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81. 发明授权

US06254850B1 Metal complexes, suitable for use in diagnosis and therapy 失效
标题翻译：金属络合物，适用于诊断和治疗
公开(公告)号：US06254850B1
公开(公告)日：2001-07-03
申请号：US09480153
申请日：2000-01-10
申请人： Werner Krause , Franz-Karl Maier , Michael Bauer , Gabriele Schuhmann-Giampieri , Wolf-Rudiger Press , Peter Muschik
发明人： Werner Krause , Franz-Karl Maier , Michael Bauer , Gabriele Schuhmann-Giampieri , Wolf-Rudiger Press , Peter Muschik
IPC分类号： A61K5104
CPC分类号： A61K49/06 , C07C229/16 , C07C229/36 , C07C233/63 , C07C233/83 , C07C237/06
摘要： The invention relates to diethylenetriaminepentaacetic acid derivatives, their complexes and complex salts, containing an element of atomic numbers 20-32, 39-51 or 57-83, pharmaceutical agents containing these compounds, their use as contrast media and antidotes and process for their production.
摘要翻译：本发明涉及含有原子序数20-32,39-51或57-83的元素的二亚乙基三胺五乙酸衍生物及其络合物和络合盐，含有这些化合物的药剂，它们作为对照介质和解毒剂的用途及其生产方法。

82. 发明授权

US09671340B2 Measurement method for determining an organ function 有权
公开(公告)号：US09671340B2
公开(公告)日：2017-06-06
申请号：US13813391
申请日：2010-07-30
申请人： Michael Bauer , Falk A. Gonnert , Peter Recknagel
发明人： Michael Bauer , Falk A. Gonnert , Peter Recknagel
IPC分类号： G01N21/64 , A61K49/10 , A61B5/00 , A61K49/00
CPC分类号： G01N21/64 , A61B5/0071 , A61K49/0032 , A61K49/0034
摘要： The invention relates to a method for acquiring data in order to determine organ function, in particular the liver or kidney function, comprising one or more polymethine fluorescent dyes having a fluorescence emission maximum, measured in ethanol, of less than or equal to 820 nm, and to the use of dyes as markers for acquiring data in order to determine the organ function. The invention further relates to a kit for determining an organ function with a marker dye, and to a device for acquiring data in the method.

83. 发明申请

US20150376698A1 METHOD FOR ESTABLISHING THE SOURCE OF INFECTION IN A CASE OF FEVER OF UNCLEAR AETIOLOGY 审中-公开
标题翻译：用于建立感染发生源的方法在不明原因感染的病例中
公开(公告)号：US20150376698A1
公开(公告)日：2015-12-31
申请号：US14711720
申请日：2015-05-13
申请人： Stefan Russwurm , Konrad Reinhart , Michael Bauer
发明人： Stefan Russwurm , Konrad Reinhart , Michael Bauer
IPC分类号： C12Q1/68
CPC分类号： C12Q1/6883 , C12Q2600/136 , C12Q2600/158
摘要： Use of gene expression profiles obtained in vitro from a patient's sample for establishing the local infection of a “fever of unknown origin”, wherein the gene expression profiles are specific for local inflammations of a “fever of unknown origin”, such as peritonitis, pneumonia, endocarditis or infections of the urea tract.
摘要翻译：使用从患者样品体外获得的基因表达谱，以建立“未知来源的发热”的局部感染，其中基因表达谱对于“不明来源的发热”的局部炎症是特异性的，例如腹膜炎，肺炎，心内膜炎或尿道感染。

84. 发明申请

US20140001622A1 CHIP PACKAGES, CHIP ARRANGEMENTS, A CIRCUIT BOARD, AND METHODS FOR MANUFACTURING CHIP PACKAGES 审中-公开
标题翻译：芯片包，芯片安排，电路板以及制造芯片包的方法
公开(公告)号：US20140001622A1
公开(公告)日：2014-01-02
申请号：US13534001
申请日：2012-06-27
申请人： Michael Bauer , Alfred Haimerl , Angela Kessler , Wolfgang Schober
发明人： Michael Bauer , Alfred Haimerl , Angela Kessler , Wolfgang Schober
IPC分类号： H01L23/48 , H01L21/58 , H01L23/495
CPC分类号： H01L23/49838 , H01L21/56 , H01L23/12 , H01L23/13 , H01L23/3121 , H01L23/3157 , H01L23/3171 , H01L23/492 , H01L23/49562 , H01L23/49805 , H01L23/49833 , H01L24/13 , H01L24/14 , H01L24/17 , H01L24/19 , H01L24/20 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/92 , H01L2224/0401 , H01L2224/05548 , H01L2224/05552 , H01L2224/05572 , H01L2224/12105 , H01L2224/13022 , H01L2224/13024 , H01L2224/131 , H01L2224/1403 , H01L2224/14051 , H01L2224/19 , H01L2224/20 , H01L2224/291 , H01L2224/2929 , H01L2224/293 , H01L2224/32245 , H01L2224/73253 , H01L2224/73267 , H01L2224/92144 , H01L2924/00014 , H01L2924/12032 , H01L2924/1301 , H01L2924/13034 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/00012 , H01L2924/014 , H01L2924/00
摘要： A chip package is provided, the chip package including: a chip carrier; a chip disposed over and electrically connected to a chip carrier top side; an electrically insulating material disposed over and at least partially surrounding the chip; one or more electrically conductive contact regions formed over the electrically insulating material and in electrical connection with the chip; a further electrically insulating material disposed over a chip carrier bottom side; wherein an electrically conductive contact region on the chip carrier bottom side is released from the further electrically insulating material.
摘要翻译：提供芯片封装，芯片封装包括：芯片载体; 芯片布置在芯片载体顶侧并电连接到芯片载体顶侧; 设置在芯片上并且至少部分地围绕芯片的电绝缘材料; 形成在所述电绝缘材料上并与所述芯片电连接的一个或多个导电接触区域; 设置在芯片载体底侧上的另外的电绝缘材料; 其中芯片载体底侧上的导电接触区域从另外的电绝缘材料释放。

85. 发明授权

US08580070B2 Method of applying an adhesive layer on thincut semiconductor chips of a semiconductor wafer 失效
标题翻译：在半导体晶片的薄切半导体芯片上涂布粘合剂层的方法
公开(公告)号：US08580070B2
公开(公告)日：2013-11-12
申请号：US11720954
申请日：2005-11-09
申请人： Edward Fuergut , Hermann Vilsmeier , Simon Jerebic , Michael Bauer
发明人： Edward Fuergut , Hermann Vilsmeier , Simon Jerebic , Michael Bauer
IPC分类号： B32B37/02
CPC分类号： H01L21/6835 , H01L21/6836 , H01L21/78 , H01L24/27 , H01L24/29 , H01L24/83 , H01L29/0657 , H01L2221/68327 , H01L2221/6834 , H01L2224/274 , H01L2224/83191 , H01L2224/8385 , H01L2924/01033 , H01L2924/01068 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/10158 , H01L2924/3512 , H01L2924/00
摘要： The invention relates to a method for making a semiconductor. In one embodiment the method includes applying an adhesive layer to ground-thin or thinned semiconductor chips of a semiconductor wafer. In this embodiment, the adhesive layer composed of curable adhesive is introduced relatively early into a method for the thinning by grinding, separation and singulation of a semiconductor wafer to form thinned semiconductor chips, and is used further in a semiconductor device into which the thinned semiconductor chip is to be incorporated.
摘要翻译：本发明涉及制造半导体的方法。在一个实施例中，该方法包括将粘合剂层应用于半导体晶片的接地薄或薄化的半导体芯片。在本实施例中，由可固化粘合剂组成的粘合剂层相对较早地引入用于通过半导体晶片的研磨，分离和分离来减薄的方法以形成变薄的半导体芯片，并且进一步用于半导体器件中，其中薄化半导体芯片将被并入。

86. 发明申请

US20130256922A1 Method for Fabricating a Semiconductor Device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US20130256922A1
公开(公告)日：2013-10-03
申请号：US13432633
申请日：2012-03-28
申请人： Michael Bauer , Daniel Porwol , Ulrich Wachter
发明人： Michael Bauer , Daniel Porwol , Ulrich Wachter
IPC分类号： H01L23/28 , H01L21/56 , H01L21/78
CPC分类号： H01L23/29 , H01L21/565 , H01L23/24 , H01L23/291 , H01L23/293 , H01L23/3128 , H01L2224/0401 , H01L2224/04105 , H01L2224/05548 , H01L2224/12105 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/1461 , H01L2924/00
摘要： In a method for fabricating a semiconductor device, a carrier and at least one semiconductor chip are provided.
摘要翻译：在制造半导体器件的方法中，提供载体和至少一个半导体芯片。

87. 发明授权

US08335595B2 System and method for adaptive islanding for stored/distributed energy devices 有权
标题翻译：用于存储/分布式能量设备的自适应孤岛的系统和方法
公开(公告)号：US08335595B2
公开(公告)日：2012-12-18
申请号：US12053962
申请日：2008-03-24
申请人： Jeff Tolnar , Heidi Caroline , Larry Hymer , Michael Bauer
发明人： Jeff Tolnar , Heidi Caroline , Larry Hymer , Michael Bauer
IPC分类号： G05D11/00
CPC分类号： H02J3/14 , H02J3/28 , H02J3/381 , Y02B70/3225 , Y04S20/222 , Y10T307/461
摘要： When a fault occurs in an energy distribution network, adaptive islanding is initiated to supply energy to customers who are disconnected from the primary source of energy on the network. The customers are selectively connected to secondary energy resources that are distributed within the network. The selected customers are chosen in accordance with a profile that takes into account the amount of energy available from the distributed resources, the expected length of time to repair the fault, the recent energy demands of the customers, and levels of priority that are assigned to respective customers. These factors are monitored, and the selected customers who are connected to the distributed resources are dynamically adjusted during the time that the fault exists.
摘要翻译：当能量分配网络发生故障时，启动自适应孤岛，以向与网络上的主要能量源断开的客户提供能量。客户选择性地连接到分布在网络内的二次能源。所选择的客户根据配置文件进行选择，该配置文件考虑到从分布式资源获得的能量的数量，修复故障的预期时间长度，客户的最新能源需求以及分配给各自的客户。监控这些因素，连接到分布式资源的选定客户在故障存在的时间内进行动态调整。

88. 发明申请

US20110126497A1 METHOD FOR THE PRODUCTION OF A BIODEGRADABLE PLASTIC FILM, AND FILM 审中-公开
标题翻译：生产可塑性塑料薄膜的方法和薄膜
公开(公告)号：US20110126497A1
公开(公告)日：2011-06-02
申请号：US12301910
申请日：2007-05-15
申请人： Michael Bauer , Karl Mauser , Roland Kelm , Kurt Stark
发明人： Michael Bauer , Karl Mauser , Roland Kelm , Kurt Stark
IPC分类号： B65B11/00 , B29C47/00 , B29C47/06 , B32B37/12 , B29C51/00 , B32B27/36 , B32B27/06 , C08L29/04
CPC分类号： C08J3/22 , B32B27/08 , B32B27/306 , B32B27/36 , B32B2250/24 , B32B2307/7163 , B32B2307/7244 , B32B2553/00 , C08J5/18 , C08J2329/04 , C08J2367/04 , C08L23/0861 , C08L29/04 , C08L51/003 , C08L67/04 , C08L2205/03 , Y10T428/31786 , C08L2666/18 , C08L2666/02 , C08L67/00 , C08L2666/14 , C08L2666/04 , C08L29/00
摘要： A method for producing a biodegradable plastic film or a composite film, and the film obtained by such method. The film has barrier properties and is made at least of a biodegradable basic plastic material and a second plastic material having barrier properties. The film is useful in particular for packaging sensitive goods.
摘要翻译：生物降解塑料薄膜或复合薄膜的制造方法以及通过该方法得到的薄膜。该膜具有阻隔性，并且至少具有可生物降解的基础塑料材料和具有阻隔性能的第二塑料材料。这部电影特别适用于包装敏感商品。

89. 发明授权

US07919857B2 Plastic housing and semiconductor component with said plastic housing 有权
标题翻译：塑料外壳和半导体元件与塑料外壳
公开(公告)号：US07919857B2
公开(公告)日：2011-04-05
申请号：US11867132
申请日：2007-10-04
申请人： Michael Bauer , Peter Strobel , Jens Pohl , Christian Stuempfl , Ludwig Heitzer
发明人： Michael Bauer , Peter Strobel , Jens Pohl , Christian Stuempfl , Ludwig Heitzer
IPC分类号： H01L23/06 , H01L23/552 , H01L21/00
CPC分类号： G01L19/0069 , G01L19/147 , H01L23/295 , H01L23/3128 , H01L23/3135 , H01L23/3142 , H01L23/552 , H01L2924/0002 , H01L2924/15311 , H01L2924/3025 , H01L2924/00
摘要： A plastic housing includes plastic external faces and the underside of the plastic housing comprises external contact areas on which external contacts are arranged. The plastic external faces are covered by a closed metal layer apart from the underside, wherein the boundary layer between plastic external faces and the closed metal layer includes exposed electrically conductive inclusions of the plastic of the housing.
摘要翻译：塑料外壳包括塑料外表面，并且塑料外壳的下侧包括外部接触区域，外部接触件布置在其上。塑料外表面被与下侧隔开的封闭金属层覆盖，其中塑料外表面和封闭金属层之间的边界层包括外壳的塑料的露出的导电夹杂物。

90. 发明授权

US07774986B2 Pre-assembly unit for a motor vehicle door 有权
标题翻译：机动车门的预组装单元
公开(公告)号：US07774986B2
公开(公告)日：2010-08-17
申请号：US11230939
申请日：2005-09-20
申请人： Klaus Unterreiner , Michael Bauer
发明人： Klaus Unterreiner , Michael Bauer
IPC分类号： B60J5/04
CPC分类号： B60J5/0406 , B60J5/0404 , B60J5/0416 , B60J5/0463 , E05F11/382 , E05F11/488 , E05Y2600/56 , E05Y2800/742 , E05Y2900/55
摘要： A pre-assembly unit for a motor vehicle and for connection of such with a door frame of the motor vehicle, comprising a window frame, a side window guided at least within the window frame, a window lifting mechanism, which is joined to the side window in order to raise or lower it, and an equipment carrier connected to but disconnectable from the window frame with a wet side (N) and a dry side (T) for dividing the door frame into a wet and a dry area is provided. At least one fixing means, which joins the window lifting mechanism to the equipment carrier and can be undone from the dry side of the equipment carrier is also provided. At least one assembly preparation is provided on or in the window lifting mechanism, and is accessible from the dry side of the equipment carrier for connecting the window lifting mechanism to the door frame. A corresponding motor vehicle door as well as an assembly and disassembly method is also provided.
摘要翻译：一种用于机动车辆并用于与机动车辆的门框架连接的预组装单元，包括窗框，至少在窗框内引导的侧窗，窗升降机构，其连接到侧面窗口，以便升高或降低它，并且提供了连接到窗框的设备托架，其具有用于将门框分成湿和干燥区域的湿侧（N）和干燥侧（T）。还提供了至少一个固定装置，其将窗升降机构连接到设备载体并且可以从设备载体的干燥侧撤消。至少一个组装准备设置在窗户提升机构上或其中，并且可从设备托架的干燥侧面接近，以将窗户提升机构连接到门框。还提供了相应的机动车门以及组装和拆卸方法。

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