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71. 发明申请

US20050167404A1 Semiconductor manufacturing device 有权
标题翻译：半导体制造装置
公开(公告)号：US20050167404A1
公开(公告)日：2005-08-04
申请号：US10772267
申请日：2004-02-06
申请人： Shunpei Yamazaki
发明人： Shunpei Yamazaki
IPC分类号： H01L21/00 , B23K9/00
CPC分类号： H01L21/6715 , H01L21/67028 , H01L21/67069 , H01L21/6708 , H01L21/67155 , H01L21/67173 , H01L21/67253
摘要： Reduction in a space of a manufacturing line, improvement of efficiency, improvement of utilization efficiency of materials, additionally, reduction in the manufacturing cost is realized by applying a means for describing a wiring pattern or a resist pattern directly on a substrate, a means for locally performing a vapor phase process such as film formation or etching under atmospheric pressure or adjacent to atmospheric pressure.
摘要翻译：减少制造线的空间，提高效率，提高材料的利用效率，另外降低制造成本通过在基板上直接施加用于描述布线图案或抗蚀剂图案的装置来实现，在大气压下或邻近大气压下局部进行成膜或蚀刻等气相工艺。

72. 发明申请

US20050160705A1 Station for controlling and purging a mini-environment 失效
标题翻译：控制和清除迷你环境的站
公开(公告)号：US20050160705A1
公开(公告)日：2005-07-28
申请号：US11035996
申请日：2005-01-18
申请人： Roland Bernard , Hisanori Kambara , Arnaud Faver
发明人： Roland Bernard , Hisanori Kambara , Arnaud Faver
IPC分类号： B65G49/00 , B65D81/20 , B65G49/07 , H01L21/00 , H01L21/02 , H01L21/673 , H01L21/677 , B01D50/00
CPC分类号： H01L21/67155 , H01L21/67017
摘要： In a device of the invention, an SMIF type mini-environment (1) can be connected onto a purge station (2). The purge station comprises a leaktight purge compartment (2b) whose top face includes a closable transfer passage (2c) facing the bottom face (1b) of the mini-environment pod (1). An elevator (4) is suitable for vertically displacing the bottom wall (1b) of the mini-environment pod (1) when coupled thereto, simultaneously moving the stack (3) of substrate wafers carried by the bottom wall (1c) so as to introduce them together into the leaktight purge compartment (2b). The stack (3) of substrate wafers is then purged inside a leaktight purge compartment (2b) of the purge station (2), while simultaneously purging the mini-environment pod (1). This provides purging that is much more effective and much faster, thus encouraging the use of SMIF mini-environment pods in microelectronic processes.
摘要翻译：在本发明的装置中，SMIF型微型环境（1）可以连接到清洗站（2）上。吹扫站包括一个泄漏净化室（2b），其顶面包括面向迷你环境舱（1）的底面（1b）的可关闭的传送通道（2c）。升降机（4）适于垂直移动迷你环境吊舱（1）的底壁（1b），当耦合到其上时，同时移动由底壁（1c）承载的衬底晶片的堆叠（3），从而将它们一起引入密封的净化室（2b）中。然后将衬底晶片的堆叠（3）清洗在吹扫站（2）的泄漏净化隔室（2b）内，同时净化迷你环境容器（1）。这提供了更有效和更快的清洗，从而鼓励在微电子工艺中使用SMIF微型环境荚。

73. 发明申请

US20050145335A1 Installation for the vacuum treatment in particular of substrates 有权
标题翻译：安装真空处理，特别是底物
公开(公告)号：US20050145335A1
公开(公告)日：2005-07-07
申请号：US11044253
申请日：2005-01-27
申请人： Gilles Fourezon , Jean-Marc Poirson
发明人： Gilles Fourezon , Jean-Marc Poirson
IPC分类号： C23C14/56 , H01L21/00 , H01L21/677 , C23F1/00 , C23C16/00
CPC分类号： H01L21/67173 , C23C14/568 , H01L21/67155 , H01L21/67236 , H01L21/677 , H01L21/67706 , H01L21/6776
摘要： Installation for vacuum treatment, particularly of substrates, includes several identical independent and aligned modules. Each module is provided with a vacuum treatment chamber and a transfer chamber having a mechanism for transferring a substrate within one of the different chambers or from one chamber to another, the second chamber being located downstream or upstream from, directly next to, or separated by at least one module from the first chamber. A substrate can be transferred into one chamber in order to undergo a treatment while another substrate is placed in a different chamber for a specific treatment.
摘要翻译：用于真空处理，特别是基板的安装包括几个相同的独立和对准的模块。每个模块设置有真空处理室和传送室，其具有用于将衬底转移到不同腔室之一或从一个腔室到另一个腔室的机构，第二腔室位于下游或上游，直接邻近或分隔开至少一个来自第一室的模块。衬底可以转移到一个室中以进行处理，而将另一个衬底放置在不同的室中用于特定处理。

74. 发明授权

US06915179B2 PIPE STRUCTURE, ALIGNMENT APPARATUS, ELECTRON BEAM LITHOGRAPHY APPARATUS, EXPOSURE APPARATUS, EXPOSURE APPARATUS MAINTENANCE METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND SEMICONDUCTOR MANUFACTURING FACTORY 失效
标题翻译：管道结构，对准装置，电子束光刻装置，曝光装置，曝光装置维护方法，半导体装置制造方法和半导体制造厂
公开(公告)号：US06915179B2
公开(公告)日：2005-07-05
申请号：US09833766
申请日：2001-04-13
申请人： Keiji Emoto
发明人： Keiji Emoto
IPC分类号： G12B5/00 , F16L9/18 , F16L9/19 , G03F7/20 , H01J37/18 , H01J37/20 , H01J37/305 , H01L21/00 , H01L21/02 , H01L21/027 , F16L11/20
CPC分类号： H01L21/67017 , B82Y10/00 , B82Y40/00 , F16L9/18 , F16L9/19 , G03F7/70716 , G03F7/70875 , G03F7/70991 , H01J37/20 , H01J37/3174 , H01L21/67155 , H01L21/67242 , Y10T29/41
摘要： A pipe structure includes a double pipe having a resin inner pipe and a resin outer pipe covering an outside of the inner pipe, and a discharge mechanism for discharging fluid in a space between the inner pipe and the outer pipe. The double pipe is used in a vacuum chamber having a vacuum atmosphere.
摘要翻译：管结构包括具有树脂内管和覆盖在内管外部的树脂外管的双管，以及用于在内管和外管之间的空间中排出流体的排出机构。双管用于具有真空气氛的真空室中。

75. 发明授权

US06863590B2 Wafer planarization apparatus 失效
标题翻译：晶圆平面化装置
公开(公告)号：US06863590B2
公开(公告)日：2005-03-08
申请号：US10147803
申请日：2002-05-20
申请人： Kazuo Kobayashi
发明人： Kazuo Kobayashi
IPC分类号： B24B49/02 , B24B7/00 , B24B7/04 , B24B7/10 , B24B37/04 , H01L21/00 , H01L21/302 , H01L21/304 , H01L21/66 , H01L21/683 , B24B49/00 , B24B51/00
CPC分类号： B24B37/345 , B24B49/00 , H01L21/67132 , H01L21/67155 , H01L21/67271
摘要： The wafer planarization apparatus comprises a processing part which holds a wafer through a protective sheet adhering to the obverse of the wafer and processes the reverse of the wafer, an inspecting device which inspects the wafer having been processed by the processing part, a frame adhering part which adheres a frame through a sheet to the reverse of the wafer having been inspected by the inspecting device, a peeling part which peels the protective sheet from the wafer to which the frame has been adhered, and a transporting device which transports the wafer between the processing part, the inspecting device, the frame adhering part, and the peeling part, so that the series of processing for the wafer can be systematized in line.
摘要翻译：晶片平面化装置包括：处理部，其通过粘附在晶片正面的保护片保持晶片，并处理晶片反面;检查装置，其检查经处理部处理的晶片;框架粘贴部其通过片材将框架粘贴到被检查装置检查的晶片的背面;剥离部，其将保护片从已经粘附有框架的晶片剥离;以及传送装置，其将晶片在处理部分，检查装置，框架粘附部分和剥离部分，使得可以将一系列用于晶片的处理系统化。

76. 发明申请

US20050009237A1 Method of manufacturing semiconductor device and semiconductor device manufacturing apparatus used in it 有权
标题翻译：其中使用的半导体器件和半导体器件制造装置的制造方法
公开(公告)号：US20050009237A1
公开(公告)日：2005-01-13
申请号：US10878464
申请日：2004-06-29
申请人： Yoshihiko Yamaguchi
发明人： Yoshihiko Yamaguchi
IPC分类号： H01L21/78 , H01L21/00 , H01L21/301 , H01L21/48 , H01L21/56 , H01L21/68 , H01L23/31 , H01L25/065 , H01L21/76
CPC分类号： H01L21/561 , H01L21/481 , H01L21/4853 , H01L21/565 , H01L21/67092 , H01L21/67155 , H01L21/681 , H01L23/3128 , H01L24/45 , H01L24/48 , H01L24/97 , H01L25/0657 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/92247 , H01L2224/97 , H01L2225/0651 , H01L2225/06568 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2224/85 , H01L2224/83 , H01L2224/05599 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device manufacturing apparatus includes a pre-alignment section having a pre-alignment camera which is adapted to recognize marks formed on a multi-arrayed substrate, a dicing section which dices the substrate with a cutting blade in accordance with information resulting from image recognition of the marks by the pre-alignment section, and an xy table which carries the substrate. The pre-alignment section recognizes in advance all marks on the substrate based on image recognition thereby to determine the dicing positions, and the dicing section merely recognizes a few points of the substrate with an alignment camera. Consequently, pre-alignment and dicing can take place concurrently, and the throughput of the dicing process can be improved.
摘要翻译：一种半导体器件制造装置，包括具有预定位相机的预对准部分，其适于识别形成在多阵列基板上的标记，切割部分根据图像识别产生的信息用切割刀片切割基板通过预对准部分的标记以及承载基板的xy台。预对准部分基于图像识别预先识别基板上的所有标记，从而确定切割位置，并且切割部分仅利用对准相机识别基板的几个点。因此，可以同时进行预对准和切割，并且可以提高切割处理的生产量。

77. 发明授权

US06756241B2 Method of manufacturing semiconductor device and system for manufacturing the same 失效
标题翻译：制造半导体器件的方法及其制造方法
公开(公告)号：US06756241B2
公开(公告)日：2004-06-29
申请号：US10026551
申请日：2001-12-27
申请人： Tomohiro Hosokawa , Satoshi Shimizu
发明人： Tomohiro Hosokawa , Satoshi Shimizu
IPC分类号： H01L2100
CPC分类号： H01L21/67253 , H01L21/67155 , H01L22/20 , Y10T29/41
摘要： A manufacturing method of a semiconductor device to perform processing, including pre-processing and post-processing, on a semiconductor substrate, a characteristic of the processed semiconductor substrate is inspected, whether the semiconductor substrate complies with a predetermined standard is judged, and a semiconductor substrate not complying with the standard is re-processed so that the semiconductor substrate complies with the standard.
摘要翻译：检查在半导体基板上进行包括预处理和后处理的处理的半导体器件的制造方法，判断半导体衬底是否符合预定标准，并且半导体不符合标准的衬底被重新处理，使得半导体衬底符合标准。

78. 发明授权

US06673126B2 Multiple chamber fabrication equipment for thin film transistors in a display or electronic device 有权
标题翻译：用于显示器或电子设备中的薄膜晶体管的多腔室制造设备
公开(公告)号：US06673126B2
公开(公告)日：2004-01-06
申请号：US10189434
申请日：2002-07-08
申请人： Mitsutoshi Miyasaka
发明人： Mitsutoshi Miyasaka
IPC分类号： H01L2100
CPC分类号： H01L29/66757 , H01L21/67155 , H01L29/78681 , H01L29/78684 , Y10T29/41
摘要： TFT fabrication equipment including a first chamber for processing under oxidizing atmosphere, a second chamber for processing under reducing atmosphere, a third chamber for performing crystallization, a fourth chamber for load-locking, and a fifth chamber. A substrate is transferred from any one chamber of the first, second, third and fourth chamber to another chamber of the first, second, third and fourth chamber. The fifth chamber is connected to the first chamber via a first shutter, being connected to the second chamber via a second shutter, being connected to the third chamber via a third shutter, and being connected to the fourth chamber via a fourth shutter.
摘要翻译： TFT制造设备包括用于在氧化气氛下处理的第一室，用于在还原气氛下处理的第二室，用于进行结晶的第三室，用于装载锁定的第四室和第五室。衬底从第一，第二，第三和第四腔室的任何一个腔室转移到第一，第二，第三和第四腔室的另一腔室。第五室经由第一闸板连接到第一室，经由第二挡板连接到第二室，经由第三闸板连接到第三室，并通过第四闸板连接到第四室。

79. 发明申请

US20030209646A1 Snubber for pneumatically isolated platforms 有权
标题翻译：缓冲器用于气动隔离平台
公开(公告)号：US20030209646A1
公开(公告)日：2003-11-13
申请号：US10142444
申请日：2002-05-07
发明人： Vyacheslav M. Ryaboy , Worthington B. Houghton JR. , Herman B. Keil
IPC分类号： F16M001/00
CPC分类号： F16F1/373 , F16F2230/0064 , F16F2236/123 , H01L21/67155
摘要： A table assembly that includes a snubber coupled to both a table and a vibration isolator. The snubber limits relative movement between the table and vibration isolator so that the isolator can more quickly damp movement by the table. The snubber reduces the settling time of the table when subjected to shock and/or vibration loads.
摘要翻译：一种桌子组件，其包括耦合到桌子和隔振器的缓冲器。缓冲器限制了台面和隔振器之间的相对移动，使得隔离器能够更快地阻止桌子的移动。当受到冲击和/或振动负载时，缓冲器可减少工作台的沉降时间。

80. 发明授权

US06524389B1 Substrate processing apparatus 有权
标题翻译：基板加工装置
公开(公告)号：US06524389B1
公开(公告)日：2003-02-25
申请号：US09576074
申请日：2000-05-22
申请人： Kyoshige Katayama , Yuta Yoshimura , Takeshi Tamura
发明人： Kyoshige Katayama , Yuta Yoshimura , Takeshi Tamura
IPC分类号： B05C1100
CPC分类号： H01L21/67109 , H01L21/67155
摘要： In a processing chamber for performing heat processing for a substrate, gas for purge, for example, N2 is supplied nearly parallel to the substrate placed on a hot plate with a gap forming member between them and toward both the front and rear faces of the substrate. Thus, an atmosphere around the substrate can be exchanged for the gas for purge efficiently, and moreover the atmosphere around the substrate can be exchanged uniformly. Accordingly, heat processing in a low oxygen atmosphere can be performed in a short time, and moreover the total time required for substrate processing can be shortened. Besides, heat processing in the low oxygen atmosphere can be performed uniformly.
摘要翻译：在用于对基板进行热处理的处理室中，用于吹扫的气体例如N 2被供给几乎平行于放置在热板上的基板，其间具有间隙形成构件并且朝向基板的前后两面。因此，可以有效地更换基板周围的气体用于净化气体，此外可以均匀地更换基板周围的气氛。因此，能够在短时间内进行低氧气氛下的热处理，能够缩短基板处理所需的总时间。此外，可以均匀地进行低氧气氛中的热处理。

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