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    • 73. 发明申请
    • Process For The Preparation Of An Additive-Containing Anionic Clay
    • 含添加剂阴离子粘土的制备方法
    • US20080032883A1
    • 2008-02-07
    • US11587393
    • 2005-04-26
    • William Jones
    • William Jones
    • C04B33/00
    • C01B13/322B01J20/06B01J20/08B01J23/002C01F7/005C01P2002/22C01P2002/50
    • Process for the preparation of an additive-containing anionic clay comprising the steps of (a) preparing a physical mixture of a divalent and a trivalent metal compound, (b) calcining the physical mixture at a temperature in the range 200-800° C. without performing a prior aging or shaping step, thereby forming a product containing at least 5 wt % of a rehydratable compound, and (c) rehydrating the calcined mixture in aqueous suspension containing an additive to form the additive-containing anionic clay. This process provides a simple and cost-effective way of preparing additive-containing anionic clays. The process does neither require aging or reaction steps before calcination, nor does it require precipitation of metal salts or the handling of inhomogeneous slurries.
    • 制备含添加剂的阴离子粘土的方法包括以下步骤:(a)制备二价和三价金属化合物的物理混合物,(b)在200-800℃的温度下煅烧该物理混合物。 从而形成含有至少5重量%的可再水化合物的产品,和(c)将含有添加剂的含水悬浮液中的煅烧混合物再水合以形成含添加剂的阴离子粘土。 该方法提供了制备含添加剂的阴离子粘土的简单和成本有效的方法。 该方法既不需要煅烧前的老化或反应步骤,也不需要沉淀金属盐或处理不均匀的浆料。
    • 80. 发明授权
    • Aqueous dispersion slurry of inorganic particles and production methods
thereof
    • 无机颗粒的水分散体浆料及其制备方法
    • US06068769A
    • 2000-05-30
    • US135840
    • 1998-08-18
    • Akira IioMasayuki HattoriMasayuki Motonari
    • Akira IioMasayuki HattoriMasayuki Motonari
    • B01F3/12B01F7/00B01F7/30B24B37/04B24B57/02C09D17/00C09K3/14B01D24/00B01D37/00B03B1/00C04B33/00
    • B24B37/04B01F3/1221B01F3/1271B01F7/30B24B57/02C09D17/004C09K3/1463B01F2215/0031B01F2215/005B01F7/00991
    • The present invention provides aqueous dispersion slurry of inorganic particles which is so stable as not to increase in viscosity, gel or sediment even if stored for a long time and therefore can be used as raw materials for, for example, cosmetics, paint, coating materials and lapping slurry for semiconductor wafers, and production method of such aqueous dispersion slurry. The aqueous dispersion slurry according to the present invention has the number of particles whose a particle diameter of 1.3 .mu.m or more is 180,000 or less per mL in terms of 30 wt % in concentration, and the average particle diameter thereof is in a range of 0.05-0.9 .mu.m. The number of particles having aparticle diameter of 1.3 .mu.m or more is counted by using Particle Sensor KS-60, which is a light extinction type sensor for detecting particles, and Particle Counter KL-11, which is a particle counter, both of which made by the same manufacturer, Rion Electro Corp. The average particle diameter is measured by using Laser Particle Analyzer System Par-III made by Otsuka Denshi Co., Ltd.
    • 本发明提供无机颗粒的水性分散体浆料,其即使长时间贮存也非常稳定,不会增加粘度,凝胶或沉淀物,因此可用作例如化妆品,油漆,涂料的原料 和研磨用于半导体晶片的浆料,以及这种水分散浆料的制造方法。 本发明的水性分散体浆料的粒径为1.3μm以上的粒子数为30,000重量%以下,其浓度为30重量%,平均粒径为 0.05-0.9亩。 通过使用作为用于检测粒子的消光型传感器的粒子传感器KS-60和作为粒子计数器的粒子计数器KL-11,对具有1.3μm以上的粒径的粒子的数量进行计数 由同一制造商Rion Electro Corp.制造。平均粒径通过使用由Otsuka Denshi Co.,Ltd制造的激光粒子分析仪系统Par-III来测量。