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81. 发明申请

US20100101759A1 APPARATUS AND METHOD FOR FACILITATING IMMERSION-COOLING OF AN ELECTRONIC SUBSYSTEM 有权
标题翻译：用于促进电子系统的冷却冷却的装置和方法
公开(公告)号：US20100101759A1
公开(公告)日：2010-04-29
申请号：US12256618
申请日：2008-10-23
申请人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Vinod KAMATH , Robert E. SIMONS
发明人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Vinod KAMATH , Robert E. SIMONS
IPC分类号： F28F7/00
CPC分类号： H05K7/20772 , H01L2924/0002 , H01L2924/00
摘要： Apparatus and method are provided for facilitating immersion-cooling of an electronic subsystem having multiple different types of components to be immersion-cooled. The apparatus includes a container sized to receive the electronic subsystem, and a hermetically sealed electrical connector disposed on a wall of the container. The electrical connector is sized and configured to receive an electrical and network connector of the electronic subsystem when the electronic subsystem is operatively inserted into the container, and to facilitate external electrical and network coupling to the subsystem. The apparatus further includes coolant inlet and outlet ports coupled to the container for facilitating ingress and egress of coolant through the container. When the electronic subsystem is operatively inserted into the container and coolant flows through the container, the electronic subsystem is immersion-cooled by the coolant.
摘要翻译：提供了一种装置和方法，用于促进具有要浸没冷却的多种不同类型组件的电子子系统的浸入式冷却。该装置包括一个容纳电子子系统的容器，以及一个设置在容器壁上的气密密封电连接器。电连接器的尺寸和构造被设计成当电子子系统可操作地插入容器中时接收电子子系统的电气和网络连接器，并且便于外部电气和网络耦合到子系统。该装置还包括联接到容器的冷却剂入口和出口，用于促进冷却剂通过容器的进入和流出。当电子子系统可操作地插入容器并且冷却剂流过容器时，电子子系统被冷却剂浸没冷却。

82. 发明申请

US20090086432A1 DOCKING STATION WITH CLOSED LOOP AIRLFOW PATH FOR FACILITATING COOLING OF AN ELECTRONICS RACK 审中-公开
标题翻译：带有闭环式空气通道的锁紧站，用于促进电子货架的冷却
公开(公告)号：US20090086432A1
公开(公告)日：2009-04-02
申请号：US11862328
申请日：2007-09-27
申请人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, Jr. , Madhusudan K. IYENGAR , Robert E. SIMONS
发明人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, Jr. , Madhusudan K. IYENGAR , Robert E. SIMONS
IPC分类号： H05K7/20 , F28D15/00
CPC分类号： H05K7/20754
摘要： A docking station is provided for cooling an electronics rack of a data center. The docking station includes an enclosure having at least one wall, a cover coupled to the at least one wall, and a central opening sized to receive the electronics rack therein through an access opening in the wall. The enclosure is separate and freestanding from the electronics rack, and when the electronics rack is operatively positioned within the central opening, the enclosure surrounds the electronics rack and facilitates establishing a closed loop airflow path passing through air inlet and outlet sides of the rack and through an air return pathway of the enclosure. The docking station further includes an air-to-liquid heat exchange assembly disposed within the air return pathway of the enclosure for cooling circulating air passing through the closed loop airflow path.
摘要翻译：提供对接站用于冷却数据中心的电子机架。对接站包括具有至少一个壁的壳体，耦合到至少一个壁的盖，以及大小适于通过壁中的进入开口将电子机架接纳到其中的中心开口。外壳与电子机架分开独立，并且当电子机架可操作地定位在中央开口内时，外壳围绕电子机架，并有助于建立通过机架的空气入口和出口侧的闭环气流路径，并通过外壳的空气返回路径。对接站还包括设置在外壳的空气返回路径内的空气 - 液体热交换组件，用于冷却通过闭环气流路径的循环空气。

83. 发明申请

US20080307806A1 COOLING SYSTEM AND METHOD UTILIZING THERMAL CAPACITOR UNIT(S) FOR ENHANCED THERMAL ENERGY TRANSFER EFFICIENCY 失效
标题翻译：使用热电偶单元（S）的冷却系统和方法，以提高热能传递效率
公开(公告)号：US20080307806A1
公开(公告)日：2008-12-18
申请号：US11762822
申请日：2007-06-14
申请人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, Jr. , Madhusudan K. IYENGAR , Robert E. SIMONS
发明人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, Jr. , Madhusudan K. IYENGAR , Robert E. SIMONS
IPC分类号： F28C1/00 , F28D15/00 , H05K7/20
CPC分类号： F28D20/021 , F24F5/0017 , H05K7/2079 , H05K7/20836 , Y02E60/145 , Y02E60/147
摘要： A cooling system and method are provided which include a facility cooling unit, a cooling tower, and one or more thermal capacitor units. The facility cooling unit, which includes a heat dissipation coolant loop, facilitates thermal energy extraction from a facility, such as a data center, for expelling of the energy to coolant within the heat dissipation coolant loop. The cooling tower is in fluid communication with the coolant loop, and includes a liquid-to-air heat exchanger for expelling thermal energy from coolant of the heat dissipation coolant loop to the surrounding environment. The thermal capacitor unit is in fluid communication with the heat dissipation coolant loop to facilitate efficient thermal energy transfer from coolant with in the coolant loop to the surrounding environment with variation in ambient temperature about the cooling tower.
摘要翻译：提供了一种冷却系统和方法，其包括设备冷却单元，冷却塔和一个或多个热电容器单元。包括散热冷却剂回路的设备冷却单元有助于从诸如数据中心的设备的热能提取，以将能量排出到散热冷却剂回路内的冷却剂。冷却塔与冷却剂回路流体连通，并且包括用于将热能从散热冷却剂回路的冷却剂排出到周围环境的液体 - 空气热交换器。热电容器单元与散热冷却剂回路流体连通，以便在冷却剂回路中的冷却剂与围绕冷却塔周围环境温度变化的周围环境有效的热能传递。

84. 发明申请

US20130105122A1 WICKING VAPOR-CONDENSER FACILITATING IMMERSION-COOLING OF ELECTRONIC COMPONENT(S) 有权
标题翻译：电子元器件的加热蒸汽冷凝器的浸入式冷却
公开(公告)号：US20130105122A1
公开(公告)日：2013-05-02
申请号：US13281669
申请日：2011-10-26
申请人： Levi A. CAMPBELL , Richard C. CHU , Milnes P. DAVID , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Robert E. SIMONS
发明人： Levi A. CAMPBELL , Richard C. CHU , Milnes P. DAVID , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Robert E. SIMONS
IPC分类号： F28D15/04
CPC分类号： F28D1/0477 , F28D15/0266 , F28D15/0275 , H05K7/203 , H05K7/20809
摘要： Cooling apparatuses and methods are provided for immersion-cooling one or more electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a fluid-tight compartment about the electronic component(s) and a dielectric fluid disposed within the fluid-tight compartment, with the electronic component(s) immersed within the dielectric fluid. A vapor-condenser and one or more wicking components are also provided. The vapor-condenser includes a plurality of thermally conductive condenser fins extending within the fluid-tight compartment, and the wicking component(s) is disposed within the fluid-tight compartment in physical contact with at least a portion of one or more thermally conductive condenser fins of the thermally conductive condenser fins extending within the compartment. The wicking component(s) facilitates drawing condensed fluid from a surface of the thermally conductive condenser fin(s) and thereby enhances heat transfer across the surface of the condenser fin(s).
摘要翻译：提供冷却装置和方法用于浸入冷却一个或多个电子部件。冷却装置包括壳体，其至少部分围绕电子部件围绕并形成流体密封的隔室，以及布置在流体密封隔室内的电介质流体，电子部件浸入介电流体内。还提供蒸气冷凝器和一个或多个芯吸部件。蒸汽冷凝器包括在流体密封室内延伸的多个导热冷凝器翅片，并且芯吸部件设置在流体密封室内，与至少一部分一个或多个导热冷凝器物理接触在隔室内延伸的导热冷凝器翅片的翅片。芯吸部件有助于从导热性冷凝器翅片的表面吸收冷凝流体，从而增强横跨冷凝器翅片的表面的热传递。

85. 发明申请

US20130021752A1 TWO-PHASE, WATER-BASED IMMERSION-COOLING APPARATUS WITH PASSIVE DEIONIZATION 有权
标题翻译：两相，水基浸入式冷却装置，被动破坏
公开(公告)号：US20130021752A1
公开(公告)日：2013-01-24
申请号：US13187556
申请日：2011-07-21
申请人： Levi A. CAMPBELL , Richard C. CHU , Milnes P. DAVID , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Robert E. SIMONS , Prabjit SINGH
发明人： Levi A. CAMPBELL , Richard C. CHU , Milnes P. DAVID , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Robert E. SIMONS , Prabjit SINGH
IPC分类号： H05K7/20 , H05K13/00 , F28F7/00
CPC分类号： H05K13/00 , F28D15/02 , F28D2021/0028 , H01L23/427 , H01L23/473 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/15311 , H05K7/20236 , H05K7/203 , H05K7/20745 , H05K7/20772 , H05K7/20809 , Y10T29/49002 , Y10T29/49353 , H01L2924/00
摘要： Cooling apparatuses, cooled electronic modules and methods of fabrication are provided for fluid immersion-cooling of an electronic component(s). The cooled electronic module includes a substrate supporting the electronic component(s), and the cooling apparatus couples to the substrate, and includes a housing at least partially surrounding and forming a compartment about the electronic component(s). Additionally, the cooling apparatus includes a fluid and a deionization structure disposed within the compartment. The electronic component is at least partially immersed within the fluid, and the fluid is a water-based fluid. The deionization structure includes deionizing material, which ensures deionization of the fluid within the compartment. The deionization structure facilitates boiling heat transfer from the electronic component(s) to a condenser structure disposed in the compartment. Transferred heat is subsequently conducted to, for example, a liquid-cooled cold plate or an air-cooled heat sink coupled to the housing for cooling the condenser structure.
摘要翻译：提供冷却装置，冷却的电子模块和制造方法用于电子部件的流体浸没冷却。冷却的电子模块包括支撑电子部件的基板，并且冷却装置耦合到基板，并且包括至少部分围绕电子部件周围并形成隔室的壳体。此外，冷却装置包括设置在隔室内的流体和去离子结构。电子部件至少部分地浸没在流体内，并且流体是水基流体。去离子结构包括去离子材料，其确保隔室内的流体的去离子。去离子结构便于从电子部件到设置在隔室中的冷凝器结构的沸腾热传递。随后将转移的热量传送到例如冷却冷凝器结构的液冷冷板或连接到壳体的风冷散热片。

86. 发明申请

US20120111038A1 VAPOR-COMPRESSION REFRIGERATION APPARATUS WITH BACKUP AIR-COOLED HEAT SINK AND AUXILIARY REFRIGERANT HEATER 审中-公开
标题翻译：带有备用空气冷却的散热器和辅助制冷器加热器的蒸气压缩制冷装置
公开(公告)号：US20120111038A1
公开(公告)日：2012-05-10
申请号：US12939563
申请日：2010-11-04
申请人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Robert E. SIMONS
发明人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Robert E. SIMONS
IPC分类号： F25B1/00 , F28F7/00 , F25B29/00 , F25D31/00 , F25B39/02
CPC分类号： H05K7/208 , F25B39/02 , F25B49/02 , F25B2400/01 , F25B2500/06 , H05K7/20809 , H05K7/20836 , Y10T29/49826
摘要： Apparatus and method are provided for cooling an electronic component. The apparatus includes a refrigerant evaporator in thermal communication with a component(s) to be cooled, and a refrigerant loop coupled in fluid communication with the evaporator for facilitating flow of refrigerant through the evaporator. The apparatus further includes a compressor in fluid communication with a refrigerant loop, an air-cooled heat sink coupled to the refrigerant evaporator, for providing backup cooling to the electronic component in a backup, air cooling mode, and a controllable refrigerant heater coupled to the heat sink. The refrigerant heater is in thermal communication across the heat sink with refrigerant passing through the refrigerant evaporator, and is controlled in a primary, refrigeration cooling mode to apply an auxiliary heat load to refrigerant passing through the refrigerant evaporator to ensure that refrigerant in the refrigerant loop entering the compressor is in a superheated thermodynamic state.
摘要翻译：提供了用于冷却电子部件的装置和方法。该装置包括与要冷却的部件热连通的制冷剂蒸发器和与蒸发器流体连通的制冷剂回路，以便制冷剂流过蒸发器。该装置还包括与制冷剂回路流体连通的压缩机，耦合到制冷剂蒸发器的空气冷却散热器，用于在备用空气冷却模式中向电子部件提供备用冷却，以及耦合到散热器。制冷剂加热器通过散热器与通过制冷剂蒸发器的制冷剂热连通，并且被控制在主要的冷冻冷却模式中，以对通过制冷剂蒸发器的制冷剂施加辅助热负荷，以确保制冷剂回路中的制冷剂进入压缩机处于过热的热力学状态。

87. 发明申请

US20120026691A1 APPARATUS AND METHOD FOR FACILITATING DISSIPATION OF HEAT FROM A LIQUID-COOLED ELECTRONICS RACK 有权
标题翻译：用于促进从液体冷却电子架排出热量的装置和方法
公开(公告)号：US20120026691A1
公开(公告)日：2012-02-02
申请号：US12845374
申请日：2010-07-28
申请人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Robert E. SIMONS
发明人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Robert E. SIMONS
IPC分类号： H05K7/20
CPC分类号： H05K7/20781
摘要： Apparatus and method are provided for facilitating cooling of one or more components of an electronics rack. The apparatus includes a liquid-cooled structure associated with the electronic component(s) to be cooled, and a liquid-to-air heat exchanger coupled in fluid communication with the liquid-cooled structure via a coolant loop to receive coolant from and supply coolant to the liquid-cooled structure. The heat exchanger is disposed external to the electronics rack within a cool air plenum of the data center containing the rack, and the plenum is coupled to a cool air source providing cooled air to the data center. Cooled air of the cool air plenum passes across the heat exchanger and cools coolant passing through the heat exchanger, which dissipates heat from the coolant passing therethrough to the cool air passing across the heat exchanger to facilitate liquid cooling of the electronic component(s) associated with the liquid-cooled structure.
摘要翻译：提供了用于促进电子机架的一个或多个部件的冷却的装置和方法。该装置包括与要冷却的电子部件相关联的液冷结构，以及液 - 空热交换器，其经由冷却剂回路与液冷结构流体连通地连接以从冷却剂接收冷却剂并供应冷却剂到液冷结构。热交换器设置在包含机架的数据中心的冷空气室内的电子机架的外部，并且气室与冷空气源耦合，从而向数据中心提供冷却的空气。冷空气通风室的冷却空气穿过热交换器并冷却通过热交换器的冷却剂，冷却剂将通过其的冷却剂的热量散发到通过热交换器的冷空气中，以促进电子部件相关联的液体冷却具有液冷结构。

88. 发明申请

US20120024501A1 THERMOELECTRIC-ENHANCED, LIQUID-COOLING APPARATUS AND METHOD FOR FACILITATING DISSIPATION OF HEAT 有权
标题翻译：热电增强型液体冷却装置及其加热排放方法
公开(公告)号：US20120024501A1
公开(公告)日：2012-02-02
申请号：US12845355
申请日：2010-07-28
申请人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Robert E. SIMONS
发明人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Robert E. SIMONS
IPC分类号： F28D15/00
CPC分类号： H05K7/2079 , H05K7/20836
摘要： Thermoelectric-enhanced, liquid-cooling apparatus and method are provided for facilitating cooling of one or more components of an electronics rack. The apparatus includes a liquid-cooled structure in thermal communication with the component(s) to be cooled, and a liquid-to-air heat exchanger coupled in fluid communication with the liquid-cooled structure via a coolant loop for receiving coolant from and supply coolant to the liquid-cooled structure. A thermoelectric array is disposed with first and second coolant loop portions in thermal contact with first and second sides of the array. The thermoelectric array operates to transfer heat from coolant passing through the first loop portion to coolant passing through the second loop portion, and cools coolant passing through the first loop portion before the coolant passes through the liquid-cooled structure. Coolant passing through the first and second loop portions passes through the liquid-to-air heat exchanger for cooling thereof.
摘要翻译：提供了热电增强型液体冷却装置和方法，以便于电子机架的一个或多个部件的冷却。该装置包括与要冷却的部件热连通的液冷结构，以及液 - 空热交换器，其经由冷却剂回路与液冷结构流体连通，用于接收冷却剂和供应冷却液流向液冷结构。热电阵列设置有与阵列的第一和第二侧热接触的第一和第二冷却剂回路部分。热电阵列用于将热量从穿过第一环路部分的冷却剂传递到穿过第二环路部分的冷却剂，并且在冷却剂通过液冷结构之前冷却通过第一环部分的冷却剂。通过第一和第二环路部分的冷却剂通过液体 - 空气热交换器进行冷却。

89. 发明申请

US20110317367A1 LIQUID-COOLED ELECTRONICS RACK WITH IMMERSION-COOLED ELECTRONIC SUBSYSTEMS 失效
标题翻译：液体冷却电子机架，带冷却冷却电子辅机
公开(公告)号：US20110317367A1
公开(公告)日：2011-12-29
申请号：US12825781
申请日：2010-06-29
申请人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Robert E. SIMONS
发明人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Robert E. SIMONS
IPC分类号： H05K7/20
CPC分类号： H05K7/20809
摘要： Liquid-cooled electronics racks are provided which include: immersion-cooled electronic subsystems; a vapor-condensing heat exchanger to condense dielectric fluid vapor egressing from the immersion-cooled electronic subsystems; a dielectric fluid vapor return coupling in fluid communication the vapor outlets of the immersion-cooled electronic subsystems and the vapor-condensing heat exchanger; a reservoir for holding dielectric fluid; a gravity drain line coupled to drain dielectric fluid condensate from the vapor-condensing heat exchanger to the reservoir; an immersed, sub-cooling heat exchanger disposed within the reservoir; a dielectric fluid supply manifold coupling in fluid communication the reservoir and the dielectric fluid inlets of the immersion-cooled electronic subsystems; and a pump for supplying under pressure dielectric fluid from the reservoir to the dielectric fluid supply manifold for maintaining dielectric fluid in a liquid state within the immersion-cooled electronic subsystems.
摘要翻译：提供液冷电子机架，包括：浸入式冷却电子子系统; 蒸气冷凝热交换器，用于冷凝从浸没冷却的电子子系统排出的介质流体蒸气; 介电流体蒸汽返回联接器，其使浸没冷却的电子子系统的蒸汽出口和蒸汽冷凝热交换器流体连通; 用于保持介电流体的储存器; 重力排放管线，其耦合以将介电流体冷凝物从所述蒸汽冷凝热交换器排出到所述储存器; 设置在储存器内的浸没式次冷热交换器; 介质流体供应歧管联接以使浸没冷却的电子子系统的储存器和电介质流体入口流体连通; 以及用于将压力介质流体从储存器供应到介电流体供应歧管的泵，用于将浸没冷却的电子子系统内的介质流体保持在液态。

90. 发明申请

US20110315355A1 IMMERSION-COOLING APPARATUS AND METHOD FOR AN ELECTRONIC SUBSYSTEM OF AN ELECTRONICS RACK 有权
标题翻译：电子机架的电子子系统的冷却冷却装置和方法
公开(公告)号：US20110315355A1
公开(公告)日：2011-12-29
申请号：US12825756
申请日：2010-06-29
申请人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, Jr. , Madhusudan K. IYENGAR , Robert E. SIMONS
发明人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, Jr. , Madhusudan K. IYENGAR , Robert E. SIMONS
IPC分类号： F28D15/00 , F25B41/00
CPC分类号： H05K7/20809 , F28D15/02
摘要： Cooling apparatus and method are provided for immersion-cooling of an electronic subsystem of an electronics rack. The cooling apparatus includes a housing at least partially surrounding and forming a sealed compartment about the electronic subsystem and a dielectric fluid disposed within the sealed compartment, with the electronic subsystem being immersed within the dielectric fluid. A liquid-cooled vapor condenser is provided which includes a plurality of thermally conductive condenser fins extending within the sealed compartment in an upper portion of the compartment. The condenser fins facilitate cooling of dielectric fluid vapor rising to the upper portion of the compartment. A filler material is disposed within the sealed compartment to reduce the amount of dielectric fluid required within the compartment to achieve immersion-cooling of the electronic subsystem, and the filler material includes a shaped surface to direct dielectric fluid vapor within the compartment towards the condenser fins.
摘要翻译：提供冷却装置和方法用于电子机架的电子子系统的浸没冷却。冷却装置包括至少部分围绕电子子系统和形成密封隔室的外壳，以及设置在密封室内的电介质流体，电子子系统浸没在电介质流体内。提供了一种液体冷却的蒸汽冷凝器，其包括在隔室的上部中在密封隔室内延伸的多个导热冷凝器翅片。冷凝器翅片有助于冷却上升到隔室上部的介质流体蒸气。填充材料设置在密封隔室内以减少隔室内所需的介电流体的量以实现电子子系统的浸没冷却，并且填充材料包括成形表面，以将隔室内的介质流体蒸气导向冷凝器翅片。

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