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    • 82. 发明授权
    • Corner dominated trigate field effect transistor
    • 角主导的立体场效应晶体管
    • US07473605B2
    • 2009-01-06
    • US11866435
    • 2007-10-03
    • Brent A. AndersonAndres BryantJeffrey B. JohnsonEdward J. Nowak
    • Brent A. AndersonAndres BryantJeffrey B. JohnsonEdward J. Nowak
    • H01L21/336
    • H01L29/785H01L29/42384H01L29/66795
    • Disclosed are embodiments of a trigate field effect transistor that comprises a fin-shaped semiconductor body with a channel region and source/drain regions on either side of the channel region. Thick gate dielectric layers separate the top surface and opposing sidewalls of the channel region from the gate conductor in order to suppress conductivity in the channel planes. A thin gate dielectric layer separates the upper corners of the channel region from the gate conductor in order to optimize conductivity in the channel corners. To further emphasize the current flow in the channel corners, the source/drain regions can be formed in the upper corners of the semiconductor body alone. Alternatively, source/drain extension regions can be formed only in the upper corners of the semiconductor body adjacent to the gate conductor and deep source/drain diffusion regions can be formed in the ends of the semiconductor body.
    • 公开了一种触发场效应晶体管的实施例,其包括具有沟道区的鳍状半导体本体和沟道区两侧的源极/漏极区。 厚栅电介质层将沟道区的顶表面和相对的侧壁与栅极导体分开,以便抑制沟道平面中的导电性。 薄栅极电介质层将沟道区的上角与栅极导体分开,以便优化沟道角中的导电性。 为了进一步强调通道角中的电流流动,源极/漏极区域可以单独形成在半导体主体的上角部。 或者,源极/漏极延伸区域仅可以形成在与栅极导体相邻的半导体本体的上角处,并且可以在半导体本体的端部形成深的源极/漏极扩散区域。
    • 87. 发明授权
    • FinFET with low gate capacitance and low extrinsic resistance
    • FinFET具有低栅极电容和低外部电阻
    • US07105934B2
    • 2006-09-12
    • US10711170
    • 2004-08-30
    • Brent A. AndersonAndres BryantEdward J. Nowak
    • Brent A. AndersonAndres BryantEdward J. Nowak
    • H01L29/76H01L21/332H01L21/335
    • H01L29/785H01L29/42384H01L29/66795Y10S257/90
    • A FinFET device and a method of lowering a gate capacitance and extrinsic resistance in a field effect transistor, wherein the method comprises forming an isolation layer comprising a BOX layer over a substrate, configuring source/drain regions above the isolation layer, forming a fin structure over the isolation layer, configuring a first gate electrode adjacent to the fin structure, disposing a gate insulator between the first gate electrode and the fin structure, positioning a second gate electrode transverse to the first gate electrode, and depositing a third gate electrode on the fin structure, the first gate electrode, and the second gate electrode, wherein the isolation layer is formed beneath the insulator, the first gate electrode, and the fin structure. The method further comprises sandwiching the second gate electrode with a dielectric material. The fin structure is formed by depositing an oxide layer over a silicon layer.
    • FinFET器件和降低场效应晶体管中的栅极电容和外在电阻的方法,其中所述方法包括在衬底上形成包括BOX层的隔离层,在隔离层上方构成源/漏区,形成鳍结构 在所述隔离层上方配置与所述鳍结构相邻的第一栅电极,在所述第一栅电极和所述鳍结构之间设置栅极绝缘体,将第二栅电极定位成横向于所述第一栅电极,以及将第三栅电极 鳍结构,第一栅电极和第二栅电极,其中隔离层形成在绝缘体下方,第一栅电极和鳍结构之下。 该方法还包括用电介质材料夹住第二栅电极。 翅片结构通过在硅层上沉积氧化物层而形成。
    • 90. 发明授权
    • Matched transistors and methods for forming the same
    • 匹配的晶体管及其形成方法
    • US06552396B1
    • 2003-04-22
    • US09524295
    • 2000-03-14
    • Andres BryantWilliam F. Clark, Jr.Edward J. NowakMinh H. Tong
    • Andres BryantWilliam F. Clark, Jr.Edward J. NowakMinh H. Tong
    • H01L2701
    • H01L27/1203H01L21/84
    • An SOI multiple FET structure is provided that comprises a substrate having a substrate layer on an insulator layer. The SOI multiple FET structure includes distal diffusion regions in the substrate layer and a central diffusion region in the substrate layer. The central diffusion region has a width and extends from a surface of the substrate layer downward into contact with the insulator layer along a portion of the width and extends only partially into the substrate layer along another portion of the width. The SOI multiple FET structure also includes a pair of gates on the surface of the substrate layer each overlapping one of the distal diffusion regions and the central diffusion region; and a pair of body regions in the substrate layer each under one of the gates for forming a channel between the one of the distal diffusion regions and the central diffusion region. The body regions are in electrical communication under the another portion of the width of the central diffusion region. Methods for forming the SOI multiple FET structure are also provided.
    • 提供了SOI多FET结构,其包括在绝缘体层上具有衬底层的衬底。 SOI多FET结构包括衬底层中的远端扩散区域和衬底层中的中心扩散区域。 中心扩散区具有宽度并且从衬底层的表面向下延伸,沿着宽度的一部分与绝缘体层接触,并且沿宽度的另一部分仅部分地延伸到衬底层中。 SOI多FET结构还包括在衬底层的表面上的一对栅极,每个栅极重叠远端扩散区域和中心扩散区域之一; 以及在所述基板层中的一个所述栅极之间的一对体区,用于在所述远侧扩散区域和所述中央扩散区域中的一个之间形成沟道。 身体区域在中央扩散区域的宽度的另一部分下电连通。 还提供了形成SOI多FET结构的方法。