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71. 发明申请

US20150346709A1 SEMICONDUCTOR PROCESS MANAGEMENT SYSTEM, SEMICONDUCTOR MANUFACTURING SYSTEM INCLUDING THE SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR 有权
标题翻译：半导体工艺管理系统，包括其的半导体制造系统以及制造半导体的方法
公开(公告)号：US20150346709A1
公开(公告)日：2015-12-03
申请号：US14718116
申请日：2015-05-21
申请人： Samsung Electronics Co., Ltd.
发明人： Dong-hoon Han , Jai-hyung Won , Do-hyung Kim , Sung-hyup Kim , Ho-jun Kim
IPC分类号： G05B19/401 , H01L21/67
CPC分类号： G05B19/41875 , G05B2219/31443 , G05B2219/45031 , G05B2219/50139 , Y02P90/20 , Y02P90/22
摘要： A semiconductor process management system is provided. The semiconductor process management system includes a communicator that receives a process recipe from one or more process apparatuses and receives a measured value for each sampling point from one or more measuring apparatus, and a first determination unit that establishes a mutual influence model between the process recipe and the measured value for each sampling point based on the process recipe and the measured value for each sampling point.
摘要翻译：提供半导体工艺管理系统。半导体处理管理系统包括从一个或多个处理装置接收处理配方并从一个或多个测量装置接收每个采样点的测量值的通信器，以及在处理配方之间建立相互影响模型的第一确定单元基于每个采样点的过程配方和测量值对每个采样点的测量值。

72. 发明申请

US20150334889A1 ELECTRONIC-COMPONENT MOUNTING SYSTEM 审中-公开
标题翻译：电子元件安装系统
公开(公告)号：US20150334889A1
公开(公告)日：2015-11-19
申请号：US14651518
申请日：2013-12-06
申请人： Panasonic Intellectual Property Management Co.,Ltd.
发明人： Ryota NISHIJIMA , Kenji OKAMOTO , Kunio YAMAMOTO , Hisashi MAEZONO
IPC分类号： H05K13/08
CPC分类号： H05K13/08 , G05B19/4183 , G05B19/41875 , G05B2219/36159 , G05B2219/40029 , H05K13/083 , Y02P90/04 , Y02P90/10 , Y02P90/18 , Y02P90/22 , Y10T29/53174
摘要： An electronic-component mounting system includes: mounting lines each including an electronic-component mounting apparatus; an operation information processor which collects operation information of the electronic-component mounting apparatus, applies a statistical process on the operation information, and produces operation quality information of the mounting lines; and a portable information terminal accessible to the operation information processor by wireless communication. An identification information transmission section which transmits identification information for identifying each of the mounting lines is disposed in each mounting line, and a reception section which receives the identification information is disposed in the portable information terminal. The portable information terminal displays on a display section thereof the operation quality information of one of the mounting lines located near the portable information terminal based on the identification information transmitted from the mounting lines.
摘要翻译：电子部件安装系统包括：各自包括电子部件安装装置的安装线; 收集电子部件安装装置的操作信息的操作信息处理器对操作信息进行统计处理，并且生成安装线的操作质量信息; 以及通过无线通信可操作信息处理器可访问的便携式信息终端。在每个安装线上设置有识别信息发送部分，用于识别每个安装线的识别信息，并且接收标识信息的接收部分设置在便携式信息终端中。便携式信息终端基于从安装线发送的识别信息，在其显示部分上显示位于便携式信息终端附近的安装线之一的操作质量信息。

73. 发明授权

US09182758B1 Computer-implemented system and method for capability zone-based manufacturing quality control 有权
标题翻译：计算机实现的基于能力区的制造质量控制系统和方法
公开(公告)号：US09182758B1
公开(公告)日：2015-11-10
申请号：US14634636
申请日：2015-02-27
申请人： Michael H S Dunlop
发明人： Michael H S Dunlop
IPC分类号： G05B19/418
CPC分类号： G05B19/41875 , G01B21/30 , G05B19/418 , G05B2219/32212 , G05B2219/32218 , G05B2219/32368 , Y02P90/02 , Y02P90/04 , Y02P90/18 , Y02P90/22
摘要： A computer-implemented system and method for capability zone-based manufacturing quality control are provided. A specification for manufacturing a part feature is obtained, the specification including a nominal and a tolerance. A plurality of measurements for the feature are obtained. A difference is determined between the nominal and each of the measurements. The difference for each of the measurements is compared to the tolerance. Each of the measurements is assigned into one of a plurality of capability zones of measurements based on the comparison. Visual representations of the capability zones into which the measurements were assigned are displayed.
摘要翻译：提供了一种基于能力区域制造质量控制的计算机实现的系统和方法。获得用于制造零件特征的规范，该规范包括标称和公差。获得该特征的多个测量。在标称值和每个测量值之间确定差异。将每个测量值的差异与公差进行比较。基于比较将每个测量值分配到多个测量能力区域中的一个。显示分配了测量值的能力区域的视觉表示。

74. 发明授权

US09175719B2 Method and device for determining center hole of crankshaft 有权
标题翻译：确定曲轴中心孔的方法和装置
公开(公告)号：US09175719B2
公开(公告)日：2015-11-03
申请号：US12993860
申请日：2009-06-25
申请人： Akihiro Yoshimoto
发明人： Akihiro Yoshimoto
IPC分类号： G01C17/38 , F16C3/08 , G01M1/10 , G01M1/24 , G05B19/401 , G05B19/4097
CPC分类号： F16C3/08 , B23P2700/07 , G01M1/10 , G01M1/24 , G05B19/401 , G05B19/4097 , G05B2219/32189 , G05B2219/37205 , Y02P90/22 , Y02P90/265
摘要： A method of determining a center hole of a material crankshaft, which is obtained through molding with first and second molds, includes: obtaining first shape data of a first portion of the material crankshaft molded by the first mold and second shape data of a second portion of the material crankshaft molded by the second mold; comparing the first and second shape data respectively with first and second designed data corresponding to the first and second molds, respectively, for computing a misalignment amount of each of the first and second portions due to misalignment between the first and second molds; adjusting, based on the misalignment amount, data corresponding to the misalignment amount to reproduce actual shape data; and determining, based on the actual shape data, a position of the center hole in the material crankshaft such that a rotation balance of the material crankshaft is within a predetermined range.
摘要翻译：一种确定通过第一和第二模具成型获得的曲轴坯料的中心孔的方法，包括：获得由第一模具模拟的曲轴的曲轴的第一部分的第一形状数据和第二部分的第二形状数据由第二模具模制的曲轴材料; 分别比较第一和第二形状数据与第一和第二模具对应的第一和第二设计数据，以计算由于第一和第二模具之间的未对准而导致的每个第一和第二部分的不对准量; 基于所述未对准量调整与所述未对准量对应的数据，以再现实际形状数据; 并且基于实际形状数据确定曲轴坯料中的中心孔的位置，使得曲轴坯料的旋转平衡在预定范围内。

75. 发明授权

US09141097B2 Adaptive and automatic determination of system parameters 有权
标题翻译：自适应和自动确定系统参数
公开(公告)号：US09141097B2
公开(公告)日：2015-09-22
申请号：US14081188
申请日：2013-11-15
申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
发明人： Po-Feng Tsai , Chia-Tong Ho , Sunny Wu , Jo Fei Wang , Jong-I Mou
IPC分类号： G06F19/00 , G05B13/02 , G05B19/418
CPC分类号： G05B13/0265 , G05B19/41875 , G05B2219/32188 , G05B2219/32189 , G05B2219/45031 , Y02P90/22 , Y02P90/86
摘要： A method of automatically determining process parameters for processing equipment includes processing at least one first substrate in the processing equipment at a first time; and processing at least one second substrate in the processing equipment at a second time. The method includes collecting data on process monitors for the at least one first substrate; and the at least one second substrate. The method includes receiving the data by a multiple-input-multiple-output (MIMO) optimization system. The method includes revising a sensitivity matrix, by a MIMO optimizer, using the data and an adaptive-learning algorithm, wherein the adaptive-learning algorithm revises the sensitivity matrix based on a learning parameter which is related to a rate of change of the processing equipment over time. The method includes determining a set of process parameters for the processing equipment by the MIMO optimizer, wherein the MIMO optimizer uses the revised sensitivity matrix to determine the process parameters.
摘要翻译：自动确定处理设备的处理参数的方法包括：在第一时间处理处理设备中的至少一个第一基板; 以及在所述处理设备中的第二时间处理至少一个第二基板。该方法包括收集关于至少一个第一衬底的过程监视器的数据; 和至少一个第二基底。该方法包括通过多输入多输出（MIMO）优化系统接收数据。该方法包括通过MIMO优化器使用数据和自适应学习算法修改灵敏度矩阵，其中自适应学习算法基于与处理设备的变化率相关的学习参数来修改灵敏度矩阵随着时间的推移。该方法包括由MIMO优化器确定处理设备的一组过程参数，其中MIMO优化器使用修正的灵敏度矩阵来确定过程参数。

76. 发明申请

US20150262894A1 STATISTICAL METHOD FOR MONITORING MANUFACTURING EQUIPMENT AND PROCESSING OPERATIONS 审中-公开
标题翻译：用于监测制造设备和处理操作的统计方法
公开(公告)号：US20150262894A1
公开(公告)日：2015-09-17
申请号：US14726915
申请日：2015-06-01
申请人： WaferTech, LLC
发明人： Liwen LU , Shih-Tzung CHANG
IPC分类号： H01L21/66
CPC分类号： H01L22/26 , G05B19/4065 , G05B19/41875 , G05B23/0237 , H01L21/32051 , H01L22/12 , H01L22/20 , Y02P90/22
摘要： A statistical process control method for monitoring and controlling semiconductor manufacturing processing operations is provided. For a chosen processing operation, multiple measurement sites are used to generate data of a measurable characteristic that is impacted by and associated with the processing operation. The data from the sites is compared over time and one or more outlier sites are identified. The outlier sites are the sites at which the data values are most divergent from the rest of the data. Algorithms are used to mathematically compare the outlier sites to the other sites to produce a comparative index. The comparative index is monitored graphically or otherwise to identify changes in the processing operation, and corrective actions are taken.
摘要翻译：提供了一种用于监视和控制半导体制造处理操作的统计过程控制方法。对于所选择的处理操作，使用多个测量站点来产生受处理操作影响并与之相关联的可测量特性的数据。随时间比较来自站点的数据，并识别一个或多个离群点。异常值站点是数据值与其余数据最不相同的站点。算法用于将离群点与其他站点进行数学比较，以生成比较索引。以图形或其他方式监测比较指标，以识别处理操作中的变化，并采取纠正措施。

77. 发明申请

US20150261906A1 QUALITY OF RESULTS SYSTEM 有权
标题翻译：成果质量体系
公开(公告)号：US20150261906A1
公开(公告)日：2015-09-17
申请号：US14645395
申请日：2015-03-11
申请人： Synopsys, Inc.
发明人： Aditya Ramachandran
IPC分类号： G06F17/50
CPC分类号： G06F17/5081 , G05B19/4188 , G05B2219/45031 , G06F17/5045 , Y02P90/22 , Y02P90/24 , Y02P90/265
摘要： Method and System for determining a next task in an Electronic Design Automation Flow, computer system and computer program product. One or more parsers configurable to identify one or more associated pre-defined data characteristics may be executed by a processor on a task output. Selected values obtained from the parser execution may be used to make a decision about the appropriate next action to be performed in the EDA flow. Selected values may provide suggestions or decisions about the appropriate next action to be performed in the EDA flow. Input for an associated task in the EDA flow may be suggested by the selected result values.
摘要翻译：用于确定电子设计自动化流程，计算机系统和计算机程序产品中的下一个任务的方法和系统。可配置为识别一个或多个相关联的预定义数据特性的一个或多个解析器可由处理器在任务输出上执行。从解析器执行获得的所选值可用于作出关于在EDA流中执行的适当的下一个动作的决定。所选值可以提供有关在EDA流程中执行的适当的下一个动作的建议或决定。 EDA流中相关任务的输入可能由选定的结果值建议。

78. 发明申请

US20150253764A1 MONITOR DATA ATTACHMENT TO PRODUCT LOTS FOR BATCH PROCESSES 有权
标题翻译：监控数据附加到批量处理的产品
公开(公告)号：US20150253764A1
公开(公告)日：2015-09-10
申请号：US14570623
申请日：2014-12-15
申请人： Texas Instruments Incorporated
发明人： DAMIEN THOMAS GILMORE , NICHOLAS ANDREW KUSEK , KENNETH RYAN THOMAS , MICHAEL GLENN WILLIAMS , ROBERT RAY SPANGLER , INGU SONG
IPC分类号： G05B19/418
CPC分类号： G05B19/41875 , G05B2219/2602 , Y02P90/22
摘要： A method of process control for a batch process includes pre-measuring a monitor lot to obtain pre-metrology data regarding at least a first process parameter. There are no product units included with the monitor lot. The pre-metrology data is saved together with an identifier for the first monitor unit. A batch is staged for the batch process including at least a first product lot including a plurality of product units together with the first monitor unit. The batch is batch processed through the batch process. After the batch processing, the first monitor unit is measured to obtain post-metrology data for the first process parameter. At least one of the post-metrology data and a difference between the post-metrology data and pre-metrology data is saved to a data file with an identifier for the first product lot or the pre-metrology data and post-metrology data is directly written to the first product lot.
摘要翻译：用于批处理过程的过程控制的方法包括预测量监视器批次以获得关于至少第一处理参数的预测量数据。显示器批次中没有产品单元。预测量数据与第一个监视器单元的标识符一起保存。批次处理的批次包括至少包括与第一监视器单元一起的多个产品单元的第一产品批次。批次通过批处理进行批处理。在批处理之后，测量第一监视器单元以获得用于第一处理参数的后计量数据。后测量数据中的至少一个和计量后数据与预测量数据之间的差异被保存到具有用于第一产品批次的标识符或预计量学数据的数据文件，并且后测量数据直接写入第一批产品。

79. 发明申请

US20150248127A1 PROCESS MANAGEMENT SYSTEMS USING COMPARISON OF STATISTICAL DATA TO PROCESS PARAMETERS AND PROCESS MANAGEMENT DEVICES 审中-公开
标题翻译：使用统计数据比较处理参数和过程管理设备的过程管理系统
公开(公告)号：US20150248127A1
公开(公告)日：2015-09-03
申请号：US14635193
申请日：2015-03-02
申请人： Samsung Electronics Co., Ltd.
发明人： Yu Sin Yang , Young Hoon Sohn , Bae Jin Lee , Sang Kil Lee , Chung Sam Jun
IPC分类号： G05B19/418
CPC分类号： G05B19/418 , G05B19/41875 , G05B2219/45031 , H01L21/3086 , H01L22/12 , H01L22/20 , Y02P90/22
摘要： A process management system can include a processing device that can be configured to perform a semiconductor process on a plurality of wafers, the processing device controlled by a process parameter. A control device can be configured to acquire statistical data relating to the process parameter and can be configured to select a reference wafer from the plurality of wafers. The control device can be configured to compare a respective process parameter used for the reference wafer with the statistical data and can be configured to set a reference condition for the process parameter.
摘要翻译：过程管理系统可以包括处理设备，其可被配置为在多个晶片上执行半导体处理，该处理设备由过程参数控制。控制装置可以被配置为获取与过程参数相关的统计数据，并且可以被配置为从多个晶片中选择参考晶片。控制装置可以被配置为将用于参考晶片的相应过程参数与统计数据进行比较，并且可以被配置为设置用于过程参数的参考条件。

80. 发明申请

US20150243108A1 PRODUCTION LINE MONITORING DEVICE 有权
标题翻译：生产线监测装置
公开(公告)号：US20150243108A1
公开(公告)日：2015-08-27
申请号：US14425424
申请日：2012-09-28
申请人： FUJI MACHINE MFG. CO., LTD.
发明人： Daisuke Nakayama
IPC分类号： G07C3/14
CPC分类号： G07C3/146 , G05B19/41875 , G05B2219/32222 , H05K13/08 , H05K13/083 , Y02P90/22
摘要： A production line monitoring device that identifies a cause of a production defect, reduces the amount of analysis data and computation, and performs real-time processing, is provided. The production line monitoring device includes a defect indication detection unit that detects an indication of a production defect of a production line, and a defect cause identification unit that identifies a cause of the production defect. The defect indication detection unit collects measurement information measured by an inspection apparatus for each reference that identifies a position on products, and detects an indication of the production defect from the change with time of the measurement information at the references. The defect cause identification unit performs stratified analysis based on production information related to the reference when the defect indication detection unit detects an indication of a production defect, and identifies a cause of a production defect from a result of the analysis.
摘要翻译：提供识别生产缺陷的原因的生产线监视装置，减少分析数据的数量和计算，并进行实时处理。生产线监视装置包括检测生产线的生产缺陷的指示的缺陷指示检测单元和识别生产缺陷的原因的缺陷原因识别单元。缺陷指示检测单元收集由检查装置测量的每个用于识别产品上的位置的参考的测量信息，并且根据参考中的测量信息随时间的变化来检测生产缺陷的指示。当缺陷指示检测单元检测到生产缺陷的指示时，缺陷原因识别单元基于与参考相关的生产信息进行分层分析，并且从分析结果中识别生产缺陷的原因。

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