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    • 86. 发明申请
    • Methods and apparatuses for processing wake events of communication networks
    • 处理通信网络唤醒事件的方法和装置
    • US20090172443A1
    • 2009-07-02
    • US12006150
    • 2007-12-31
    • Michael A. RothmanArvind KumarVincent J. ZimmerPatrick G. KutchOmer Levy
    • Michael A. RothmanArvind KumarVincent J. ZimmerPatrick G. KutchOmer Levy
    • H04L9/32G06F1/32
    • H04L63/08G06F1/3209G06F21/85H04L12/12H04L63/083Y02D50/40
    • Methods, apparatuses, and computer program products that respond to wake events of communication networks are disclosed. One or more embodiments comprise setting a wake password of a computing device, such as a notebook computer or a server. Some of the embodiments comprise receiving a wake request from a communications network, establishing a secure communication session, and setting the wake password with the secure communication session. Some embodiments comprise an apparatus having a network controller to allow a platform to communicate via a communications network, non-volatile memory that stores a wake password, and a management controller which may communicate with a management console via a secure communication session to update the wake password. One or more embodiments the network controller may wake management hardware and/or wake the management controller while keeping one or more of the devices in the power conservation mode.
    • 公开了响应通信网络的唤醒事件的方法,设备和计算机程序产品。 一个或多个实施例包括设置诸如笔记本计算机或服务器之类的计算设备的唤醒密码。 一些实施例包括从通信网络接收唤醒请求,建立安全通信会话,以及利用安全通信会话设置唤醒密码。 一些实施例包括具有网络控制器的装置,其允许平台经由通信网络进行通信,存储唤醒密码的非易失性存储器以及可以经由安全通信会话与管理控制台通信以更新唤醒的管理控制器 密码。 一个或多个实施例,网络控制器可以在保持一个或多个设备处于功率节省模式的同时唤醒管理硬件和/或唤醒管理控制器。
    • 87. 发明授权
    • Three-dimensional stackable die configuration for an electronic circuit board
    • 电子电路板的三维可堆叠模具配置
    • US07438558B1
    • 2008-10-21
    • US11939272
    • 2007-11-13
    • Arvind Kumar Sinha
    • Arvind Kumar Sinha
    • H01R12/00
    • H01R13/22Y10T29/4913
    • A three-dimensional die configuration for mounting electronic components to a circuit board includes a circuit board having at least one circuit board die, a first electronic component mounted at the circuit board die and a first substrate member including a first surface electrically connected to the first chip. The three-dimensional die configuration further includes a double-sided land grid array having a first surface electrically connected to a second surface of the first substrate member. A second substrate member is electrically connected to a second surface of the double-sided land grid array. A second electronic component is electrically connected to a second surface of the second substrate member. A thermal interface member abuts the second chip and is covered by a cap member. The resulting three-dimensional die configuration establishes a multiple electronic component mounting arrangement having a footprint of a single electronic component.
    • 用于将电子部件安装到电路板的三维管芯构造包括具有至少一个电路板裸片,安装在电路板裸片上的第一电子部件和第一基板部件的电路板,第一基板部件包括电连接到第一 芯片。 三维管芯配置还包括双面焊盘栅格阵列,其具有电连接到第一衬底构件的第二表面的第一表面。 第二基板部件电连接到双面焊盘格栅阵列的第二表面。 第二电子部件电连接到第二基板部件的第二表面。 热接口构件邻接第二芯片并被盖构件覆盖。 所得到的三维模具配置建立了具有单个电子部件的占地面积的多个电子部件安装装置。