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71. 发明申请

US20140240938A1 CARRIER-LESS SILICON INTERPOSER 有权
标题翻译：无载体硅介质
公开(公告)号：US20140240938A1
公开(公告)日：2014-08-28
申请号：US13776035
申请日：2013-02-25
申请人： INVENSAS CORPORATION
发明人： Michael Newman , Cyprian Emeka Uzoh , Charles G. Woychik , Pezhman Monadgemi , Terrence Caskey
IPC分类号： H05K1/11 , H05K3/40
CPC分类号： H01L21/486 , H01L23/147 , H01L23/49827 , H01L2224/13 , H01L2224/16225 , H05K1/111 , H05K3/0014 , H05K3/4038 , Y10T29/49117
摘要： An interposer can have conductive elements at a first side and terminals at a second side opposite therefrom, for connecting with a microelectronic element and a second component, respectively. The component can include a first element having a thermal expansion coefficient less than 10 ppm/° C., and an insulating second element, with a plurality of openings extending from the second side through the second element towards the first element. Conductive structure extending through the openings in the second element and through the first element electrically connects the terminals with the conductive elements.
摘要翻译：插入件可以在第一侧具有导电元件，并且在与其相对的第二侧具有端子，用于分别与微电子元件和第二元件连接。该组件可以包括具有小于10ppm /℃的热膨胀系数的第一元件和绝缘的第二元件，其中多个开口从第二侧延伸穿过第二元件朝向第一元件。延伸穿过第二元件中的开口并通过第一元件的导电结构将端子与导电元件电连接。

72. 发明申请

US20140196944A1 METHOD FOR PRODUCING A RECEPTACLE FOR A SENSOR ELEMENT 有权
标题翻译：用于生产传感器元件的接收器的方法
公开(公告)号：US20140196944A1
公开(公告)日：2014-07-17
申请号：US14151907
申请日：2014-01-10
申请人： Robert Bosch GmbH
发明人： Thomas Loibl , Imke Heeren
IPC分类号： H05K3/00 , G01R1/04
CPC分类号： H05K3/0014 , G01R1/04 , H05K1/0306 , H05K3/10
摘要： A method for producing a receptacle for a sensor element, such as a combustion chamber pressure sensor, includes introducing a first amount of a pre-ceramic substance into an injection mold, forming a base layer of the receptacle by molding the pre-ceramic substance in the mold, and applying at least one conductor track to the base layer. A further amount of a pre-ceramic substance is introduced into the mold onto at least a partial region of the conductor track. A top region of the receptacle is formed directly on the base layer while at least partially covering over the conductor track by molding the further pre-ceramic substance in the injection mold. The method also includes debinding and sintering the molded body. The method forms a receptacle for a sensor element that has conductor tracks lying on the inside and incorporated in a gas-tight manner in a ceramic body.
摘要翻译：一种用于生产用于诸如燃烧室压力传感器的传感器元件的容器的方法，包括将第一量的预陶瓷物质引入注射模具中，通过将预陶瓷物质模制成型而形成容器的基层模具，以及将至少一个导体轨道施加到基底层。将另外量的预陶瓷物质引入到导体轨道的至少一部分区域上。容器的顶部区域直接形成在基底层上，同时通过在注射模具中模制另外的预陶瓷物质，至少部分地覆盖在导体轨道上。该方法还包括脱模和烧结成型体。该方法形成用于传感器元件的容器，其具有位于内部的导体轨道并且以气密方式并入陶瓷体中。

73. 发明授权

US08742530B2 Conduction element, manufacturing method thereof, wiring element, information input device, display device, and electronic apparatus 有权
标题翻译：导电元件及其制造方法，布线元件，信息输入装置，显示装置和电子装置
公开(公告)号：US08742530B2
公开(公告)日：2014-06-03
申请号：US13362397
申请日：2012-01-31
申请人： Shunichi Kajiya , Kazuya Hayashibe
发明人： Shunichi Kajiya , Kazuya Hayashibe
IPC分类号： H01L31/00 , H01L21/00
CPC分类号： H05K3/0014 , G02F1/134336 , G02F1/13439 , H05K3/06 , H05K2201/0317 , H05K2201/0326 , H05K2203/0143
摘要： A conduction element includes a substrate which has a first wave surface and a second wave surface, and a laminate film which is formed on the first wave surface and where two or more layers are laminated, where the laminate film forms a conduction pattern, and the first wave surface and the second wave surface satisfy a relationship below. 0≦(Am1/λm1)
摘要翻译：导电元件包括具有第一波面和第二波面的基板，以及形成在第一波面上并层叠有两层以上层叠膜的层压膜，其中层压膜形成导电图案，第一波面和第二波面满足以下关系。 0＆nlE;（Am1 /λm1）<（Am2 /λm2）＆nlE; 1.8（这里，Am1：第一波面的振动的平均宽度，Am2：第二波面的振动的平均宽度，λm1：第一波面的平均波长波面，λm2：第二波面的平均波长）。

74. 发明授权

US08698003B2 Method of producing circuit board, and circuit board obtained using the manufacturing method 有权
标题翻译：制造电路板的方法和使用该制造方法获得的电路板
公开(公告)号：US08698003B2
公开(公告)日：2014-04-15
申请号：US13131402
申请日：2009-11-30
申请人： Shingo Yoshioka , Hiroaki Fujiwara
发明人： Shingo Yoshioka , Hiroaki Fujiwara
IPC分类号： H05K1/03
CPC分类号： H05K3/184 , H05K1/0284 , H05K3/0014 , H05K3/0032 , H05K3/107 , H05K2201/0133 , H05K2201/09736 , H05K2203/0108 , H05K2203/0264 , H05K2203/0565 , H05K2203/0769
摘要： One aspect of the present invention resides in a method of producing a circuit board, including a film-forming step of forming a resin film on a surface of an insulative substrate; a circuit pattern-forming step of forming a circuit pattern portion by forming a recessed portion having a depth equal to or greater than a thickness of the resin film, with an outer surface of the resin film serving as a reference; a catalyst-depositing step of depositing a plating catalyst or a precursor thereof on a surface of the circuit pattern portion and a surface of the resin film; a film-separating step of removing the resin film from the insulative substrate; and a plating step of forming an electroless plating film only in a region where the plating catalyst or the precursor thereof remains after the resin film is separated.
摘要翻译：本发明的一个方面在于一种制造电路板的方法，包括在绝缘基板的表面上形成树脂膜的成膜步骤; 电路图案形成步骤，通过形成具有等于或大于树脂膜的厚度的深度的凹部，以树脂膜的外表面作为基准来形成电路图案部分; 在电路图形部分的表面和树脂膜的表面上沉积电镀催化剂或其前体的催化剂沉积步骤; 从所述绝缘性基板除去所述树脂膜的膜分离工序; 以及仅在树脂膜分离后在电镀催化剂或其前体残留的区域中形成无电解镀膜的电镀工序。

75. 发明申请

US20140087063A1 METHOD FOR MANUFACTURING ION OPTICAL DEVICE 有权
标题翻译：制造离子光学器件的方法
公开(公告)号：US20140087063A1
公开(公告)日：2014-03-27
申请号：US14094132
申请日：2013-12-02
申请人： SHIMADZU RESEARCH LABORATORY (SHANGHAI) CO. LTD.
发明人： Hui Mu , Gongyu Jiang , Li Ding , Jianliang Li , Wenjian Sun
IPC分类号： H05K3/10
CPC分类号： H05K3/107 , B05D3/002 , B05D5/12 , C23C14/0021 , C23C14/046 , C23C14/34 , C23C18/1806 , H01J37/04 , H01J49/063 , H01J49/421 , H05K1/119 , H05K3/0014 , H05K3/14
摘要： The present invention provides a method for preparing an ion optical device. A substrate is fabricated with a hard material adapted for a grinding process, the substrate at least including a planar surface, and including at least one insulating material layer. Next, one or more linear grooves are cut on the planar surface, to form multiple discrete ion optical electrode regions on the planar surface separated by the linear grooves. Then, conductive leads are fabricated on other substrate surfaces than the planar surface and in a through hole inside the substrate, to provide voltages required on ion optical electrodes. By using high-hardness materials in cooperation with high-precision machining, higher precision and a desired discrete electrode contour can be obtained.
摘要翻译：本发明提供了一种离子光学器件的制备方法。用适于磨削工艺的硬质材料制造衬底，所述衬底至少包括平坦表面，并且包括至少一个绝缘材料层。接下来，在平坦表面上切割一个或多个线性沟槽，以在由线性沟槽分隔开的平面上形成多个离散的离子光电极区域。然后，在平坦表面和衬底内的通孔中的其它衬底表面上制造导电引线，以提供离子光电电极所需的电压。通过与高精度加工配合使用高硬度材料，可以获得更高精度和期望的分立电极轮廓。

76. 发明授权

US08603574B2 Curved touch sensor 有权
标题翻译：弯曲触摸传感器
公开(公告)号：US08603574B2
公开(公告)日：2013-12-10
申请号：US12940544
申请日：2010-11-05
申请人： Lili Huang , Seung Jae Hong , John Z. Zhong
发明人： Lili Huang , Seung Jae Hong , John Z. Zhong
IPC分类号： H05K3/00
CPC分类号： G06F3/044 , G06F2203/04103 , H05K1/028 , H05K3/0014 , H05K2201/057
摘要： A method of forming a curved touch surface is disclosed. The method can include depositing and patterning a conductive thin film on a flexible substrate to form at least one touch sensor pattern, while the flexible substrate is in a flat state. According to certain embodiments, the method can include supporting the flexible substrate in the flat state on at least one curved forming substrate having a predetermined curvature; and performing an anneal process, or an anneal-like high-heat process, on the conductive thin film, wherein the anneal process can cause the flexible substrate to conform to the predetermined curvature of the at least one curved forming substrate. According to an embodiment, the curved forming substrate can include a first forming substrate having a first predetermined curvature and a second forming substrate having a second predetermined curvature complementing the first predetermined curvature.
摘要翻译：公开了一种形成弯曲的触摸表面的方法。该方法可以包括在柔性基板上沉积和图案化导电薄膜以形成至少一个触摸传感器图案，同时柔性基板处于平坦状态。根据某些实施例，该方法可以包括在至少一个具有预定曲率的弯曲成形衬底上支撑处于平坦状态的柔性衬底; 以及对所述导电薄膜进行退火处理或类似于退火的高热处理，其中所述退火工艺可使所述柔性衬底符合所述至少一个弯曲成形衬底的预定曲率。根据实施例，弯曲成形基板可以包括具有第一预定曲率的第一成形基板和具有补充第一预定曲率的第二预定曲率的第二成形基板。

77. 发明授权

US08569080B2 Method for packaging light emitting diode 有权
标题翻译：封装发光二极管的方法
公开(公告)号：US08569080B2
公开(公告)日：2013-10-29
申请号：US13523878
申请日：2012-06-14
申请人： Li-Hsiang Chen , Hsin-Chiang Lin , Pin-Chuan Chen
发明人： Li-Hsiang Chen , Hsin-Chiang Lin , Pin-Chuan Chen
IPC分类号： H01L21/00
CPC分类号： H01L33/642 , H01L33/62 , H01L2224/48091 , H05K1/189 , H05K3/0014 , H05K2201/09036 , H05K2201/10106 , H05K2203/0278 , H01L2924/00014
摘要： A method of packaging a light emitting diode comprising: providing a flexible substrate with a heat-conducting layer, an insulating layer covering on a surface of the heat-conducting layer and an electrically conductive layer positioned on the insulating layer; etching the conductive layer to form a gap in the conductive layer and expose a part of the insulating layer, the conductive layer being separated by the gap into a first electrode and a second electrode isolated from each other; stamping the flexible substrate with a mold at the position of the gap to form a recess in the flexible substrate; positioning a light emitting element on the conductive layer and electrically connecting the light emitting element to the conductive layer; and forming an encapsulation to cover the light emitting element.
摘要翻译：一种封装发光二极管的方法，包括：提供具有导热层的柔性衬底，覆盖在导热层的表面上的绝缘层和位于绝缘层上的导电层; 蚀刻所述导电层以在所述导电层中形成间隙并暴露所述绝缘层的一部分，所述导电层被所述间隙分隔成彼此隔离的第一电极和第二电极; 在间隙的位置用模具冲压柔性基板以在柔性基板中形成凹部; 将发光元件定位在所述导电层上并将所述发光元件电连接到所述导电层; 并形成封装以覆盖发光元件。

78. 发明申请

US20130277100A1 TOUCH PANEL AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：触控面板及其制造方法
公开(公告)号：US20130277100A1
公开(公告)日：2013-10-24
申请号：US13532454
申请日：2012-06-25
申请人： Seung Hyun Ra , Jin Uk Lee
发明人： Seung Hyun Ra , Jin Uk Lee
IPC分类号： H05K1/00 , H05K3/06 , H05K3/10
CPC分类号： H05K3/0014 , G06F3/044 , G06F3/045 , G06F2203/04103 , H05K3/06 , H05K3/1275 , H05K2201/0108
摘要： Disclosed herein are a touch panel and a method of manufacturing the same. The touch panel includes a transparent substrate, an insulating layer that is formed on the transparent substrate and has an intaglio portion formed thereon, an electrode layer that is embedded in the intaglio portion, and a light absorbing layer that is formed in an inner wall of the intaglio portion to be interposed between the inner wall of the intaglio portion and the electrode layer. In the touch panel, the electrode layer is formed to be embedded, and the light absorbing layer is further included, thereby durability and visibility of the touch panel.
摘要翻译：这里公开了触摸面板及其制造方法。触摸面板包括透明基板，形成在透明基板上并具有凹版部分的绝缘层，嵌入凹版部分中的电极层和形成在凹版部分的内壁中的光吸收层凹版部分被插入在凹版部分的内壁和电极层之间。在触摸面板中，电极层被形成为嵌入，并且还包括光吸收层，从而使触摸面板的耐久性和可视性。

79. 发明申请

US20130243655A1 Flexible IC/microfluidic integration and packaging 有权
公开(公告)号：US20130243655A1
公开(公告)日：2013-09-19
申请号：US13715110
申请日：2012-12-14
申请人： Zhenyu LI , Mona E. ZAGHLOUL , Bowei ZHANG , Can E. KORMAN
发明人： Zhenyu LI , Mona E. ZAGHLOUL , Bowei ZHANG , Can E. KORMAN
IPC分类号： G01N33/50 , H05K3/00
CPC分类号： G01N33/50 , B01L3/502707 , B01L3/502715 , B01L2200/12 , B01L2300/0663 , B01L2300/0816 , B01L2300/0848 , B81C1/0023 , G01N33/49 , H01L23/49822 , H01L2224/12105 , H05K3/0014 , H05K3/4038 , Y10T29/49155
摘要： A flexible IC/microfluidic hybrid integration and packaging method and resulting device. A single flexible elastomer substrate, such as polydimethylsiloxane (PDMS), has dedicated microchannels filled with liquid metals (or low melting point solders) to provide electrical interconnects to a solid-state IC die, such as CMOS, and additional microchannels for hybrid integration with microfluidics without performing any post-processing on the IC die. The liquid metal used can be a gallium-indium-tin eutectic alloy (also called Galinstan).

80. 发明申请

US20130187182A1 WIRING SUBSTRATE, LIGHT EMITTING DEVICE, AND MANUFACTURING METHOD OF WIRING SUBSTRATE 有权
标题翻译：接线基板，发光装置及布线基板的制造方法
公开(公告)号：US20130187182A1
公开(公告)日：2013-07-25
申请号：US13749096
申请日：2013-01-24
申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
发明人： Shigetsugu MURAMATSU , Hiroshi SHIMIZU , Kazutaka KOBAYASHI
IPC分类号： H01L33/60 , H05K3/10
CPC分类号： H01L33/60 , H01L25/0753 , H01L2224/13 , H01L2924/0002 , H05K1/0274 , H05K3/0014 , H05K3/0061 , H05K3/10 , H05K3/205 , H05K2201/0195 , H05K2201/0376 , H05K2201/09409 , H05K2201/10106 , H05K2201/2054 , Y10T29/49155 , H01L2924/00
摘要： There is provided a wiring substrate. The wiring substrate includes: a heat sink; an insulating member on the heat sink; a wiring pattern embedded in the insulating member and including a first surface and a second surface opposite to the first surface, the second surface contacting the insulating member; and a metal layer on the first surface of the wiring pattern, wherein an exposed surface of the metal layer is flush with an exposed surface of the insulating member.
摘要翻译：提供了布线基板。布线基板包括：散热器; 散热器上的绝缘构件; 布线图案，其嵌入在所述绝缘构件中并且包括与所述第一表面相对的第一表面和第二表面，所述第二表面接触所述绝缘构件; 以及在所述布线图案的第一表面上的金属层，其中所述金属层的暴露表面与所述绝缘构件的暴露表面齐平。

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