专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

71. 发明授权

US07750466B2 Microelectronic assembly having second level interconnects including solder joints reinforced with crack arrester elements and method of forming same 失效
标题翻译：具有二级互连的微电子组件，其包括用裂纹避雷器元件加强的焊点以及其形成方法
公开(公告)号：US07750466B2
公开(公告)日：2010-07-06
申请号：US11852173
申请日：2007-09-07
申请人： Timothy P. Rothman , Leo J. Craft , Dong W. Kim
发明人： Timothy P. Rothman , Leo J. Craft , Dong W. Kim
IPC分类号： H01L23/485
CPC分类号： H01L23/42 , H01L23/10 , H01L23/3675 , H01L23/49816 , H01L23/562 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/01079 , H01L2924/1433 , H01L2924/15311 , H01L2924/16152 , H05K3/328 , H05K3/3436 , H05K3/4015 , H05K2201/0367 , Y02P70/613 , H01L2924/00012 , H01L2924/00
摘要： A microelectronic assembly and a method of forming the assembly. The microelectronic assembly includes a package having a package substrate having a die side and a carrier side, and substrate lands on the carrier side thereof; a microelectronic die mounted on the package substrate at the die side thereof; and an array of first level interconnects electrically coupling the die to the package substrate. The assembly further includes a carrier having a substrate side, the package being mounted on the carrier at the substrate side thereof; and an array of second level interconnects electrically coupling the package to the carrier, each of the second level interconnects including a solder joint connecting the substrate lands to the carrier lands, and a crack arrester element at least partially encompassed within the solder joint.
摘要翻译：微电子组件和组装方法。微电子组件包括具有封装基板的封装，该封装基板具有管芯侧和载体侧，并且衬底位于其载体侧上; 在其芯片侧安装在封装基板上的微电子管芯; 以及将管芯与封装衬底电耦合的第一级互连阵列。组件还包括具有衬底侧的载体，该封装在衬底侧安装在载体上; 以及将所述封装电耦合到所述载体的第二级互连阵列，所述第二级互连件中的每一个包括将所述衬底焊盘连接到所述载体焊盘的焊接接头，以及至少部分地包围在所述焊接接头内的防裂器元件。

72. 发明申请

US20090317617A1 BASE MEMBER WITH BINDING FILM, BONDING METHOD, AND BONDED STRUCTURE 审中-公开
标题翻译：具有结合膜的基座部件，接合方法和结合结构
公开(公告)号：US20090317617A1
公开(公告)日：2009-12-24
申请号：US12484316
申请日：2009-06-15
申请人： Mitsuru SATO , Takatoshi YAMAMOTO
发明人： Mitsuru SATO , Takatoshi YAMAMOTO
IPC分类号： C09J7/02 , B32B37/00
CPC分类号： H05K3/321 , B32B37/12 , B32B2309/02 , B32B2310/0472 , B32B2310/0831 , B41J2/161 , B41J2/1623 , B41J2/1631 , B41J2/1634 , B41J2/1643 , B41J2/1645 , B41J2/1646 , C09J7/20 , H05K3/4015 , H05K2203/1105 , H05K2203/121 , Y10T428/28 , Y10T428/2804
摘要： A bonding film-formed base member includes a base member and a bonding film formed by supplying a liquid material containing a metal complex on a surface of the base member and then drying and burning the liquid material. The bonding film includes a metal atom and a leaving group made of an organic component. In the bonding-film formed base member, energy is applied to at least a partial region of a surface of the bonding film to eliminate the leaving group present near the surface of the bonding film from the bonding film so as to allow the at least a partial region of the surface to have adhesion to an object intended to be bonded to the bonding film-formed base member.
摘要翻译：接合膜形成的基底构件包括基底构件和通过在基底构件的表面上供给含有金属络合物的液体材料，然后干燥和燃烧液体材料而形成的接合膜。接合膜包括金属原子和由有机组分制成的离去基团。在接合膜形成的基底部件中，能量被施加到接合膜的表面的至少一部分区域，以消除接合膜表面附近存在的离开基团，从而允许至少一个表面的局部区域具有与要接合到接合膜形成的基底构件的物体的粘合性。

73. 发明授权

US07625218B2 Electrocoated contacts compatible with surface mount technology 失效
公开(公告)号：US07625218B2
公开(公告)日：2009-12-01
申请号：US12349484
申请日：2009-01-06
申请人： Philip van Haaster
发明人： Philip van Haaster
IPC分类号： H01R12/00 , H05K1/00
CPC分类号： H01R13/035 , H05K3/341 , H05K3/4015 , H05K2201/0133 , Y10T29/49117 , Y10T29/4913 , Y10T29/49204
摘要： According to various aspects, exemplary embodiments are provided of contacts that may be compatible with surface mount technology. The contacts may be surface mountable for establishing an electrical pathway (e.g., electrical grounding contact, etc.) from at least one electrically-conductive surface on the substrate to another electrically-conductive surface (e.g., EMI shield, battery contact, etc.). In one exemplary embodiment, a contact generally includes a resilient dielectric core member. At least one outer electrically-conductive layer is electrocoated onto the resilient dielectric core member. A solderable electrically-conductive base member may be coupled to the resilient core member and/or the outer electrically-conductive layer. The base member may be in electrical contact with the outer electrically-conductive layer.

74. 发明授权

US07621044B2 Method of manufacturing a resilient contact 失效
标题翻译：制造弹性接触件的方法
公开(公告)号：US07621044B2
公开(公告)日：2009-11-24
申请号：US10971489
申请日：2004-10-22
申请人： Benjamin N. Eldridge , Gaetan L. Mathieu
发明人： Benjamin N. Eldridge , Gaetan L. Mathieu
IPC分类号： H01R43/20
CPC分类号： C25D1/10 , C23C18/1657 , C23C18/31 , C25D1/20 , G01R1/06711 , G01R1/06727 , G01R1/07342 , G01R3/00 , H05K3/32 , H05K3/321 , H05K3/326 , H05K3/341 , H05K3/4015 , H05K3/4092 , H05K3/42 , H05K2203/0726 , Y10T29/49117 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49204 , Y10T29/49208 , Y10T29/53378
摘要： Resilient spring contact structures are manufactured by plating the contact structures on a reusable mandrel, as opposed to forming the contact structures on sacrificial layers that are later etched away. In one embodiment, the mandrel includes a form or mold area that is inserted through a plated through hole in a substrate. Plating is then performed to create the spring contact on the mold area of the mandrel as well as to attach the spring contact to the substrate. In a second embodiment, the mandrel includes a form that is initially plated to form the resilient contact structure and then attached to a region of a substrate without being inserted through the substrate. Attachment in the second embodiment can be achieved during the plating process used to form the spring contact, or by using a conductive adhesive or solder either before or after releasing the spring contact from the mandrel.
摘要翻译：通过将接触结构电镀在可重复使用的心轴上来制造弹性弹性接触结构，而不是在随后蚀刻掉的牺牲层上形成接触结构。在一个实施例中，心轴包括通过衬底中的电镀通孔插入的形状或模具区域。然后进行电镀以在心轴的模具区域上产生弹簧接触以及将弹簧接触件附接到基底。在第二实施例中，心轴包括最初电镀以形成弹性接触结构然后在不插入衬底的情况下附着到衬底的区域的形式。在用于形成弹簧接触的电镀工艺期间，或者在从芯棒释放弹簧接触之前或之后使用导电粘合剂或焊料，可以实现第二实施例中的附接。

75. 发明申请

US20090250154A1 METHOD FOR BONDING METALLIC TERMINALS BY USING ELASTIC CONTACT 失效
标题翻译：使用弹性接触接触金属端子的方法
公开(公告)号：US20090250154A1
公开(公告)日：2009-10-08
申请号：US12411254
申请日：2009-03-25
申请人： Shinichi NAGANO , Shin YOSHIDA
发明人： Shinichi NAGANO , Shin YOSHIDA
IPC分类号： B29C65/06 , B32B37/06
CPC分类号： H01R43/0214 , H01L23/49811 , H01L24/12 , H01L24/16 , H01L24/81 , H01L24/83 , H01L2224/13099 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/81201 , H01L2224/81206 , H01L2224/81222 , H01L2224/81234 , H01L2224/81385 , H01L2224/81464 , H01L2224/81801 , H01L2924/00011 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01025 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/19042 , H01R13/2421 , H05K3/326 , H05K3/4015 , H05K3/42 , H05K2201/0311 , H05K2201/0367 , H05K2201/09481 , H05K2201/10265 , H05K2201/10378 , H05K2201/10734 , Y10T156/10 , H01L2924/01083 , H01L2924/00014 , H01L2224/83851 , H01L2924/00
摘要： A connection electrode that is formed of solder on an electronic component side and a tip portion of an elastic contact contact each other at a contact portion. Regarding the elastic contact, a resistive layer is formed in the tip portion, and the tip portion is placed in a clearance of an induction coil. When a predetermined high-frequency current is passed through the induction coil, electromagnetic induction causes the resistive layer to generate heat. Solder that forms the connection electrode is melt, and flows onto the tip portion of the elastic contact. Thus, the tip portion of the elastic contact and the connection electrode can be strongly bonded together at the contact portion that is a single point therebetween.
摘要翻译：由电子部件侧的焊料形成的连接电极和弹性接触的前端部在接触部分处相互接触。关于弹性接触，在前端部形成电阻层，将前端部配置在感应线圈的间隙内。当预定的高频电流通过感应线圈时，电磁感应使电阻层产生热量。形成连接电极的焊料熔化，并流到弹性接触件的前端部。因此，弹性接触件的顶端部分和连接电极可以在它们之间的单点的接触部分处牢固地结合在一起。

76. 发明申请

US20090053911A1 PRINTED BOARD WITH COMPONENT MOUNTING PIN 有权
公开(公告)号：US20090053911A1
公开(公告)日：2009-02-26
申请号：US12254608
申请日：2008-10-20
申请人： Takashi KARIYA , Toshiki Furutani , Takeshi Kawanishi
发明人： Takashi KARIYA , Toshiki Furutani , Takeshi Kawanishi
IPC分类号： H01R12/02
CPC分类号： H05K3/4015 , H01L21/4853 , H01L23/49811 , H01L24/45 , H01L24/72 , H01L24/78 , H01L24/81 , H01L24/83 , H01L24/90 , H01L2224/05568 , H01L2224/05573 , H01L2224/1134 , H01L2224/131 , H01L2224/451 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/78301 , H01L2224/786 , H01L2224/8121 , H01L2224/81815 , H01L2224/838 , H01L2224/851 , H01L2224/85205 , H01L2224/90 , H01L2924/00013 , H01L2924/00014 , H01L2924/0133 , H01L2924/014 , H01L2924/14 , H01L2924/3011 , H05K3/326 , H05K3/341 , H05K2201/10265 , H05K2201/10287 , H05K2203/049 , Y10T29/49135 , Y10T29/49142 , Y10T29/49149 , Y10T29/49153 , H01L2224/13099 , H01L2924/01029 , H01L2924/01047 , H01L2924/01079 , H01L2224/48 , H01L2924/00015 , H01L2224/05599
摘要： A printed circuit board according to the present invention is a printed circuit board (4) including a component mounting pin (1) made of a metal wire to connect with a semiconductor chip (10). The semiconductor chip (10) is a surface mounting type semiconductor chip having an electrode pad on its mounting surface for use in a flip-chip mounting system. The component mounting pin (1) is formed by using wire-bonding technology. This printed circuit board (4) is able to decrease malconnections or disconnection caused by a difference between the coefficients of thermal expansion of the semiconductor chip (10) and the printed circuit board (4).

77. 发明授权

US07427558B2 Method of forming solder ball, and fabricating method and structure of semiconductor package using the same 有权
标题翻译：形成焊球的方法，以及使用其制造半导体封装的方法和结构
公开(公告)号：US07427558B2
公开(公告)日：2008-09-23
申请号：US11070212
申请日：2005-03-03
申请人： Jae-Hong Kim , Heui-Seog Kim , Wha-Su Sin , Jong-Keun Jeon
发明人： Jae-Hong Kim , Heui-Seog Kim , Wha-Su Sin , Jong-Keun Jeon
IPC分类号： H01L21/44
CPC分类号： H01L23/3128 , H01L21/4867 , H01L21/563 , H01L23/3114 , H01L23/49816 , H01L24/45 , H01L24/48 , H01L25/0657 , H01L2224/1134 , H01L2224/131 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/45015 , H01L2224/451 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73203 , H01L2224/73204 , H01L2225/0651 , H01L2225/06568 , H01L2924/00011 , H01L2924/00013 , H01L2924/00014 , H01L2924/01029 , H01L2924/01079 , H01L2924/01327 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H05K3/3484 , H05K3/4015 , H05K2201/0367 , H05K2201/10734 , H05K2203/043 , H05K2203/049 , H01L2224/13099 , H01L2924/00012 , H01L2924/00 , H01L2924/20752 , H01L2924/20755 , H01L2924/2075 , H01L2924/20754 , H01L2224/0401
摘要： A method of forming solder balls may involve forming bumps through wire boding on land patterns of a circuit substrate. Solder cream may be applied to the bumps through screen printing. The solder cream may be melted via reflow to form solder balls in which the bumps are embedded.
摘要翻译：形成焊球的方法可以包括通过在电路基板的焊盘图案上的导线形成来形成凸块。焊膏可以通过丝网印刷施加到凸块上。焊膏可以通过回流熔化以形成其中嵌入凸块的焊球。

78. 发明申请

US20080171450A1 Wafer Bump Manufacturing Using Conductive Ink 审中-公开
标题翻译：使用导电油墨制造晶圆凸块
公开(公告)号：US20080171450A1
公开(公告)日：2008-07-17
申请号：US11622770
申请日：2007-01-12
申请人： Petri Molkkari , Pauliina Mansikkamaki , Matti Mantysalo , Jani Miettinen , Jani Valtanen
发明人： Petri Molkkari , Pauliina Mansikkamaki , Matti Mantysalo , Jani Miettinen , Jani Valtanen
IPC分类号： H01R12/00
CPC分类号： H01L21/4867 , C09D11/30 , C09D11/52 , H01L23/49816 , H01L2924/0002 , H05K3/321 , H05K3/4015 , H05K2201/10234 , H05K2203/013 , Y10T156/10 , H01L2924/00
摘要： The invention is related to a method of manufacturing connection bumps on substrates, and in particular to a connection bump formed by depositing conductive ink and placing a conductive element on top of the ink. The final connection bump is formed by curing the conductive ink, thus providing a conductive attachment of the conductive element to a substrate surface. Ink-jet printing may be used for depositing ink on the surface.
摘要翻译：本发明涉及一种在衬底上制造连接凸块的方法，特别涉及通过沉积导电油墨并将导电元件放置在油墨顶部而形成的连接凸块。通过固化导电油墨形成最终的连接凸块，从而提供导电元件到基底表面的导电附着。喷墨打印可以用于在表面上沉积墨。

79. 发明申请

US20080166927A1 ELECTROCOATED CONTACTS COMPATIBLE WITH SURFACE MOUNT TECHNOLOGY 失效
标题翻译：电动接触器与表面安装技术兼容
公开(公告)号：US20080166927A1
公开(公告)日：2008-07-10
申请号：US11757819
申请日：2007-06-04
申请人： Philip van Haaster
发明人： Philip van Haaster
IPC分类号： H01R13/405
CPC分类号： H01R13/035 , H05K3/341 , H05K3/4015 , H05K2201/0133 , Y10T29/49117 , Y10T29/4913 , Y10T29/49204
摘要： According to various aspects, exemplary embodiments are provided of contacts that may be compatible with surface mount technology. The contacts may be surface mountable for establishing an electrical pathway (e.g., electrical grounding contact, etc.) from at least one electrically-conductive surface on the substrate to another electrically-conductive surface (e.g., EMI shield, battery contact, etc.). In one exemplary embodiment, a contact generally includes a resilient dielectric core member. At least one outer electrically-conductive layer is electrocoated onto the resilient dielectric core member. A solderable electrically-conductive base member may be coupled to the resilient core member and/or the outer electrically-conductive layer. The base member may be in electrical contact with the outer electrically-conductive layer.
摘要翻译：根据各个方面，提供了可与表面贴装技术兼容的触点的示例性实施例。触点可以是表面安装的，用于建立从基板上的至少一个导电表面到另一个导电表面（例如，EMI屏蔽，电池触点等）的电路径（例如，电接地触点等）。在一个示例性实施例中，触头通常包括弹性介电芯构件。至少一个外部导电层被电涂覆到弹性介电芯体上。可焊接的导电基底构件可以连接到弹性芯构件和/或外部导电层。基底构件可以与外部导电层电接触。

80. 发明授权

US07353600B2 Circuit board fabrication method and circuit board 失效
标题翻译：电路板制造方法和电路板
公开(公告)号：US07353600B2
公开(公告)日：2008-04-08
申请号：US10940933
申请日：2004-09-15
申请人： Norihito Tsukahara , Kazuhiro Nishikawa , Daisuke Sakurai
发明人： Norihito Tsukahara , Kazuhiro Nishikawa , Daisuke Sakurai
IPC分类号： H05K3/00 , H05K3/12
CPC分类号： H05K3/005 , H05K3/0011 , H05K3/4015 , H05K3/4644 , H05K2201/0108 , H05K2201/083 , H05K2201/10242 , H05K2203/0108 , H05K2203/104 , H05K2203/1189 , H05K2203/308 , Y10T29/49147 , Y10T29/49155 , Y10T29/49162 , Y10T29/49165
摘要： A circuit board fabrication method including: forming first conductive interconnection 2 onto insulator substrate 1; applying resin film 41, which is to be interlevel insulator layer 42 for electrically insulating first conductive interconnection 2 and second conductive interconnection 6, onto insulator substrate 1; either making pillar-like member 3 stand on a prescribed position on first conductive interconnection 2 before applying resin film 41, or press fitting pillar-like member 3 into resin film 41 so as to reach either a surface vicinity of first conductive interconnection 2 or a portion of first conductive interconnection 2 after applying resin film 41; hardening resin film 41 to form interlevel insulator layer 42; pulling out pillar-like member 3 to form opening 5 in interlevel insulator layer 42; and forming second conductive interconnection 6 onto interlevel insulator layer 42 to include opening 5.
摘要翻译：一种电路板制造方法，包括：在绝缘体基板1上形成第一导电布线2; 将用于将第一导电互连2和第二导电互连6电绝缘的层间绝缘体层42的树脂膜41施加到绝缘体基板1上; 在施加树脂膜41之前，使柱状构件3立在第一导电布线2的规定位置上，或者将柱状构件3压入树脂膜41中，以到达第一导电布线2的附近或第在施加树脂膜41之后的第一导电互连2的部分; 硬化树脂膜41以形成层间绝缘体层42; 拉出柱状构件3以在层间绝缘体层42中形成开口5; 以及在层间绝缘体层42上形成第二导电布线6以包括开口5。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式