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    • 81. 发明授权
    • Slide assembly with positioning device
    • 带定位装置的滑动组件
    • US08528999B2
    • 2013-09-10
    • US13225633
    • 2011-09-06
    • Ken-Ching ChenChien-Li HuangChun-Chiang Wang
    • Ken-Ching ChenChien-Li HuangChun-Chiang Wang
    • A47B88/00A47B95/00
    • F16C29/005A47B88/487A47B88/57A47B2088/4235A47B2210/0018A47B2210/0035A47B2210/0059F16C29/046F16C29/048
    • The slide assembly includes a first rail, a second rail, a bearing assembly and an engaging member. The first rail includes an opening located adjacent to an end thereof and a stop face is defined on a wall of the opening. The bearing assembly is located between the first and second rails. The bearing assembly has a bearing retainer which has a first contact portion. The engaging member is connected to the second rail and has a second contact portion and an engaging portion. The second contact portion is located corresponding to the first contact portion. When the second rail is pulled relative to the first rail, the bearing retainer is moved by engagement between the first and second contact portions. When the bearing assembly moves to a desired position, the engaging portion is inserted into the opening and contacts the stop face so that the second rail is engaged with the first rail.
    • 滑动组件包括第一轨道,第二轨道,轴承组件和接合构件。 第一轨道包括邻近其端部的开口,并且止动面限定在开口的壁上。 轴承组件位于第一和第二轨道之间。 轴承组件具有带有第一接触部分的轴承保持器。 接合构件连接到第二轨道并且具有第二接触部分和接合部分。 第二接触部分对应于第一接触部分定位。 当相对于第一轨道拉动第二轨道时,轴承保持器通过第一和第二接触部分之间的接合来移动。 当轴承组件移动到期望的位置时,接合部分插入到开口中并接触止动面,使得第二轨道与第一轨道接合。
    • 83. 发明授权
    • Method to reduce void formation during trapezoidal write pole plating in perpendicular recording
    • 在垂直记录中梯形写入极电镀期间减少空隙形成的方法
    • US08273233B2
    • 2012-09-25
    • US12460432
    • 2009-07-17
    • Chao-Peng ChenJas ChudasamaSituan LamChien-Li Lin
    • Chao-Peng ChenJas ChudasamaSituan LamChien-Li Lin
    • C25D5/02
    • C25D5/022C25D5/18C25D7/001G11B5/1278G11B5/3116G11B5/3163
    • A method of forming a write pole in a PMR head is disclosed that involves forming an opening in a mold forming layer. A conformal Ru seed layer is formed within the opening and on a top surface. An auxiliary layer made of CoFeNi or alloys thereof is formed as a conformal layer on the seed layer. All or part of the auxiliary layer is removed in an electroplating solution by applying a (−) current or voltage during an activation step that is controlled by activation time. Thereafter, a magnetic material is electroplated with a (+) current to fill the opening and preferably has the same CoFeNi composition as the auxiliary layer. The method avoids Ru oxidation that causes poor adhesion to CoFeNi, and elevated surfactant levels that lead to write pole impurities. Voids in the plated material are significantly reduced by forming a seed layer surface with improved wettability.
    • 公开了一种在PMR头中形成写极的方法,其涉及在成型层中形成开口。 在开口内和顶表面上形成保形钌籽晶层。 由CoFeNi制成的辅助层或其合金在种子层上形成为保形层。 通过在由激活时间控制的激活步骤期间施加( - )电流或电压,在电镀溶液中去除全部或部分辅助层。 此后,以(+)电流电镀磁性材料以填充开口,并且优选地具有与辅助层相同的CoFeNi组成。 该方法避免了Ru氧化,导致对CoFeNi的粘附不良,以及导致写入极杂质的表面活性剂含量升高。 通过形成具有改善的润湿性的种子层表面,可显着地减少电镀材料中的空隙。
    • 84. 发明授权
    • Silicon based substrate and manufacturing method thereof
    • 硅基基板及其制造方法
    • US08269316B2
    • 2012-09-18
    • US12831431
    • 2010-07-07
    • Chien-Li KuoJui-Hung Cheng
    • Chien-Li KuoJui-Hung Cheng
    • H01L29/40
    • H01L23/522H01L21/76898H01L2924/0002H01L2924/00
    • A silicon based substrate includes a silicon wafer, a first circuit substrate and a second circuit substrate. The silicon wafer includes a first surface and a second surface and at least a through silicon via. The first circuit substrate is disposed on the first surface and includes a plurality of first dielectric layers and a plurality of first conductive trace layers alternately stacked. The second circuit substrate is disposed on the second surface and includes a plurality of second dielectric layers and a plurality of second conductive trace layers alternately stacked. The trace density of the first conductive trace layers is higher than the trace density of the second conductive trace layers. Otherwise, the first dielectric layer includes an inorganic material and the second dielectric layer includes an organic material. A manufacturing method of the silicon based substrate is also provided.
    • 硅基衬底包括硅晶片,第一电路衬底和第二电路衬底。 硅晶片包括第一表面和第二表面以及至少一个硅通孔。 第一电路基板设置在第一表面上,并且包括多个第一电介质层和交替层叠的多个第一导电迹线层。 第二电路基板设置在第二表面上,并且包括多个第二电介质层和交替层叠的多个第二导电迹线层。 第一导电迹线层的痕量密度高于第二导电迹线层的迹线密度。 否则,第一介​​电层包括无机材料,第二介电层包括有机材料。 还提供了硅基基板的制造方法。
    • 85. 发明申请
    • SIMULTANEOUSLY-INFLATED PLASTIC BLOW MOLD
    • 同时充气塑料吹塑模具
    • US20120082748A1
    • 2012-04-05
    • US13252800
    • 2011-10-04
    • Chien-Li CHEN
    • Chien-Li CHEN
    • B29C49/30
    • B29C49/48A63B41/00A63B45/00B29C49/20B29C49/4268B29C2049/2008B29C2049/2017B29C2049/2021B29C2791/001B29D22/02B29D22/04B29L2031/54
    • A simultaneously-inflated plastic blow mold includes a left mold and a right mold. The left mold or the right mold fixedly disposed with a control device includes a mold trough formed with a guide hole therein. When the left and right molds are closed, a gas nozzle is moved in the plastic blow mold to blow a product. The gas nozzle is stopped blowing the gas and withdrew from the plastic blow mold when the mold closing is completed. The control device is utilized to adjust a gas needle to enter the inside of the plastic blow mold via an inflating seat and to penetrate through the valve nozzle on a plastic blow product. The control device can adjust the gas blowing or exhausting step inside the hollow portion of the plastic blow product to remain a stable gas flow in the product blowing step.
    • 同时充气的塑料吹塑模具包括左模和右模。 固定设置有控制装置的左模具或右模具包括在其中形成有引导孔的模槽。 当左和右模具关闭时,气体喷嘴在塑料吹塑模具中移动以吹塑产品。 当模具关闭完成时,气体喷嘴停止吹入气体并从塑料吹塑模具中退出。 控制装置用于调节气针经由充气座进入塑料吹塑模具的内部并穿过塑料吹塑产品上的阀喷嘴。 控制装置可以调节塑料吹塑产品的中空部分内的气体吹送或排气步骤,以在产品吹制步骤中保持稳定的气流。
    • 86. 发明申请
    • LATCH AND RELEASE DEVICE FOR SLIDE ASSEMBLY
    • 用于滑动组件的锁定和释放装置
    • US20120076446A1
    • 2012-03-29
    • US12889884
    • 2010-09-24
    • Ken-Ching CHENChien-Li HUANGChun-Chiang WANG
    • Ken-Ching CHENChien-Li HUANGChun-Chiang WANG
    • A47B88/04
    • A47B88/43
    • A latch and release device for a slide assembly includes first and second rails slidably movable relative to each other. An engaging member includes a resilient arm and an engaging portion is connected to the resilient arm and faces the first rail. The engaging portion can be engaged with a latch which is fixed to the second rail to restrict the second rail to move relative to the first rail. An operation member includes a first end, a second end and a body which is pivotably connected to the second rail and the first end of the operation member contacts the resilient arm. When the second end of the operation member is shifted, the resilient arm is moved by the first end of the operation member to disengage from the latch.
    • 用于滑动组件的闩锁和释放装置包括可相对于彼此滑动移动的第一和第二轨道。 接合构件包括弹性臂,并且接合部分连接到弹性臂并面向第一轨道。 接合部分可以与固定到第二轨道的闩锁接合,以限制第二轨道相对于第一轨道移动。 操作构件包括第一端,第二端和可枢转地连接到第二轨道的主体,并且操作构件的第一端接触弹性臂。 当操作构件的第二端移动时,弹性臂由操作构件的第一端移动以与闩锁脱离。
    • 88. 发明申请
    • SILICON BASED SUBSTRATE AND MANUFACTURING METHOD THEREOF
    • 基于硅的基板及其制造方法
    • US20120007249A1
    • 2012-01-12
    • US12831431
    • 2010-07-07
    • Chien-Li KUOJui-Hung Cheng
    • Chien-Li KUOJui-Hung Cheng
    • H01L23/522H01L21/768
    • H01L23/522H01L21/76898H01L2924/0002H01L2924/00
    • A silicon based substrate includes a silicon wafer, a first circuit substrate and a second circuit substrate. The silicon wafer includes a first surface and a second surface and at least a through silicon via. The first circuit substrate is disposed on the first surface and includes a plurality of first dielectric layers and a plurality of first conductive trace layers alternately stacked. The second circuit substrate is disposed on the second surface and includes a plurality of second dielectric layers and a plurality of second conductive trace layers alternately stacked. The trace density of the first conductive trace layers is higher than the trace density of the second conductive trace layers. Otherwise, the first dielectric layer includes an inorganic material and the second dielectric layer includes an organic material. A manufacturing method of the silicon based substrate is also provided.
    • 硅基衬底包括硅晶片,第一电路衬底和第二电路衬底。 硅晶片包括第一表面和第二表面以及至少一个硅通孔。 第一电路基板设置在第一表面上,并且包括多个第一电介质层和交替层叠的多个第一导电迹线层。 第二电路基板设置在第二表面上,并且包括多个第二电介质层和交替层叠的多个第二导电迹线层。 第一导电迹线层的痕量密度高于第二导电迹线层的迹线密度。 否则,第一介​​电层包括无机材料,第二介电层包括有机材料。 还提供了硅基基板的制造方法。
    • 89. 发明授权
    • Locating structure for a slide assembly
    • 滑动组件的定位结构
    • US07918517B2
    • 2011-04-05
    • US11907413
    • 2007-10-12
    • Ken-Ching ChenChien-Li HuangWei-Sheng WangChun-Chiang Wang
    • Ken-Ching ChenChien-Li HuangWei-Sheng WangChun-Chiang Wang
    • A47B95/00
    • A47B88/57A47B88/493
    • A locating structure for a slide assembly includes a first track, a second track, a releasing member, and a locating member; a locating tab is provided at a front end of the first track; the second track is inserted and connected onto the first track to slide thereon; the second track is provided with a locating portion; the releasing member is mounted to an inner side of the second track; one end of the releasing member is provided with an operation button; the locating member is located on one side of the operation button and has a propped portion and a plunged portion; the locating member provides resilience for the propped portion to hold against the locating portion of the second track; and the locating member drives the propped portion to disengage from the locating portion by means of the plunged portion.
    • 滑动组件的定位结构包括第一轨道,第二轨道,释放构件和定位构件; 在第一轨道的前端设有定位翼片, 将第二轨道插入并连接到第一轨道上以在其上滑动; 第二轨道设置有定位部分; 释放构件安装到第二轨道的内侧; 释放构件的一端设置有操作按钮; 定位构件位于操作按钮的一侧,并具有支撑部分和突出部分; 定位构件为支撑部分提供弹性以抵靠第二轨道的定位部分; 并且定位构件通过突出部分驱动支撑部分与定位部分脱离接合。