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71. 发明授权

US10034609B2 Temperature sensor for tracking body temperature based on printable nanomaterial thermistor 有权
公开(公告)号：US10034609B2
公开(公告)日：2018-07-31
申请号：US14932998
申请日：2015-11-05
申请人： NANO AND ADVANCED MATERIALS INSTITUTE LIMITED
发明人： Caiming Sun , Xiaohua Chen
IPC分类号： A61B5/00 , H01C7/04 , G01K1/08 , G01K7/22 , G01K13/00 , A61B5/01 , H01C1/142 , H01C1/14 , H01C17/28
CPC分类号： A61B5/0008 , A61B5/01 , A61B2560/0214 , A61B2562/0276 , A61B2562/12 , A61B2562/164 , G01K1/08 , G01K7/22 , G01K13/002 , H01C1/1413 , H01C1/142 , H01C7/041 , H01C17/281
摘要： Provided are wireless temperature sensors. A temperature sensor with a flexible, large-area printed thermistor can include an negative temperature coefficient (NTC) thermistor for temperature sensing, a control circuitry for electrically connecting with the NTC thermistor and obtaining the temperature sensed by the NTC thermistor, a power source for providing power supply to the NTC thermistor and the control circuitry, and a frame element for supporting the NTC thermistor, the control circuitry and the power source, where the frame element is at least partially thermally insulated to establish thermal equilibrium within the temperature sensor. The temperature sensor can sense the temperature in a fast and accurate way due to fast thermal equilibrium established within the sensor.

72. 发明授权

US10008310B1 Resistor element, method of manufacturing the same, and resistor element assembly 有权
公开(公告)号：US10008310B1
公开(公告)日：2018-06-26
申请号：US15728977
申请日：2017-10-10
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Heung Bok Ryu , Teack Yong Nam , Yong Joo Lee , Sung Gil Gu , Jung Min Nam
IPC分类号： H05K1/16 , H01C1/16 , H05K1/18 , H05K1/11 , H01C1/142 , H01C1/012 , H01C7/00 , H01C1/02 , H01C17/28 , H01C17/00 , H01C17/065 , H01C17/075
CPC分类号： H01C1/16 , H01C1/012 , H01C1/02 , H01C1/142 , H01C7/003 , H01C7/006 , H01C17/006 , H01C17/065 , H01C17/075 , H01C17/281 , H05K1/111 , H05K1/181 , H05K3/3442 , H05K2201/10022
摘要： A resistor element includes a first terminal and a second terminal disposed on opposite end portions of a base substrate, respectively. A first resistance layer is connected to the first terminal and formed of a thick film resistor, and a second resistance layer is connected to the first resistance layer and the second terminal and is formed of a thin film resistor.

73. 发明申请

US20180122536A1 CHIP RESISTOR AND MOUNTING STRUCTURE THEREOF 审中-公开
公开(公告)号：US20180122536A1
公开(公告)日：2018-05-03
申请号：US15802032
申请日：2017-11-02
申请人： ROHM CO., LTD.
发明人： Masaki YONEDA
IPC分类号： H01C1/012 , H01C1/14 , H05K1/18
CPC分类号： H01C1/012 , H01C1/014 , H01C1/028 , H01C1/14 , H01C1/142 , H01C3/12 , H05K1/181 , H05K3/3442 , H05K2201/10022 , H05K2201/10636 , Y02P70/611
摘要： A chip resistor with a reduced thickness is provided. The chip resistor includes an insulating substrate, a resistor embedded in the substrate, a first electrode electrically connected to the resistor, and a second electrode electrically connected to the resistor. The first electrode and the second electrode are spaced apart from each other in a lateral direction that is perpendicular to the thickness direction of the substrate.

74. 发明申请

US20180108462A1 RECTANGULAR CHIP RESISTOR AND MANUFACTURING METHOD FOR SAME 审中-公开
公开(公告)号：US20180108462A1
公开(公告)日：2018-04-19
申请号：US15568865
申请日：2016-04-22
申请人： KAMAYA ELECTRIC CO., LTD.
发明人： Tomiharu MORITA , Yuusuke NOJIRI
IPC分类号： H01C13/02 , H01C17/242 , H01C17/06 , H01C17/00
CPC分类号： H01C13/02 , H01C1/142 , H01C7/003 , H01C17/006 , H01C17/06 , H01C17/065 , H01C17/242
摘要： The chip resistor includes insulating substrate 10, first and second top electrodes (11x, 11b) on the top surface of the insulating substrate each on either longitudinal end thereof, and resistive element 12 electrically in contact with the top electrodes, wherein each of the top electrodes has, on its inner side facing to the other, cutout part 11a and protruding part 11b, with the cutout part in the first top electrode extending from at least one longitudinal side of the insulating substrate, transversely inwards thereof, and with the cutout part in the second top electrode arranged substantially point-symmetrically to the cutout part in the first top electrode with respect to the center of the insulating substrate, wherein the resistive element has contacting regions 12b, and non-contacting regions 12c, and trimming slot (53a, 53b) including a linear part.

75. 发明授权

US09832877B2 Collective substrate for resistor devices 有权
公开(公告)号：US09832877B2
公开(公告)日：2017-11-28
申请号：US15239943
申请日：2016-08-18
申请人： Murata Manufacturing Co., Ltd.
发明人： Kazuo Hattori , Isamu Fujimoto , Shinichiro Kuroiwa
IPC分类号： H05K7/00 , H05K1/18 , H01G4/30 , H01G4/12 , H01G4/248 , H01C7/00 , H01C1/01 , H05K1/02
CPC分类号： H05K1/181 , H01C1/01 , H01C1/014 , H01C1/142 , H01C1/148 , H01C7/008 , H01C7/18 , H01G2/065 , H01G4/12 , H01G4/232 , H01G4/248 , H01G4/30 , H05K1/0296 , H05K2201/0909 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003
摘要： A collective substrate for resistor devices includes a base, a first conductive pattern in a to-be-product region and a to-be-cut-away region of the base, and a resistive element in the to-be-product region of the base. The to-be-cut-away region includes a first region adjacent to the to-be-product region in a first direction, and a second region adjacent to the to-be-product region in a second direction. The first conductive pattern includes a first terminal portion connected to the resistive element and disposed in the to-be-product region, a first electrode portion disposed in the first region and larger in area than the first terminal portion, and a first interconnect portion extended from the first terminal portion toward the second region to be connected to the first electrode portion.

76. 发明授权

US09773588B2 Chip parts 有权
公开(公告)号：US09773588B2
公开(公告)日：2017-09-26
申请号：US14713684
申请日：2015-05-15
申请人： ROHM CO., LTD.
发明人： Takuma Shimoichi , Yasuhiro Kondo , Keishi Watanabe , Takamichi Torii , Katsuya Matsuura
IPC分类号： H01C7/10 , H01C1/01 , H01F27/29 , H01C1/14 , H01G4/30 , H01G4/228 , H01F27/28 , H01F17/00
CPC分类号： H01C1/01 , H01C1/02 , H01C1/14 , H01C1/142 , H01C7/006 , H01C13/02 , H01C17/267 , H01F17/0006 , H01F27/2804 , H01F27/292 , H01F2017/0026 , H01G4/228 , H01G4/30 , H01G4/33 , H01L23/5228 , H01L23/647 , H01L28/20 , H05K1/0293 , H05K1/162 , H05K1/165 , H05K1/167
摘要： A chip part is provided that includes a substrate 2 in which an element region 5 and an electrode region 16 are set, an insulating film (a first insulating film 9 and a second insulating film 3) which is formed on the substrate 2 and which selectively includes an internal concave/convex structure 18 in the electrode region 16 on a surface, a first connection electrode 3 and a second connection electrode 4 which include, at a bottom portion, an anchor portion 24 entering the concave portion 17 of the internal concave/convex structure 18 and which include an external concave/convex structure 6, 7 on a surface on the opposite side and a circuit element which is disposed in the element region 5 and which is electrically connected to the first connection electrode 3 and the second connection electrode 4.

77. 发明申请

US20170271053A1 CHIP RESISTOR AND METHOD OF MAKING THE SAME 审中-公开
公开(公告)号：US20170271053A1
公开(公告)日：2017-09-21
申请号：US15457423
申请日：2017-03-13
申请人： ROHM CO., LTD.
发明人： Masaki YONEDA
IPC分类号： H01C1/142 , H01C17/00 , H01C17/28 , H01C1/012
CPC分类号： H01C1/142 , H01C1/012 , H01C1/148 , H01C7/003 , H01C17/006 , H01C17/242 , H01C17/281 , H01C17/288
摘要： The present invention provides a chip resistor and a method of making the same for alleviating stress resulted from thermal expansion difference and thus suppressing cracks. A chip resistor includes: a substrate, having a carrying surface and a mounting surface facing away from each other; a pair of upper electrodes, disposed at two ends of the carrying surface; a resistor, disposed on the carrying surface and between the pair of upper electrodes, and electrically connected to the pair of upper electrodes; a stress relaxation layer having flexibility and formed on the mounting surface of the substrate; a metal thin film layer, formed on a surface of the stress relaxation layer opposite to the substrate; a side electrode for electrically connecting the upper electrodes and the metal thin film layer; and a plating layer covering the side electrode and the metal thin film layer.

78. 发明授权

US09704621B2 Chip resistor 有权
公开(公告)号：US09704621B2
公开(公告)日：2017-07-11
申请号：US14472650
申请日：2014-08-29
申请人： ROHM CO., LTD.
发明人： Shinsuke Ogawa , Makoto Toyonaga
IPC分类号： H01C10/00 , H01C1/142 , H01C1/148 , H01C7/00 , H01C17/00 , H01C17/24
CPC分类号： H01C1/142 , H01C1/148 , H01C7/003 , H01C17/006 , H01C17/24
摘要： A chip resistor includes a base member, a resistive element formed on the base member, a first inner electrode held in contact with a first end portion or the resistive element, a second inner electrode held in contact with a second end portion of the resistive element, a first reverse surface electrode reaching a first end portion of the base member, and a second reverse surface electrode reaching a second end portion of the base member. The length of the first and the second reverse surface electrodes is in a range of 2/10 to 3/10 of the length of the base member. Also, the length of the first and the second reverse surface electrodes is greater than the length of the first and the second inner electrodes.

79. 发明授权

US09508473B2 Chip resistor and electronic device 有权
标题翻译：芯片电阻和电子设备
公开(公告)号：US09508473B2
公开(公告)日：2016-11-29
申请号：US14366092
申请日：2012-12-10
申请人： ROHM CO., LTD.
发明人： Masaki Yoneda
IPC分类号： H01C1/012 , H01C1/142 , H01C7/00 , H01C17/02 , H01C17/28
CPC分类号： H05K1/185 , H01C1/012 , H01C1/142 , H01C7/003 , H01C17/006 , H01C17/02 , H01C17/281 , H05K1/113 , H05K2201/10022
摘要： [Object] To provide a chip resistor with which laser irradiation requires no extremely high positional accuracy, and a plating layer provided on a base and adjacent to a resistor element can be connected to an external conductive layer. [Solution] A chip resistor includes a base 1, a first principal surface electrode 21, a second principal surface electrode spaced apart from the first principal surface electrode 21 in a first direction X1, a resistor element 4 in contact with the first principal surface electrode 21 and the second principal surface electrode 31, an overcoat 6 covering the resistor element 4, the first principal surface electrode 21 and the second principal surface electrode, a first auxiliary electrode 25 covering the first principal surface electrode 21 and the overcoat 6, and a first plating electrode 27 covering the first auxiliary electrode 25. The first auxiliary electrode 25 includes a portion 259 offset from the first principal surface electrode 21 in the first direction X1.
摘要翻译：为了提供激光照射不需要极高位置精度的片式电阻器，并且设置在基座上并且与电阻元件相邻的镀层可以连接到外部导电层。 [解决方案]芯片电阻器包括基底1，第一主面电极21，与第一主面电极21沿第一方向X1隔开的第二主面电极，与第一主面电极接触的电阻体4 21和第二主表面电极31，覆盖电阻元件4，第一主表面电极21和第二主表面电极的外涂层6，覆盖第一主表面电极21和外涂层6的第一辅助电极25和覆盖第一辅助电极25的第一电镀电极27.第一辅助电极25包括从第一主表面电极21沿第一方向X1偏移的部分259。

80. 发明申请

US20160307673A1 Method for Fabricating a Varistor Device and Varistor Device 有权
标题翻译：制造压敏电阻器件和压敏电阻器件的方法
公开(公告)号：US20160307673A1
公开(公告)日：2016-10-20
申请号：US15102645
申请日：2014-11-13
申请人： EPCOS AG
发明人： Dennis Sun , Jamie Jing , Qirong Li
IPC分类号： H01C7/102 , H01C17/28 , H01C17/30 , H01C1/142
CPC分类号： H01C7/102 , H01C1/142 , H01C1/144 , H01C17/28 , H01C17/281 , H01C17/283 , H01C17/30
摘要： A method for fabricating a varistor device is presented. In an embodiment the method includes providing a base body for the varistor device, wherein the base body comprises a ceramic material, providing a basic material for a base metal electrode region on the base body, exposing the base body with the basic material to a temperature under a protective gas atmosphere such that the base metal electrode region is formed and firmly connected to the base body and completing the varistor device.
摘要翻译：提出了一种用于制造变阻器装置的方法。在一个实施例中，该方法包括提供用于压敏电阻器件的基体，其中基体包括陶瓷材料，为基体上的基底金属电极区提供基本材料，将基体与碱性材料暴露于温度在保护气体气氛下，使得基底金属电极区域形成并牢固地连接到基体并完成压敏电阻器件。

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