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    • 83. 发明授权
    • Semiconductor package and packaging method using flip-chip bonding technology
    • 半导体封装方法采用倒装芯片封装技术
    • US07098535B2
    • 2006-08-29
    • US10953120
    • 2004-09-28
    • Yeong-Gyu LeeSeung-Do An
    • Yeong-Gyu LeeSeung-Do An
    • H01L23/48
    • B81C1/00301B81B2207/097H01L2224/48463H01L2924/10253H01L2924/1461H01L2924/00
    • A semiconductor package and packaging method using a flip-chip bonding technology is disclosed. In the semiconductor package and packaging method, the microelement array of a micro-device, for example, the micromirror array of a light modulator having micromirrors that are hyperfine elements, is sealed from the outside using flip-chip bonding technology. Thus, the microelement array is protected from the outside. The packaging method executes the packaging process using only the flip-chip bonding technology, without a wire-bonding technology, at a wafer level instead of a conventional individual semiconductor device level, thus increasing the bonding process efficiency. Furthermore, the electrode array pattern for supplying both electricity and control signals to the microelement array does not pass through a hermetic sealing layer, thus ensuring a well-sealed semiconductor package. The electrode array pattern is also finely formed to correspond to the microelement array which is extremely finely formed.
    • 公开了使用倒装芯片接合技术的半导体封装和封装方法。 在半导体封装和封装方法中,微型器件的微元件阵列例如具有超微细元件的微反射镜的光调制器的微镜阵列使用倒装芯片接合技术从外部密封。 因此,微元件阵列受到外部保护。 封装方法在晶片级而不是传统的单个半导体器件级别上仅利用倒装芯片接合技术执行封装处理,而无需引线接合技术,从而提高了接合工艺效率。 此外,用于向微元件阵列提供电和控制信号的电极阵列图案不通过气密密封层,从而确保密封的半导体封装。 电极阵列图案也精细地形成为对应于非常精细地形成的微元件阵列。
    • 84. 发明授权
    • Flat panel display with thin film transistor
    • 带薄膜晶体管的平板显示器
    • US07009207B2
    • 2006-03-07
    • US10989643
    • 2004-11-17
    • Jae-Bon KooJi-Yong ParkUl-Ho LeeJin-Soo KimJin-Woung JungChang-Gyu Lee
    • Jae-Bon KooJi-Yong ParkUl-Ho LeeJin-Soo KimJin-Woung JungChang-Gyu Lee
    • H01L29/04
    • H01L29/78696H01L27/1285H01L27/1296H01L29/04H01L29/7866
    • A flat panel display capable of lowering an on-current of a driving thin film transistor (TFT), maintaining high switching properties of a switching TFT, maintaining uniform brightness using the driving TFT, and maintaining a life span of a light emitting device while the same voltages are applied to the switching TFT and the driving TFT without changing a size of an active layer. The flat panel display includes a light emitting device, a switching thin film transistor including a semiconductor active layer having a channel area for transferring a data signal to the light emitting device, and a driving thin film transistor including a semiconductor active layer having a channel area for driving the light emitting device. A predetermined amount of current flows through the light emitting device according to the data signal. The channel area of the switching thin film transistor has crystal grains with at least one of different sized or different shaped crystal grains than the crystal grains in the channel area of the driving thin film transistor.
    • 一种平板显示器,其能够降低驱动薄膜晶体管(TFT)的导通电流,保持开关TFT的高开关特性,使用驱动TFT保持均匀的亮度,并且保持发光器件的寿命,同时 在不改变有源层的尺寸的情况下,向开关TFT和驱动TFT施加相同的电压。 平板显示器包括发光器件,包括具有用于将数据信号传输到发光器件的沟道区域的半导体有源层的开关薄膜晶体管,以及包括具有沟道面积的半导体有源层的驱动薄膜晶体管 用于驱动发光装置。 预定量的电流根据数据信号流过发光器件。 开关薄膜晶体管的沟道区域具有与驱动薄膜晶体管的沟道区域中的晶粒不同尺寸或不同形状的晶粒中的至少一种的晶粒。
    • 86. 发明申请
    • Semiconductor package and packaging method using flip-chip bonding technology
    • 半导体封装方法采用倒装芯片封装技术
    • US20050269710A1
    • 2005-12-08
    • US10953120
    • 2004-09-28
    • Yeong-Gyu LeeSeung-Do An
    • Yeong-Gyu LeeSeung-Do An
    • H01L23/34H01L23/08H01L23/48H01L23/52
    • B81C1/00301B81B2207/097H01L2224/48463H01L2924/10253H01L2924/1461H01L2924/00
    • A semiconductor package and packaging method using a flip-chip bonding technology is disclosed. In the semiconductor package and packaging method, the microelement array of a micro-device, for example, the micromirror array of a light modulator having micromirrors that are hyperfine elements, is sealed from the outside using flip-chip bonding technology. Thus, the microelement array is protected from the outside. The packaging method executes the packaging process using only the flip-chip bonding technology, without a wire-bonding technology, at a wafer level instead of a conventional individual semiconductor device level, thus increasing the bonding process efficiency. Furthermore, the electrode array pattern for supplying both electricity and control signals to the microelement array does not pass through a hermetic sealing layer, thus ensuring a well-sealed semiconductor package. The electrode array pattern is also finely formed to correspond to the microelement array which is extremely finely formed.
    • 公开了使用倒装芯片接合技术的半导体封装和封装方法。 在半导体封装和封装方法中,微型器件的微元件阵列例如具有超微细元件的微反射镜的光调制器的微镜阵列使用倒装芯片接合技术从外部密封。 因此,微元件阵列受到外部保护。 封装方法在晶片级而不是传统的单个半导体器件级别上仅利用倒装芯片接合技术执行封装处理,而无需引线接合技术,从而提高了接合工艺效率。 此外,用于向微元件阵列提供电和控制信号的电极阵列图案不通过气密密封层,从而确保密封的半导体封装。 电极阵列图案也精细地形成为对应于非常精细地形成的微元件阵列。