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热词
    • 83. 发明授权
    • Stand-off transmission lines and method for making same
    • 离线传输线及其制作方法
    • US5017509A
    • 1991-05-21
    • US555814
    • 1990-07-18
    • David B. Tuckerman
    • David B. Tuckerman
    • H01P3/08H01P11/00
    • H01P3/081H01P11/003
    • Standoff transmission lines in an integrated circuit structure are formed by etching away or removing the portion of the dielectric layer separating the microstrip metal lines and the ground plane from the regions that are not under the lines. The microstrip lines can be fabricated by a subtractive process of etching a metal layer, an additive process of direct laser writing fine lines followed by plating up the lines or a subtractive/additive process in which a trench is etched over a nucleation layer and the wire is electrolytically deposited. Microstrip lines supported on freestanding posts of dielectric material surrounded by air gaps are produced. The average dielectric constant between the lines and ground plane is reduced, resulting in higher characteristic impedance, less crosstalk between lines, increased signal propagation velocities, and reduced wafer stress.
    • 集成电路结构中的分支传输线通过蚀刻除去将微带金属线和接地平面分隔开的介质层的部分与不在线下的区域形成。 微带线可以通过蚀刻金属层的减法处理,直接激光写入细线,随后电镀线的加法处理或其中在成核层上蚀刻沟槽的减法/添加工艺来制造微带线 电解沉积。 产生由气隙包围的介电材料的独立柱支撑的微带线。 线和接地层之间的平均介电常数降低,导致更高的特性阻抗,线间串扰减小,信号传播速度增加,晶片应力减小。