L2924/15747 , H01L2924/1576 , H01L2924/181 , H01L2924/20753 , H01L2924/00014 , H01L2924/00 , H01L2924/01082 , H01L2924/01026 , H01L2924/01049 , H01L2924/00012 , H01L2924/3512
摘要： A manufacturing method of a semiconductor device including preparing a lead frame having a die pad, leads arranged around the die pad and a silver plating layer formed over a first portion of each of the leads, mounting a semiconductor chip over a main surface of the die pad with a rear surface of the chip fixed to the main surface of the die pad, electrically connecting electrodes of the chip with the leads through wires, forming a molding resin sealing the die pad, the first portion, the semiconductor chip, and the wires, and forming a lead-free solder plating layer over a second portion of each of the leads exposed from the molding resin. An area of the die pad is smaller than an area of the chip, and a part of the molding resin contacts with the rear surface of the chip exposed from the die pad.

87. 发明授权

US07348931B2 Unbalanced power feeding antenna device for making radio communications 失效
标题翻译：用于制造无线电通信的不平衡馈电天线装置
公开(公告)号：US07348931B2
公开(公告)日：2008-03-25
申请号：US11497737
申请日：2006-08-02
申请人： Hiromichi Suzuki , Isao Ohba , Takayuki Shibuya , Yusuke Okada , Kenji Matsuzaki
发明人： Hiromichi Suzuki , Isao Ohba , Takayuki Shibuya , Yusuke Okada , Kenji Matsuzaki
IPC分类号： H01Q1/50
CPC分类号： H01Q1/50
摘要： An antenna device which is connected to a radio module performing radio communications with a system using a first band and a system using a second band, has an antenna element which transmits/receives radio signals in the first and second bands. The antenna device has first and second matching circuits corresponding to the first and second bands, and also disposes a switching circuit between the first and second bands and the radio module. A first filter circuit is connected between the first matching circuit and the antenna element. The first filter circuit passes the radio signal in the first band and also attenuates the radio signal in the second band. Meanwhile, a second filter circuit is connected between the second matching circuit and the antenna element. The second filter circuit passes the radio signal in the second band and also attenuates the radio signal in the first band.
摘要翻译：连接到与使用第一频带的系统进行无线电通信的无线电模块和使用第二频带的系统的天线装置具有在第一和第二频带中发送/接收无线电信号的天线单元。天线装置具有对应于第一和第二频带的第一和第二匹配电路，并且还在第一和第二频带与无线电模块之间配置切换电路。第一滤波电路连接在第一匹配电路和天线元件之间。第一滤波器电路通过第一频带中的无线电信号，并且还使第二频带中的无线电信号衰减。同时，第二滤波电路连接在第二匹配电路和天线元件之间。第二滤波器电路通过第二频带中的无线电信号，并且还使第一频带中的无线电信号衰减。

88. 发明授权

US07158820B2 Mobile communication terminal 失效
标题翻译：移动通信终端
公开(公告)号：US07158820B2
公开(公告)日：2007-01-02
申请号：US10948876
申请日：2004-09-24
申请人： Hiromichi Suzuki , Takashi Amano
发明人： Hiromichi Suzuki , Takashi Amano
IPC分类号： H04M1/00
CPC分类号： H01Q1/243 , H01Q1/245 , H01Q5/371 , H01Q5/378 , H01Q7/00
摘要： A mobile communication terminal of a portable telephone is housed in a casing having a first surface. A receiver section of the portable telephone capable of generating a voice is arranged on the first surface. A two-wavelength loop antenna arranged on a plane substantially parallel to the first plane and formed of a looped line having a right section and a left section that are in symmetry with respect to an imaginary vertical symmetric line is housed in the casing. A power supply point for supplying an electric power to the loop antenna is arranged in the vicinity of the intersection between the symmetric line and the looped line.
摘要翻译：便携式电话的移动通信终端被容纳在具有第一表面的壳体中。能够产生声音的便携式电话的接收器部分布置在第一表面上。布置在基本上平行于第一平面并且具有相对于虚拟垂直对称线对称的右部分和左部分的环形线的平面上的双波长环形天线被容纳在壳体中。用于向环形天线提供电力的电源点布置在对称线和环形线之间的交叉点附近。

89. 发明授权

US06962836B2 Method of manufacturing a semiconductor device having leads stabilized during die mounting 有权
标题翻译：具有在管芯安装期间稳定的引线的半导体器件的制造方法
公开(公告)号：US06962836B2
公开(公告)日：2005-11-08
申请号：US10644919
申请日：2003-08-21
申请人： Yoshinori Miyaki , Hiromichi Suzuki
发明人： Yoshinori Miyaki , Hiromichi Suzuki
IPC分类号： H01L23/50 , H01L23/495 , H01L21/48 , H01L21/44
CPC分类号： H01L23/49506 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/01039 , H01L2924/01057 , H01L2924/01079 , H01L2924/07802 , H01L2924/09701 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： A semiconductor device comprises a plurality of inner leads extending around a semiconductor chip, a tape substrate supporting the semiconductor chip and joined to respective end portions of the inner leads, wires connecting the inner leads and pads formed on a main surface of the semiconductor chip, a seal portion formed by resin-sealing the semiconductor chip and the wires, and a plurality of outer leads linking in a line with the inner leads and protruded from the seal portion to the exterior of four directions. A relationship between a length (a) of a shorter side of the semiconductor chip and a clearance (b) from the semiconductor chip, to a tip of the inner leads arranged at the farthest location from the semiconductor chip is a≦2b. It is possible to attain a narrow pad pitch, and mount the semiconductor chip formed in a small size, and standardize the lead frame.
摘要翻译：一种半导体器件，包括：半导体芯片周围延伸的多个内引线;支撑该半导体芯片的带基片，并与内引线的各端部连接，连接形成在半导体芯片主表面上的内引线和焊盘; 通过树脂密封半导体芯片和电线形成的密封部分，以及与内部引线成一直线并且从密封部分向四个方向外部突出的多个外部引线。半导体芯片的短边的长度（a）与半导体芯片的间隙（b）与布置在离半导体芯片最远的位置的内部引线的尖端之间的关系为<= 2b。可以获得窄的焊盘间距，并且安装形成为小尺寸的半导体芯片，并且使引线框架标准化。

90. 发明授权

US06274359B1 25-hydroxyvitamin D3-1&agr;-hydroxylase and DNA encoding the hydroxylase 失效
标题翻译： 25-羟基维生素D3-1alpha-羟化酶和编码羟化酶的DNA
公开(公告)号：US06274359B1
公开(公告)日：2001-08-14
申请号：US09111730
申请日：1998-07-08
申请人： Hideharu Anazawa , Hiroko Shimada , Seiji Sugimoto , Tatsuo Suda , Toshimasa Shinki , Takao Saruta , Yuzuru Ishimura , Matsuhiko Hayashi , Shu Wakino , Toshiaki Monkawa , Tadashi Yoshida , Hiromichi Suzuki
发明人： Hideharu Anazawa , Hiroko Shimada , Seiji Sugimoto , Tatsuo Suda , Toshimasa Shinki , Takao Saruta , Yuzuru Ishimura , Matsuhiko Hayashi , Shu Wakino , Toshiaki Monkawa , Tadashi Yoshida , Hiromichi Suzuki
IPC分类号： C12N902
CPC分类号： C12N9/0071 , A01K2217/05 , A61K38/00 , A61K39/00
摘要： The present invention relates to a polypeptide having 25-hydroxyvitamin D3-1&agr;-hydroxylase activity, being useful for the prevention, diagnosis and therapeutic treatment of adult diseases such as osteoporosis induced by the decrease of active type vitamin D3 and catalyzing the final stage of vitamin D3 activation; and the gene encoding the polypeptide. In accordance with the present invention, the following can be provided; a polypeptide having 25-hydroxyvitamin D3-1&agr;-hydroxylase activity, DNA encoding the polypeptide, a recombinant DNA prepared by inserting the DNA in a vector, a transformant carrying the recombinant DNA, a method for preparing 25-hydroxyvitamin D3-1&agr;-hydroxylase by using the transformant, a method for preparing 1&agr;, 25-dihydroxyvitamin D3 comprising using the polypeptide having 25-hydroxyvitamin D3-1&agr;-hydroxylase activity, and an antibody recognizing the polypeptide.
摘要翻译：本发明涉及具有25-羟基维生素D3-1alpha-羟化酶活性的多肽，可用于预防，诊断和治疗成人疾病如由活性型维生素D3的减少引起的骨质疏松症并催化维生素的最终阶段 D3激活; 和编码多肽的基因。根据本发明，可以提供以下：具有25-羟基维生素D3-1alpha-羟化酶活性的多肽，编码该多肽的DNA，通过将DNA插入载体制备的重组DNA，携带重组DNA的转化体，通过以下方法制备25-羟基维生素D3-1alpha-羟化酶的方法使用转化体，制备包含使用具有25-羟基维生素D3-1α-羟化酶活性的多肽的1α，25-二羟基维生素D 3的方法和识别该多肽的抗体。

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