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    • 71. 发明授权
    • Packaging for storing a free-flowing, paste-like or powdery substance and method for storing and applying the substance
    • 用于储存自由流动的糊状或粉状物质的包装以及用于储存和施用该物质的方法
    • US09434522B2
    • 2016-09-06
    • US12364734
    • 2009-02-03
    • Uwe LeinerManfred T. Plaumann
    • Uwe LeinerManfred T. Plaumann
    • B65D85/84B65D41/00B65D75/32
    • B65D75/327B65D75/328B65D2575/3236B65D2575/3245
    • A packaging (100, 200) for storing a free-flowing, paste-like or powdery substance (110), includes a bottom foil (120, 220) and a covering foil (130, 230) which are sealed to each other at least in certain portions, and a removal chamber (140, 240) which is formed from regions of the bottom foil and the covering foil that are detachably sealed to one another at least in certain portions, wherein the removal chamber can be opened by detaching at least a first portion (131, 231) of the covering foil from the bottom foil, wherein a second portion (132, 232), which is arranged adjacent to the first portion, of the covering foil displays less deformation resistance than the first portion of the covering foil, so that plastic deformation, required for opening the removal chamber, of the covering foil occurs substantially in the second portion of the covering foil.
    • 一种用于储存自由流动的糊状或粉状物质(110)的包装(100,200)包括底部箔(120,220)和至少彼此密封的覆盖箔(130,230) 至少部分可拆卸地彼此密封的从底部箔片和覆盖箔片的区域形成的去除室(140,240),其中通过分离至少可以打开去除室 覆盖箔从底部箔片的第一部分(131,231),其中与覆盖箔片的第一部分相邻布置的第二部分(132,232)显示比第一部分 覆盖箔,使得覆盖箔的打开除去室所需的塑性变形基本上在覆盖箔的第二部分中发生。
    • 75. 发明授权
    • Sealing sheet for use to close a container-defining sheet
    • 用于关闭容器限定片材的密封片
    • US08757381B2
    • 2014-06-24
    • US13721664
    • 2012-12-20
    • Chantel Hebert
    • Michel Bouthiette
    • B65D83/04A61J7/00
    • A61J7/0069A61J1/035A61J7/04A61J2205/30B65D1/34B65D75/327B65D75/54B65D2575/3236B65D2575/3245B65D2575/3281B65D2575/366B65D2583/0418
    • A sealing sheet for closing a container-defining sheet having a top surface comprising a given number of spaced apart cavities embossed therein, each of the cavities being upwardly opened and defining a container surrounded by a flange. The sealing sheet includes a top layer having a lower surface covered with pressure sensitive adhesive glue, and a bottom layer having an upper surface detachably fixed to the lower surface of the top layer by pressure sensitive adhesive glue. The bottom layer being peelable from the lower surface of the top layer to allow fixation of the sealing sheet onto the top surface of the container-defining sheet in order to close the containers defined in the same. The sealing sheet also includes an additional layer that is tearable into additional elements that are foldably attached on top of each of the containers and on which additional information may be printed.
    • 一种用于封闭容器限定片材的密封片,其具有包括在其中压花的给定数量的间隔开的空腔的顶表面,每个空腔向上打开并限定由凸缘包围的容器。 密封片包括具有被压敏粘合剂胶覆盖的下表面的顶层和具有通过压敏粘合剂胶可拆卸地固定到顶层的下表面的上表面的底层。 底层可从顶层的下表面剥离,以便将密封片固定在容器限定片的顶表面上,以封闭其中限定的容器。 密封片还包括另外的层,其可撕裂成可折叠地附接在每个容器的顶部上并且可以在其上印刷附加信息的附加元件。
    • 77. 发明授权
    • Arrangement comprising at least one power semiconductor module and a transport packaging
    • 排列包括至少一个功率半导体模块和运输包装
    • US08405195B2
    • 2013-03-26
    • US13010637
    • 2011-01-20
    • Stefan Starovecký
    • Stefan Starovecký
    • H01L23/02
    • B65D75/327B65D75/367B65D2575/3245
    • An arrangement comprising: at least one power semiconductor module and a transport packaging. The power semiconductor module has a base element, a housing and connection elements. The transport packaging has a cover layer, an interlayer with a respective cutout assigned to the power semiconductor module, and a cover film. The cover layer is generally planar, and has a first main surface facing the power semiconductor module. The interlayer is arranged on the first main surface of the cover layer. The power semiconductor module is arranged in the cutout, on the first main surface of the cover layer, wherein the base element of the power semiconductor module is disposed on the first main surface of the cover layer. The cover film bears on and covers substantial parts of the housing of the power semiconductor module. The cover film is connected to the first main surface of the interlayer.
    • 一种装置,包括:至少一个功率半导体模块和运输包装。 功率半导体模块具有基座元件,壳体和连接元件。 运输包装具有覆盖层,具有分配给功率半导体模块的相应切口的中间层和覆盖膜。 覆盖层通常是平面的,并且具有面向功率半导体模块的第一主表面。 中间层布置在覆盖层的第一主表面上。 功率半导体模块布置在覆盖层的第一主表面上的切口中,其中功率半导体模块的基底元件设置在覆盖层的第一主表面上。 覆盖膜承载并覆盖功率半导体模块的壳体的主要部分。 覆盖膜连接到中间层的第一主表面。