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71. 发明申请

US20050162761A1 Heat sink tab for optical sub-assembly 有权
标题翻译：用于光学子组件的散热片
公开(公告)号：US20050162761A1
公开(公告)日：2005-07-28
申请号：US11042541
申请日：2005-01-25
申请人： Marian Hargis , Michael Hanley , James Moon
发明人： Marian Hargis , Michael Hanley , James Moon
IPC分类号： G02B7/00 , G02B26/06 , G12B15/06 , H05K5/00 , H05K7/20 , G02B7/02
CPC分类号： G02B7/008 , G02B6/4269 , G02B6/4281 , G02B6/4283 , G02B26/06
摘要： The present invention relates to a heat sinking tab for dissipating heat directly from an optical sub-assembly (OSA) to a transceiver housing, within which the optical sub-assembly is located. The heat sinking tab includes a mounting plate for mounting on the rear end of a transistor outline (TO) can, and a finger for extending into contact or close proximity to the transceiver housing. The mounting plate also provides a stiffening plate for flexible conductors used to connect the OSA leads to a transceiver printed circuit board (PCB).
摘要翻译：本发明涉及一种用于将热量从光学子组件（OSA）直接散热到光学子组件所在的收发器壳体的散热片。散热片包括用于安装在晶体管轮廓（TO）罐的后端上的安装板和用于延伸到接收或靠近收发机壳体的手指。安装板还提供用于将OSA引线连接到收发器印刷电路板（PCB）的柔性导体的加强板。

72. 发明授权

US06879032B2 Folded flex circuit interconnect having a grid array interface 有权
公开(公告)号：US06879032B2
公开(公告)日：2005-04-12
申请号：US10623304
申请日：2003-07-18
申请人： Steven A. Rosenau , Mohammed E. Ali , Brian E. Lemoff , Lisa A. Windover
发明人： Steven A. Rosenau , Mohammed E. Ali , Brian E. Lemoff , Lisa A. Windover
IPC分类号： H01L21/60 , G02B6/42 , H05K1/14 , H05K1/18 , H01L23/48
CPC分类号： G02B6/4201 , G02B6/4281 , G02B6/4283 , H01L2924/0002 , H05K1/141 , H05K1/147 , H05K1/189 , H05K2201/056 , H05K2201/10734 , H01L2924/00
摘要： A folded flex circuit interconnect increases a number of interconnection pads of a grid array interface available to accommodate high count outputs from distinct circuit elements. The circuit interconnect includes a substrate capable of being folded, a conductor layer adjacent to a surface of the substrate, and a pad array having an interconnection pad connected to the conductor layer at a first end of the circuit interconnect. The pad array is part of the grid array interface. An optics module includes the folded flex circuit interconnect and an optical unit. The folded flex circuit interconnect further includes an electrical interface at a second end that is connected to the conductor layer. The folded flex circuit interconnect connects to the optical unit using the electrical interface. The circuit interconnect connects the optical unit to a motherboard using the pad array at the first end.

73. 发明申请

US20050025434A1 Method and apparatus for providing optoelectronic communication with an electronic device 有权
标题翻译：用于与电子设备进行光电通信的方法和设备
公开(公告)号：US20050025434A1
公开(公告)日：2005-02-03
申请号：US10631933
申请日：2003-07-31
申请人： Alan Benner , Evan Colgan , How Lin , John Magerlein , Frank Pompeo , Subhash Shinde , Daniel Stigliani
发明人： Alan Benner , Evan Colgan , How Lin , John Magerlein , Frank Pompeo , Subhash Shinde , Daniel Stigliani
IPC分类号： G02B6/36 , G02B6/42 , G06F1/20 , G06F3/00
CPC分类号： G02B6/4201 , G02B6/4246 , G02B6/4249 , G02B6/4268 , G02B6/4281 , G02B6/4283 , G02B6/4292
摘要： An optoelectronic assembly for a computer system includes an electronic chip(s), a substrate, an electrical signaling medium, an optoelectronic transducer, and an optical coupling guide. The electronic chip(s) is in communication with the substrate, which is in communication with a first end of the electrical signaling medium. A second end of the electrical signaling medium is in communication with the optoelectronic transducer, and includes the optical coupling guide for aligning an optical signaling medium with the optoelectronic transducer. An electrical signal from the electronic chip is communicated to the optoelectronic transducer via the substrate and the electrical signaling medium. The optical transducer and electronic chip(s) share a common heat spreader, and communication to other groups of electronic chip(s) is done without the need for communication via a second level electrical package.
摘要翻译：用于计算机系统的光电组件包括电子芯片，基板，电信号介质，光电转换器和光耦合引导件。电子芯片与基板通信，该基板与电信号介质的第一端连通。电信令介质的第二端与光电换能器通信，并且包括用于使光信号介质与光电换能器对准的光耦合引导件。来自电子芯片的电信号通过衬底和电信令介质传送到光电换能器。光学传感器和电子芯片共享共同的散热器，并且完成与其他电子芯片组的通信，而不需要通过第二级电气封装进行通信。

74. 发明申请

US20050012199A1 Folded flex circuit interconnect having a grid array interface 有权
标题翻译：具有网格阵列接口的折叠柔性电路互连
公开(公告)号：US20050012199A1
公开(公告)日：2005-01-20
申请号：US10623304
申请日：2003-07-18
申请人： Steven Rosenau , Mohammed Ali , Brian Lemoff , Lisa Windover
发明人： Steven Rosenau , Mohammed Ali , Brian Lemoff , Lisa Windover
IPC分类号： H01L21/60 , G02B6/42 , H05K1/14 , H05K1/18 , H01L23/48 , H01L23/52
CPC分类号： G02B6/4201 , G02B6/4281 , G02B6/4283 , H01L2924/0002 , H05K1/141 , H05K1/147 , H05K1/189 , H05K2201/056 , H05K2201/10734 , H01L2924/00
摘要： A folded flex circuit interconnect increases a number of interconnection pads of a grid array interface available to accommodate high count outputs from distinct circuit elements. The circuit interconnect includes a substrate capable of being folded, a conductor layer adjacent to a surface of the substrate, and a pad array having an interconnection pad connected to the conductor layer at a first end of the circuit interconnect. The pad array is part of the grid array interface. An optics module includes the folded flex circuit interconnect and an optical unit. The folded flex circuit interconnect further includes an electrical interface at a second end that is connected to the conductor layer. The folded flex circuit interconnect connects to the optical unit using the electrical interface. The circuit interconnect connects the optical unit to a motherboard using the pad array at the first end.
摘要翻译：折叠的柔性电路互连增加了可用于容纳来自不同电路元件的高计数输出的网格阵列接口的多个互连焊盘。电路互连包括能够被折叠的基板，与基板的表面相邻的导体层，以及在电路互连的第一端处具有连接到导体层的互连焊盘的焊盘阵列。焊盘阵列是网格阵列接口的一部分。光学模块包括折叠的柔性电路互连和光学单元。折叠的柔性电路互连还包括在连接到导体层的第二端处的电接口。折叠的柔性电路互连使用电接口连接到光学单元。电路互连使用第一端的焊盘阵列将光学单元连接到母板。

75. 发明申请

US20050008302A1 Optic communications module, method for manufacturing the same, optic communications device, and electronic equipment 失效
标题翻译：光通信模块，其制造方法，光通信设备和电子设备
公开(公告)号：US20050008302A1
公开(公告)日：2005-01-13
申请号：US10849785
申请日：2004-05-21
申请人： Akira Miyamae
发明人： Akira Miyamae
IPC分类号： G02B6/42 , H01L31/02 , H01S5/022 , G02B6/36
CPC分类号： G02B6/4201 , G02B6/424 , G02B6/4253 , G02B6/4255 , G02B6/4281 , G02B6/4283 , G02B6/4292 , H01L24/97 , H01L2224/16225 , H01L2924/12042 , H01L2924/00
摘要： The present invention provides a compact optic communications module. An optic communications module according to the invention can include a base including a portion defining a through-hole through a first plane to a second plane into which an optical fiber is inserted, a fiber optic piece located on the first plane side in the through-hole and whose axis length is shorter than the distance between the first plane and the second plane, a transparent resin film provided on the first plane of the base so as to cover the through-hole, a wiring film provided on at least one surface of the transparent resin film, and an optical element aligned on the optical axis of the fiber optic piece with the transparent resin film therebetween and coupled to the wiring film.
摘要翻译：本发明提供一种紧凑的光通信模块。根据本发明的光通信模块可以包括：底座，其包括限定通过第一平面的通孔到插入光纤的第二平面的部分，位于通孔中的第一平面侧的光纤片，孔，其轴长小于第一平面和第二平面之间的距离;透明树脂膜，设置在基座的第一平面上以覆盖通孔;布线膜，设置在基板的至少一个表面上所述透明树脂膜和在所述光纤片的光轴上排列有透明树脂膜并与所述布线膜耦合的光学元件。

76. 发明授权

US06835003B2 Integrated packaging system for optical communications devices that provides automatic alignment with optical fibers 有权
标题翻译：用于光纤通信设备的集成封装系统，提供与光纤的自动对准
公开(公告)号：US06835003B2
公开(公告)日：2004-12-28
申请号：US09954384
申请日：2001-09-10
申请人： Kirk S. Giboney , Paul K. Rosenberg , Albert T. Yuen
发明人： Kirk S. Giboney , Paul K. Rosenberg , Albert T. Yuen
IPC分类号： G02B636
CPC分类号： G02B6/4249 , G02B6/4201 , G02B6/4228 , G02B6/4269 , G02B6/428 , G02B6/4281 , G02B6/4283 , G02B6/4292
摘要： The packaging system comprises a mechanical support, an insulating substrate and an electronic circuit. The mechanical support has a first support element that extends at a non-zero angle from a second support element. The insulating substrate has a first portion and a second portion in contact with the first support element and the second support element, respectively. The first portion is contoured to define at least one access hole. The optical communications device and the electronic circuit are mechanically coupled to the first support element. Either or both the optical communications device and the electronic circuit is mechanically coupled to the first support element through a respective one of the at least one access hole. The packaging device additionally comprises a conductive track extending between the electronic circuit and the optical communications device on the first portion of the insulating substrate.
摘要翻译：包装系统包括机械支撑件，绝缘基板和电子电路。机械支撑件具有从第二支撑元件以非零角度延伸的第一支撑元件。绝缘基板具有分别与第一支撑元件和第二支撑元件接触的第一部分和第二部分。第一部分是轮廓以限定至少一个进入孔。光通信设备和电子电路机械耦合到第一支撑元件。光通信设备和电子电路中的任何一个或两者通过至少一个访问孔中的相应的一个机械耦合到第一支撑元件。该封装装置还包括在绝缘基板的第一部分上的电子电路和光通信装置之间延伸的导电轨迹。

77. 发明授权

US06676302B2 Method of constructing a fiber optics communications module 失效
标题翻译：构建光纤通信模块的方法
公开(公告)号：US06676302B2
公开(公告)日：2004-01-13
申请号：US09954419
申请日：2001-09-17
申请人： Hengju Cheng , Lee L. Xu
发明人： Hengju Cheng , Lee L. Xu
IPC分类号： G02B636
CPC分类号： G02B6/4206 , G02B6/4231 , G02B6/4249 , G02B6/4261 , G02B6/4266 , G02B6/4269 , G02B6/4281 , G02B6/4284 , G02B6/4292
摘要： A method of constructing an optoelectronic module for use in fiber optic communication systems. The module is adapted for mechanically and optically interconnecting with a ferrule supporting a set of optical communications fibers. The module supports an optoelectronic device comprised of a set of photoactive components for use in communicating with the fibers. The module also includes a carrier adapted for supporting the optoelectronic device and a set of guide pins used for alignment with the ferrule. The module is constructed in steps. First, the carrier constructed as a silicon substrate. Structures such as alignment apertures may then be fabricated on the surface of the substrate using photolithography techniques. Guide pins are inserted in an alignment ferrule. The carrier is placed on the ferrule the guide pins engaged with the alignment apertures. The guide pins and carrier are aligned and held in position by the alignment ferrule. The guide pins and carrier can then installed on a support block with the ends of guide pins being cemented in alignment passages within the support block. The support block provides for the guide pins, carrier and optoelectronic device to be permanently supported in accurate alignment with one another.
摘要翻译：一种构建用于光纤通信系统的光电子模块的方法。该模块适用于与支撑一组光通信光纤的套圈的机械和光学互连。该模块支持由用于与纤维通信使用的一组光活性组件组成的光电子器件。该模块还包括适于支撑光电子器件的载体和用于与套圈对准的一组引导销。该模块是按步骤构建的。首先，载体构造为硅衬底。然后可以使用光刻技术在基板的表面上制造诸如对准孔的结构。导销插入对准套圈中。载体被放置在套圈上，导向销与对准孔接合。引导销和托架通过对准套圈对准并保持在适当的位置。然后，引导销和托架可以安装在支撑块上，引导销的端部被胶合在支撑块内的对齐通道中。支撑块提供引导引脚，载体和光电子器件被永久地支持以彼此精确对准。

78. 发明申请

US20030118312A1 Optical network unit 失效
标题翻译：光网络单元
公开(公告)号：US20030118312A1
公开(公告)日：2003-06-26
申请号：US10219337
申请日：2002-08-16
申请人： ALCATEL CANADA INC.
发明人： Jay Richard Sobel , Steve Daniel Armstrong
IPC分类号： G02B006/00
CPC分类号： G02B6/4442 , G02B6/4201 , G02B6/4251 , G02B6/4256 , G02B6/4261 , G02B6/4268 , G02B6/4277 , G02B6/428 , G02B6/4281 , G02B6/4283 , H05K5/02 , H05K5/06
摘要： An optical network unit having an environmentally sealed printed circuit board arrangement within a first compartment and a signal in/out arrangement in a second compartment. The compartments are provided by two housings. Instead of replacing individual circuit boards in the case of breakdown or malfunction, replacement of the whole of the printed circuit board arrangement is necessary thereby eliminating human error and minimizing downtime. Two housings provide the two compartments. These housings are preferably mounted upon a housing mount and a carrier for the optical network unit is also preferably mounted upon the housing mount. This housing and carrier arrangement simplifies assembly and disassembly of parts of the unit for maintenance and replacement purposes.
摘要翻译：一种光网络单元，其具有在第一隔间内的环境密封的印刷电路板布置，以及在第二隔室中的信号输入/输出。隔间由两个外壳提供。在故障或故障的情况下，不需要更换各个电路板，因此需要更换整个印刷电路板布置，从而消除人为错误并最大限度地减少停机时间。两个外壳提供两个隔间。这些壳体优选地安装在壳体安装件上，并且用于光学网络单元的载体也优选地安装在壳体安装件上。该外壳和托架安装简化了组件和拆卸部件的维护和更换目的。

79. 发明申请

US20030103737A1 Packaging architecture for a multiple array transceiver using a winged flexible cable for optimal wiring 失效
公开(公告)号：US20030103737A1
公开(公告)日：2003-06-05
申请号：US10006839
申请日：2001-11-05
申请人： International Business Machines Corporation
发明人： Johnny R. Brezina , Brian M. Kerrigan , Gerald D. Malagrino JR. , James R. Moon
IPC分类号： G02B006/36
CPC分类号： G02B6/4246 , G02B6/4269 , G02B6/4277 , G02B6/4281 , G02B6/4283
摘要： The packaging architecture for a multiple array transceiver using a winged flexible cable for optimal wiring of the present invention provides a 90-degree transition between an optical signal input/output at a communication chassis bulkhead, and provides an attachment to a heat spreader for use in wiring electrical components to the flexible cable. The packaging architecture system comprises a forward vertical carrier having an optical converter, a rearward horizontal I/O block oriented about 90 degrees from the forward vertical carrier, a heat spreader, and a flexible cable attached to the sides of the heat spreader. The multiple array transceiver makes the 90-degree transition within a narrow gap established by industry and manufacturing standards. The multiple array transceiver also provides cooling to the internal electronics through a heat sink that is attached to the heat spreader which concurrently mounts and locates the transceiver to a common host board.

80. 发明授权

US06547452B1 Alignment systems for subassemblies of overmolded optoelectronic modules 有权
标题翻译：包覆成型光电子模块子组件对准系统
公开(公告)号：US06547452B1
公开(公告)日：2003-04-15
申请号：US09568978
申请日：2000-05-11
申请人： Benson Chan , Paul F. Fortier , Francois M. Guindon , Glen W. Johnson , Martial A. Letourneau , John H. Sherman , Real Tetreault
发明人： Benson Chan , Paul F. Fortier , Francois M. Guindon , Glen W. Johnson , Martial A. Letourneau , John H. Sherman , Real Tetreault
IPC分类号： G02B636
CPC分类号： B29C45/14655 , B29C45/14065 , G02B6/4201 , G02B6/421 , G02B6/423 , G02B6/4231 , G02B6/4239 , G02B6/4255 , G02B6/4277 , G02B6/4281 , G02B6/4283 , G02B6/4292
摘要： Alignment systems for optoelectronic modules with overmolded chip carriers include drilled or milled substrate corners for engaging dowel pins to precisely align the substrate in a mold for molding an overmold frame on the substrate. The overmold frame includes slot and trilobe holes for receiving retainer posts to precisely align a retainer assembly on the overmold frame. Cooperating standoff pads on the overmold frame and on the retainer assembly stabilize the assembly of these components and provide a precise gap for receiving an adhesive to permanently attach these two components. The retainer assembly carries optoelectronic components that include a flexible circuit, and a distal end portion of this flexible circuit and walls of a receiving cavity in the overmold frame have cooperating features for precisely aligning distal electrical leads of the flexible circuit with an array of electrical pads on the substrate. A permanent shroud on a proximate end portion of the flexible circuit protects and helps align proximate electrical leads with electrical pads on optic dies and their carriers.
摘要翻译：用于具有包覆成型芯片载体的光电子模块的对准系统包括用于接合定位销的钻孔或铣削基板拐角，以将基板精确地对准模具中用于模制基板上的二次模制框架。包覆模制框架包括用于接收保持器柱的狭槽和三叶孔，以将保持器组件精确对准在包覆模制框架上。包覆模制框架和保持器组件上的合作支座稳定了这些组件的组装，并提供了一个精确的间隙，用于接收粘合剂以永久地附接这两个部件。保持器组件携载包括柔性电路的光电子部件，并且该柔性电路的远端部分和包覆模制框架中的接收腔的壁具有用于将柔性电路的远端电引线与电极焊盘阵列精确对准的配合特征在基板上。柔性电路的近端部分上的永久性护罩保护并有助于使邻近的电引线与光学管芯及其载体上的电焊盘对准。

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