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81. 发明授权

US07288433B2 Method of making assemblies having stacked semiconductor chips 有权
标题翻译：制造具有层叠半导体芯片的组件的方法
公开(公告)号：US07288433B2
公开(公告)日：2007-10-30
申请号：US11156812
申请日：2005-06-20
申请人： Belgacem Haba , Masud Beroz
发明人： Belgacem Haba , Masud Beroz
IPC分类号： H01L21/44
CPC分类号： H01L23/5387 , H01L2224/16225 , H01L2224/32225 , H01L2224/73253 , H01L2924/00014 , H01L2224/0401
摘要： A stacked microelectronic assembly comprises a flexible sheet having an obverse surface and a reverse surface and including at least a first panel and a second panel. The second panel and the first panel are adjacent to each other, the second panel including terminals on the reverse surface for mounting to an external circuit. The first panel includes a non-overmolded microelectronic element mounted thereon. The microelectronic element having a rear face and a front face surface, wherein the front face surface confronts the obverse surface of the first panel. During manufacture the flexible sheet is folded to create a stacked microelectronic assembly such that the rear face of the first microelectronic assembly confronts and substantially contacts the obverse surface of the second panel. This results in the second panel being kept substantially flat during subsequent mounting to the external circuit.
摘要翻译：堆叠的微电子组件包括具有正面和反面并且至少包括第一面板和第二面板的柔性片。第二面板和第一面板彼此相邻，第二面板包括用于安装到外部电路的反面上的端子。第一面板包括安装在其上的非包覆成型的微电子元件。微电子元件具有后表面和前表面，其中前表面面对第一面板的正面。在制造期间，将柔性片材折叠以产生堆叠的微电子组件，使得第一微电子组件的后表面面对并基本上接触第二面板的正面。这导致在后续安装到外部电路期间第二面板保持基本平坦。

82. 发明申请

US20060138640A1 Multi-sheet conductive substrates for microelectronic devices and methods for forming such substrates 有权
标题翻译：用于微电子器件的多片导电衬底以及用于形成这种衬底的方法
公开(公告)号：US20060138640A1
公开(公告)日：2006-06-29
申请号：US11025401
申请日：2004-12-29
申请人： Masud Beroz , Belgacem Haba
发明人： Masud Beroz , Belgacem Haba
IPC分类号： H05K1/11 , H01L21/4763 , H01L23/12
CPC分类号： H01L23/49833 , H01L23/4985 , H01L2224/48227 , H01L2224/49109 , H05K1/112 , H05K3/4611 , H05K2201/09472
摘要： A substrate is provided having a plurality of sheets. Each sheet has a first major surface containing a plurality of electrically conductive regions and a second major surface that opposes the first major surface. The sheets are arranged such that the first major surface of a sheet faces the second major surface of another. At least one electrically conductive region of each sheet is partially or fully exposed. At least one electrically conductive region of a sheet is partially or fully covered, e.g., by one or more electrically conductive regions of another sheet. A method for forming such a substrate is also provided.
摘要翻译：提供具有多个片材的基片。每个片材具有包含多个导电区域的第一主表面和与第一主表面相对的第二主表面。片材布置成使得片材的第一主表面面对另一片材的第二主表面。每个片材的至少一个导电区域部分或全部暴露。片材的至少一个导电区域被部分或完全覆盖，例如由另一片材的一个或多个导电区域覆盖。还提供了一种用于形成这种基板的方法。

83. 发明授权

US06651321B2 Microelectronic joining processes 有权
标题翻译：微电子连接工艺
公开(公告)号：US06651321B2
公开(公告)日：2003-11-25
申请号：US09523513
申请日：2000-03-10
申请人： Masud Beroz , Belgacem Haba , Klaus-Jurgen Wolter
发明人： Masud Beroz , Belgacem Haba , Klaus-Jurgen Wolter
IPC分类号： H05K334
CPC分类号： H01L24/75 , H01L21/283 , H01L21/2885 , H01L21/563 , H01L21/6835 , H01L23/3128 , H01L24/11 , H01L24/12 , H01L24/14 , H01L24/16 , H01L24/72 , H01L24/81 , H01L2224/13099 , H01L2224/14051 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/75315 , H01L2224/7598 , H01L2224/81209 , H01L2224/81801 , H01L2224/83051 , H01L2224/83385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01021 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01061 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , Y10T29/49121 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , Y10T29/49149 , Y10T29/49169 , Y10T29/49224 , Y10T29/53178 , H01L2924/00
摘要： A Microelectronic Bonding processes wherein a microelectronic element is connected with a connection component having a polymeric body, and a bonding material is provided between contacts on the microelectronic element and conductive features of the connection component. The microelectronic element is heated so as to activate the bonding material, and then cooled, leaving said contacts on said microelectronic element bonded to said conductive features on the connection component. The connection component is maintained at an average temperature below the glass transition temperature of the polymer in the connection component during the heating and cooling steps.
摘要翻译：一种微电子接合方法，其中微电子元件与具有聚合物主体的连接部件连接，并且在微电子元件上的触点和连接部件的导电特征之间提供接合材料。加热微电子元件以激活接合材料，然后冷却，使所述微电子元件上的接触物接合到连接部件上的导电特征上。在加热和冷却步骤期间，连接部件保持在连接部件中聚合物的玻璃化转变温度以下的平均温度。

84. 发明授权

US06384475B1 Lead formation using grids 有权
标题翻译：使用网格的铅形成
公开(公告)号：US06384475B1
公开(公告)日：2002-05-07
申请号：US09535620
申请日：2000-03-27
申请人： Masud Beroz , Belgacem Haba , Christopher M. Pickett
发明人： Masud Beroz , Belgacem Haba , Christopher M. Pickett
IPC分类号： H01L2348
CPC分类号： H01L23/49827 , H01L21/4846 , H01L21/563 , H01L2224/73203 , H01L2924/01079
摘要： A component for making microelectronic units includes a grid of interspersed leads with ends of the various leads being connected to one another by frangible elements. One end of each lead is bonded to a top element and the other end of each lead is bonded to a bottom element. The top and bottom elements are moved away from one another, thereby breaking the frangible elements and deforming the leads towards a vertically extensive disposition. A flowable composition such as dielectric material may be injected around the leads during or after the moving step. The resulting unit may be used to form permanent or temporary connections between microelectronic elements.
摘要翻译：用于制造微电子单元的部件包括散布引线的网格，各个引线的端部通过易碎元件彼此连接。每个引线的一端结合到顶部元件，并且每个引线的另一端结合到底部元件。顶部和底部元件彼此远离，从而破坏易碎元件并使引线变形成垂直方向的布置。可移动组合物如介电材料可以在移动步骤期间或之后在引线周围注入。所得到的单元可用于在微电子元件之间形成永久或临时连接。

85. 发明授权

US06334942B1 Selective removal of dielectric materials and plating process using same 有权
公开(公告)号：US06334942B1
公开(公告)日：2002-01-01
申请号：US09247156
申请日：1999-02-09
申请人： Belgacem Haba , Irina Poukhova , Masud Beroz
发明人： Belgacem Haba , Irina Poukhova , Masud Beroz
IPC分类号： C25D502
CPC分类号： H01L21/4828 , C25D7/12 , H05K3/062 , H05K3/108 , H05K3/4092 , H05K2203/0597 , H05K2203/095 , H05K2203/105 , H05K2203/1184
摘要： A metal is provided on a polymeric component and the component is subjected to a removal process such as plasma or liquid etching in the presence of an electric field. The etchant selectively attacks the polymer at the boundary between the metal and the polymer, thereby forming gaps alongside the metal. A cover metal may be plated onto the metal in the gaps. The cover metal protects the principal metal during subsequent etching procedures.

86. 发明授权

US08525314B2 Stacked packaging improvements 有权
公开(公告)号：US08525314B2
公开(公告)日：2013-09-03
申请号：US11666975
申请日：2005-11-03
申请人： Belgacem Haba , Craig S. Mitchell , Masud Beroz
发明人： Belgacem Haba , Craig S. Mitchell , Masud Beroz
IPC分类号： H01L23/02
CPC分类号： H01L24/81 , H01L21/56 , H01L21/78 , H01L23/49575 , H01L23/49833 , H01L24/48 , H01L24/97 , H01L25/105 , H01L25/18 , H01L25/50 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2225/1023 , H01L2225/1029 , H01L2225/1041 , H01L2225/1052 , H01L2225/1058 , H01L2924/00014 , H01L2924/01002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/07811 , H01L2924/15311 , H01L2924/19107 , H01L2924/3011 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A plurality of microelectronic assemblies (60) are made by severing an in-process unit including an upper substrate (40) and lower substrate (20) with microelectronic elements (36) disposed between the substrates. In a further embodiment, a lead frame (452) is joined to a substrate (440) so that the leads project from this substrate. Lead frame (452) is joined to a further substrate (470) with one or more microelectronic elements (436, 404, 406) disposed between the substrates.

87. 发明申请

US20090071000A1 Formation of circuitry with modification of feature height 有权
标题翻译：形成具有特征高度修改的电路
公开(公告)号：US20090071000A1
公开(公告)日：2009-03-19
申请号：US12291853
申请日：2008-11-14
申请人： Belgacem Haba , Masud Beroz , Young-Gon Kim , David B. Tuckerman
发明人： Belgacem Haba , Masud Beroz , Young-Gon Kim , David B. Tuckerman
IPC分类号： H01R43/20
CPC分类号： H01L24/48 , H01L23/13 , H01L23/49811 , H01L24/45 , H01L24/49 , H01L2224/0233 , H01L2224/02377 , H01L2224/45144 , H01L2224/48091 , H01L2224/48095 , H01L2224/4824 , H01L2224/48465 , H01L2224/48599 , H01L2224/49175 , H01L2224/85444 , H01L2224/85455 , H01L2924/01005 , H01L2924/01006 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , Y10T29/49208 , H01L2924/00014 , H01L2924/00
摘要： A connection component for mounting a chip or other microelectronic element is formed from a starting unit including posts projecting from a dielectric element by crushing or otherwise reducing the height of at least some of the posts.
摘要翻译：用于安装芯片或其他微电子元件的连接部件由起动单元形成，起动单元包括通过压碎或以其他方式减小至少一些柱的高度从电介质元件突出的柱。

88. 发明授权

US07462936B2 Formation of circuitry with modification of feature height 有权
标题翻译：形成具有特征高度修改的电路
公开(公告)号：US07462936B2
公开(公告)日：2008-12-09
申请号：US10959465
申请日：2004-10-06
申请人： Belgacem Haba , Masud Beroz , Young-Gon Kim , David B. Tuckerman
发明人： Belgacem Haba , Masud Beroz , Young-Gon Kim , David B. Tuckerman
IPC分类号： H01L23/48
CPC分类号： H01L24/48 , H01L23/13 , H01L23/49811 , H01L24/45 , H01L24/49 , H01L2224/0233 , H01L2224/02377 , H01L2224/45144 , H01L2224/48091 , H01L2224/48095 , H01L2224/4824 , H01L2224/48465 , H01L2224/48599 , H01L2224/49175 , H01L2224/85444 , H01L2224/85455 , H01L2924/01005 , H01L2924/01006 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , Y10T29/49208 , H01L2924/00014 , H01L2924/00
摘要： A connection component for mounting a chip or other microelectronic element is formed from a starting unit including posts projecting from a dielectric element by crushing or otherwise reducing the height of at least some of the posts.
摘要翻译：用于安装芯片或其他微电子元件的连接部件由起动单元形成，起动单元包括通过压碎或以其它方式减小至少一些柱的高度从电介质元件伸出的柱。

89. 发明授权

US07427423B2 Components with conductive solder mask layers 有权
标题翻译：具有导电阻焊层的部件
公开(公告)号：US07427423B2
公开(公告)日：2008-09-23
申请号：US09942386
申请日：2001-08-30
申请人： Masud Beroz , Belgacem Haba
发明人： Masud Beroz , Belgacem Haba
IPC分类号： B05D5/12 , B23K31/00
CPC分类号： H01L24/16 , H01L23/49816 , H01L24/05 , H01L24/73 , H01L24/83 , H01L24/90 , H01L2224/0401 , H01L2224/05001 , H01L2224/0554 , H01L2224/05551 , H01L2224/05555 , H01L2224/13021 , H01L2224/13099 , H01L2224/131 , H01L2224/13147 , H01L2224/2919 , H01L2224/8319 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01076 , H01L2924/01078 , H01L2924/014 , H01L2924/0665 , H01L2924/3011 , H01L2924/3025 , H05K1/0201 , H05K3/3452 , H05K3/3457 , H05K2201/062 , H05K2201/0715 , H05K2201/2081 , H05K2203/0315 , H01L2924/00014 , H01L2924/00
摘要： A method of fabricating solder assemblies for forming solder connections that include a dielectric base having a non solder-wettable surface, a plurality of solder-wettable pads exposed to said surface, and an electrically conductive potential plane element having a non solder-wettable surface overlying the surface of the base in proximity to the pads but spaced from said pads. The non-wettable surface of the potential plane element may include a metal such as nickel or a metal oxide. The potential plane element thus performs the functions of a solder mask to prevent solder from forming short circuits between adjacent pads, and may also act as a ground plane, power plane or shielding element.
摘要翻译：一种制造用于形成焊接连接的焊料组件的方法，其包括具有不可焊接润湿表面的电介质基底，暴露于所述表面的多个焊料可润湿焊盘以及具有不可焊接润湿表面的导电电位平面元件基部的表面靠近焊盘，但与所述焊盘间隔开。电位平面元件的不可润湿表面可以包括诸如镍或金属氧化物的金属。因此，电位平面元件执行焊接掩模的功能，以防止焊料在相邻焊盘之间形成短路，并且还可以用作接地层，电源层或屏蔽元件。

90. 发明授权

US07351641B2 Structure and method of forming capped chips 有权
标题翻译：形成封盖芯片的结构和方法
公开(公告)号：US07351641B2
公开(公告)日：2008-04-01
申请号：US11201726
申请日：2005-08-11
申请人： Belgacem Haba , Masud Beroz , Glenn Urbish , David B. Tuckerman
发明人： Belgacem Haba , Masud Beroz , Glenn Urbish , David B. Tuckerman
IPC分类号： H01L21/76 , H01L21/30
CPC分类号： B81B7/007 , H03H3/02 , H03H9/0547 , H03H9/059 , H03H9/1057 , H03H9/1092
摘要： As disclosed herein, structures and methods are provided for forming capped chips. As provided by the disclosed method, a metal base pattern is formed on a chip insulated from wiring of the chip, and a cap is formed including a metal. The cap is joined to the metal base pattern on the chip to form the capped chip. In one embodiment, a front surface of the chip is exposed which extends from a contact of the chip to an edge of the chip. In another embodiment, a conductive connection is formed to the contact, the conductive connection extending from the contact to a terminal at an exposed plane above the front surface of the chip.
摘要翻译：如本文所公开的，提供了用于形成加盖芯片的结构和方法。通过所公开的方法提供，在与芯片的布线绝缘的芯片上形成金属基底图案，并且形成包括金属的盖。盖子连接到芯片上的金属基底图案以形成封盖的芯片。在一个实施例中，芯片的前表面被暴露，其从芯片的触点延伸到芯片的边缘。在另一个实施例中，导电连接形成于接触件，导电连接件从接触件延伸到芯片前表面上的暴露平面处的端子。

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