专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

71. 发明授权

US09093576B2 Image sensor comprising a digital-alloy microlens array integrated with sensor array, and manufacturing method thereof 有权
标题翻译：图像传感器包括与传感器阵列集成的数字合金微透镜阵列及其制造方法
公开(公告)号：US09093576B2
公开(公告)日：2015-07-28
申请号：US14056915
申请日：2013-10-17
申请人： KOREA BASIC SCIENCE INSTITUTE
发明人： Ki Soo Chang , Geon Hee Kim , Sun Cheol Yang , Hyo Sik Kim
IPC分类号： H01L21/00 , H01L31/0232 , B29D11/00 , H01L27/146 , H01L31/18
CPC分类号： H01L31/0232 , B29D11/00365 , B29D11/00807 , H01L27/14627 , H01L27/14685 , H01L31/02327 , H01L31/18
摘要： The present invention relates to an image sensor comprising a microlens array, and to a manufacturing method thereof. The method of the present invention includes gradually increasing the aluminum composition ratio of a compound semiconductor as the latter gradually gets farther from a substrate, to enable a microlens-forming layer to grow, and making the oxidation rate of the region adjacent to the substrate slower and the oxidation rate of the region farther from the substrate faster, making the interface between the oxidized region and the unoxidized region into a lens shape after the completion of oxidation. The thus-made lens is integrated into an image sensor. The present invention reduces costs for manufacturing image sensors in which a microlens is integrated, increases the signal-to-noise ratio and resolution of the image sensor, and achieves improved sensitivity.
摘要翻译：本发明涉及一种包括微透镜阵列的图像传感器及其制造方法。本发明的方法包括逐渐增加化合物半导体的铝组成比，随着后者从衬底逐渐变得越远，以使微透镜形成层生长，并且使与邻近衬底的区域的氧化速率变慢并且距离衬底更远的区域的氧化速率更快，使氧化区域和未氧化区域之间的界面在氧化完成后成为透镜形状。这样制成的镜头被集成到图像传感器中。本发明降低了其中集成微透镜的图像传感器的制造成本，增加了图像传感器的信噪比和分辨率，并且实现了改进的灵敏度。

72. 发明申请

US20150183173A1 Methods and Apparatus for Positioning a Structure on a Polymer Layer 有权
标题翻译：在聚合物层上定位结构的方法和装置
公开(公告)号：US20150183173A1
公开(公告)日：2015-07-02
申请号：US14143842
申请日：2013-12-30
申请人： GOOGLE INC.
发明人： Jeffrey George Linhardt , Daniel Patrick Burrows
IPC分类号： B29D11/00 , A61B3/10
CPC分类号： B29D11/00807 , A61B3/101 , B29C31/008 , B29C65/02 , B29C65/483 , B29C65/4835 , B29C65/4845 , B29C65/522 , B29C65/526 , B29C65/7811 , B29C65/7814 , B29C65/7844 , B29C66/1122 , B29C66/5324 , B29C66/5326 , B29C66/8122 , B29C66/81457 , B29C66/8161 , B29C66/8322 , B29C66/92451 , B29L2011/0041 , G02C7/04 , B29K2883/00 , B29K2867/003 , B29K2823/12 , B29K2875/00 , B29K2879/085
摘要： Methods and apparatus for positioning a structure on a polymer layer are described. A method may involve forming a first polymer layer. The method may further involve positioning, by an apparatus, a structure on the first polymer layer, where the apparatus comprises a rod having a first end that supports the structure as the structure is being positioned and a plunger located around the first end of the rod that presses the structure onto the first polymer layer as the structure is being positioned. And the method may involve forming a second polymer layer over the first polymer layer and the structure, where the first polymer layer defines a first side of a body-mountable device and the second polymer layer defines a second side of the body-mountable device opposite the first side.
摘要翻译：描述了在聚合物层上定位结构的方法和装置。一种方法可以包括形成第一聚合物层。该方法还可以包括通过设备在第一聚合物层上定位结构，其中该装置包括具有第一端的杆，该杆具有在结构被定位时支撑结构的第一端和位于杆的第一端周围的柱塞当结构被定位时，该结构将结构压在第一聚合物层上。并且该方法可以包括在第一聚合物层和结构上形成第二聚合物层，其中第一聚合物层限定可体内安装的装置的第一侧，并且第二聚合物层限定可相对于身体安装的装置的第二侧第一面。

73. 发明授权

US09054079B2 Assembling thin silicon chips on a contact lens 有权
标题翻译：在隐形眼镜上组装薄硅芯片
公开(公告)号：US09054079B2
公开(公告)日：2015-06-09
申请号：US14025581
申请日：2013-09-12
申请人： Google Inc.
发明人： James Etzkorn
IPC分类号： G02C7/04 , H01L23/48 , H01L21/56 , H01L23/00
CPC分类号： G02C11/10 , A61B5/6821 , A61B2562/12 , B29D11/00048 , B29D11/00807 , G02C7/04 , G02C7/049 , H01L21/56 , H01L21/563 , H01L21/768 , H01L23/3107 , H01L23/3121 , H01L23/48 , H01L23/528 , H01L24/03 , H01L24/05 , H01L24/09 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/742 , H01L24/81 , H01L24/83 , H01L24/89 , H01L24/97 , H01L2224/02375 , H01L2224/0401 , H01L2224/05548 , H01L2224/05553 , H01L2224/05554 , H01L2224/08225 , H01L2224/11312 , H01L2224/13109 , H01L2224/16225 , H01L2224/16227 , H01L2224/291 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/73204 , H01L2224/8012 , H01L2224/8085 , H01L2224/81191 , H01L2224/81192 , H01L2224/81193 , H01L2224/81203 , H01L2224/81204 , H01L2224/81815 , H01L2224/81903 , H01L2224/83191 , H01L2224/83192 , H01L2224/83203 , H01L2224/83851 , H01L2224/83855 , H01L2224/9211 , H01L2224/92125 , H01L2924/00014 , H01L2924/10161 , H01L2924/10162 , H01L2924/10253 , H01L2924/12041 , H01L2924/14 , H01L2924/2064 , H01L2924/20641 , H01L2924/20642 , H01L2924/20643 , H01L2924/20644 , H01L2924/20645 , H01L2924/20646 , H01L2924/20647 , H01L2924/20648 , H01L2924/20649 , H01L2924/2065 , H01L2924/00 , H01L2224/83104 , H01L2224/05599 , H01L2924/013 , H01L2924/0105 , H01L2924/01083 , H01L2924/00013 , H01L2924/20105 , H01L2924/00012 , H01L2924/0665
摘要： A contact lens having a thin silicon chip integrated therein is provided along with methods for assembling the silicon chip within the contact lens. In an aspect, a method includes creating a plurality of lens contact pads on a lens substrate and creating a plurality of chip contact pads on a chip. The method further involves applying assembly bonding material to the each of the plurality of lens contact pads or chip contact pads, aligning the plurality of lens contact pads with the plurality of chip contact pads, bonding the chip to the lens substrate via the assembly bonding material using flip chip bonding, and forming a contact lens with the lens substrate.
摘要翻译：集成有薄硅芯片的隐形眼镜与隐形眼镜中的硅芯片的组装方法一起提供。一方面，一种方法包括在透镜基板上形成多个透镜接触焊盘并在芯片上产生多个芯片接触焊盘。该方法还包括将组装接合材料施加到多个透镜接触焊盘或芯片接触焊盘中的每一个上，将多个透镜接触焊盘与多个芯片接触焊盘对准，通过组装接合材料将芯片粘合到透镜基板使用倒装芯片接合，并且与透镜基板形成隐形眼镜。

74. 发明申请

US20150146159A1 METHODS FOR FORMATION OF AN OPHTHALMIC LENS WITH AN INSERT UTILIZING VOXEL-BASED LITHOGRAPHY 有权
标题翻译：使用基于VOXEL的LITHOGRAPHY的插入物形成眼镜的方法
公开(公告)号：US20150146159A1
公开(公告)日：2015-05-28
申请号：US14087484
申请日：2013-11-22
申请人： Johnson & Johnson Vision Care, Inc.
发明人： Marina Johns Archer , Michael Ferran , Frederick A. Flitsch , Camille A. Higham , Randall Braxton Pugh , Michael F. Widman , Christopher Wildsmith
IPC分类号： B29D11/00 , G02C7/04
CPC分类号： B29D11/00038 , B29C35/0266 , B29C2035/0833 , B29D11/00144 , B29D11/00153 , B29D11/00807 , B29K2083/00 , B29K2105/0002 , B29K2105/243 , G02C7/049
摘要： Methods for manufacturing an ophthalmic lens with an insert using voxel-based lithography techniques, wherein at least a portion of one surface may be free-formed from a reactive mixture are set forth herein. An ophthalmic lens precursor may be formed on a substrate with an arcuate optical quality surface via a source of actinic radiation controllable to cure a definable portion of a volume of reactive mixture, wherein the control may be on a voxel by voxel basis.
摘要翻译：使用基于体素的光刻技术制造具有插入物的眼用透镜的方法，其中一个表面的至少一部分可以由反应性混合物自由形成。眼科镜片前体可以通过光化辐射源形成在具有弧形光学质量表面的基底上，该光源可控制以固化一定体积的反应性混合物的可定义部分，其中该对照可以通过体素基于体素。

75. 发明授权

US08985763B1 Contact lens having an uneven embedded substrate and method of manufacture 有权
标题翻译：隐形眼镜具有不均匀的嵌入式基板及其制造方法
公开(公告)号：US08985763B1
公开(公告)日：2015-03-24
申请号：US13627675
申请日：2012-09-26
申请人： James Etzkorn , Babak Amirparviz
发明人： James Etzkorn , Babak Amirparviz
IPC分类号： G02C11/00 , G02C7/04
CPC分类号： G02C11/00 , B29D11/00038 , B29D11/00807 , G02C7/04
摘要： Contact lenses and methods of manufacturing contact lenses are provided. In one aspect, a method includes: forming a substrate having an uneven surface; providing a sensor at a first region of the substrate; providing a chip at a second region of the substrate; and encapsulating the substrate, sensor and chip in a polymer. The method also includes: patterning interconnections from the first region of the substrate to the second region of the substrate; and patterning metal pads proximate to the second region of the substrate. The chip can be provided on a metal pad. The uneven surface can be a sloped surface or one or more sloped channels in the substrate, and the channels can be wide enough to receive interconnections for the chip and to receive the chip. Further, the substrate can be ring-shaped and curved prior to encapsulation.
摘要翻译：提供隐形眼镜和制造隐形眼镜的方法。一方面，一种方法包括：形成具有不平坦表面的基板; 在所述基板的第一区域处设置传感器; 在所述衬底的第二区域处提供芯片; 并将基板，传感器和芯片封装在聚合物中。该方法还包括：将从衬底的第一区域到衬底的第二区域的互连图形化; 以及图案化靠近所述衬底的所述第二区域的金属衬垫。芯片可以设置在金属垫上。不平坦表面可以是衬底中的倾斜表面或一个或多个倾斜通道，并且通道可以足够宽以接收芯片的互连并接收芯片。此外，衬底可以是环形的并且在封装之前是弯曲的。

76. 发明授权

US08940552B2 Methods and ophthalmic devices with organic semiconductor layer 有权
标题翻译：方法和眼科装置与有机半导体层
公开(公告)号：US08940552B2
公开(公告)日：2015-01-27
申请号：US13840202
申请日：2013-03-15
申请人： Johnson & Johnson Vision Care, Inc.
发明人： Randall B. Pugh , Frederick A. Flitsch
IPC分类号： H01L21/00 , B29D11/00 , H01L25/00
CPC分类号： B29D11/00038 , B29D11/00807 , G02C7/04 , H01L25/50 , H01L27/283 , H01L2924/0002 , H01L2924/00
摘要： This invention discloses methods and apparatus to form organic semiconductor transistors upon three-dimensionally formed insert devices. In some embodiments, the present invention includes incorporating the three-dimensional surfaces with organic semiconductor-based thin film transistors, electrical interconnects, and energization elements into an insert for incorporation into ophthalmic lenses. In some embodiments, the formed insert may be directly used as an ophthalmic device or incorporated into an ophthalmic device.
摘要翻译：本发明公开了在三维形成的插入装置上形成有机半导体晶体管的方法和装置。在一些实施例中，本发明包括将有机半导体基薄膜晶体管，电互连和通电元件的三维表面结合到用于并入眼科镜片的插入物中。在一些实施例中，所形成的插入物可以直接用作眼科装置或并入眼科装置中。

77. 发明申请

US20140268810A1 Optic for a Light Source 有权
标题翻译：视光源
公开(公告)号：US20140268810A1
公开(公告)日：2014-09-18
申请号：US13834599
申请日：2013-03-15
申请人： ABL IP HOLDING LLC
发明人： Craig Eugene Marquardt , Jie Chen , Daniel Aaron Weiss
IPC分类号： F21V5/04 , F21V13/04
CPC分类号： F21V5/048 , B29D11/00807 , B29K2083/00 , B29K2105/253 , F21V5/007 , F21V5/008 , F21V5/04 , F21V7/22 , F21V13/04 , F21V19/002 , F21V23/005 , F21Y2101/00 , F21Y2115/10 , H05K1/0274 , H05K1/181 , H05K3/284 , H05K2201/0162 , H05K2201/10106 , H05K2203/1327 , Y10T29/49124
摘要： Certain embodiments of the present invention provide an optic over a light source, such as, but not limited to, an LED, whereby the optic does not entirely encapsulate the LED but rather includes an inner surface such that an air gap exists between the optic and the LED.
摘要翻译：本发明的某些实施例提供光源（例如但不限于LED）上的光学元件，由此光学元件不完全地封装LED，而是包括内表面，使得在光学元件和光学元件之间存在气隙 LED。

78. 发明申请

US20140085599A1 ASSEMBLING THIN SILICON CHIPS ON A CONTACT LENS 有权
标题翻译：在接触镜上组装薄硅胶
公开(公告)号：US20140085599A1
公开(公告)日：2014-03-27
申请号：US14025581
申请日：2013-09-12
申请人： Google Inc.
发明人： James Etzkorn
IPC分类号： G02C7/04 , H01L23/00
CPC分类号： G02C11/10 , A61B5/6821 , A61B2562/12 , B29D11/00048 , B29D11/00807 , G02C7/04 , G02C7/049 , H01L21/56 , H01L21/563 , H01L21/768 , H01L23/3107 , H01L23/3121 , H01L23/48 , H01L23/528 , H01L24/03 , H01L24/05 , H01L24/09 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/742 , H01L24/81 , H01L24/83 , H01L24/89 , H01L24/97 , H01L2224/02375 , H01L2224/0401 , H01L2224/05548 , H01L2224/05553 , H01L2224/05554 , H01L2224/08225 , H01L2224/11312 , H01L2224/13109 , H01L2224/16225 , H01L2224/16227 , H01L2224/291 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/73204 , H01L2224/8012 , H01L2224/8085 , H01L2224/81191 , H01L2224/81192 , H01L2224/81193 , H01L2224/81203 , H01L2224/81204 , H01L2224/81815 , H01L2224/81903 , H01L2224/83191 , H01L2224/83192 , H01L2224/83203 , H01L2224/83851 , H01L2224/83855 , H01L2224/9211 , H01L2224/92125 , H01L2924/00014 , H01L2924/10161 , H01L2924/10162 , H01L2924/10253 , H01L2924/12041 , H01L2924/14 , H01L2924/2064 , H01L2924/20641 , H01L2924/20642 , H01L2924/20643 , H01L2924/20644 , H01L2924/20645 , H01L2924/20646 , H01L2924/20647 , H01L2924/20648 , H01L2924/20649 , H01L2924/2065 , H01L2924/00 , H01L2224/83104 , H01L2224/05599 , H01L2924/013 , H01L2924/0105 , H01L2924/01083 , H01L2924/00013 , H01L2924/20105 , H01L2924/00012 , H01L2924/0665
摘要： A contact lens having a thin silicon chip integrated therein is provided along with methods for assembling the silicon chip within the contact lens. In an aspect, a method includes creating a plurality of lens contact pads on a lens substrate and creating a plurality of chip contact pads on a chip. The method further involves applying assembly bonding material to the each of the plurality of lens contact pads or chip contact pads, aligning the plurality of lens contact pads with the plurality of chip contact pads, bonding the chip to the lens substrate via the assembly bonding material using flip chip bonding, and forming a contact lens with the lens substrate.
摘要翻译：集成有薄硅芯片的隐形眼镜与隐形眼镜中的硅芯片的组装方法一起提供。一方面，一种方法包括在透镜基板上形成多个透镜接触焊盘并在芯片上产生多个芯片接触焊盘。该方法还包括将组装接合材料施加到多个透镜接触焊盘或芯片接触焊盘中的每一个上，将多个透镜接触焊盘与多个芯片接触焊盘对准，通过组装接合材料将芯片粘合到透镜基板使用倒装芯片接合，并且与透镜基板形成隐形眼镜。

79. 发明申请

US20140084489A1 ASSEMBLING THIN SILICON CHIPS ON A CONTACT LENS 有权
公开(公告)号：US20140084489A1
公开(公告)日：2014-03-27
申请号：US13627574
申请日：2012-09-26
申请人： Google Inc.
发明人： James Etzkorn
IPC分类号： H01L23/48 , H01L21/56
CPC分类号： G02C11/10 , A61B5/6821 , A61B2562/12 , B29D11/00048 , B29D11/00807 , G02C7/04 , G02C7/049 , H01L21/56 , H01L21/563 , H01L21/768 , H01L23/3107 , H01L23/3121 , H01L23/48 , H01L23/528 , H01L24/03 , H01L24/05 , H01L24/09 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/742 , H01L24/81 , H01L24/83 , H01L24/89 , H01L24/97 , H01L2224/02375 , H01L2224/0401 , H01L2224/05548 , H01L2224/05553 , H01L2224/05554 , H01L2224/08225 , H01L2224/11312 , H01L2224/13109 , H01L2224/16225 , H01L2224/16227 , H01L2224/291 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/73204 , H01L2224/8012 , H01L2224/8085 , H01L2224/81191 , H01L2224/81192 , H01L2224/81193 , H01L2224/81203 , H01L2224/81204 , H01L2224/81815 , H01L2224/81903 , H01L2224/83191 , H01L2224/83192 , H01L2224/83203 , H01L2224/83851 , H01L2224/83855 , H01L2224/9211 , H01L2224/92125 , H01L2924/00014 , H01L2924/10161 , H01L2924/10162 , H01L2924/10253 , H01L2924/12041 , H01L2924/14 , H01L2924/2064 , H01L2924/20641 , H01L2924/20642 , H01L2924/20643 , H01L2924/20644 , H01L2924/20645 , H01L2924/20646 , H01L2924/20647 , H01L2924/20648 , H01L2924/20649 , H01L2924/2065 , H01L2924/00 , H01L2224/83104 , H01L2224/05599 , H01L2924/013 , H01L2924/0105 , H01L2924/01083 , H01L2924/00013 , H01L2924/20105 , H01L2924/00012 , H01L2924/0665
摘要： A contact lens having a thin silicon chip integrated therein is provided along with methods for assembling the silicon chip within the contact lens. In an aspect, a method includes creating a plurality of lens contact pads on a lens substrate and creating a plurality of chip contact pads on a chip. The method further involves applying assembly bonding material to the each of the plurality of lens contact pads or chip contact pads, aligning the plurality of lens contact pads with the plurality of chip contact pads, bonding the chip to the lens substrate via the assembly bonding material using flip chip bonding, and forming a contact lens with the lens substrate.

80. 发明申请

US20120182710A1 LED FLASH LENS UNIT AND MANUFACTURING METHOD THEREOF 有权
标题翻译： LED闪光灯单元及其制造方法
公开(公告)号：US20120182710A1
公开(公告)日：2012-07-19
申请号：US13338874
申请日：2011-12-28
申请人： Jin Eui Lee , Seung Jae Lee , Dong Seob Jang , Heung Bom Kim , Jin Bae Kim
发明人： Jin Eui Lee , Seung Jae Lee , Dong Seob Jang , Heung Bom Kim , Jin Bae Kim
IPC分类号： G03B15/06 , B29D11/00
CPC分类号： B29D11/00807 , G02B5/0215 , G02B19/0028 , G02B19/0061 , G02B27/0955 , G03B15/05 , G03B2215/0567 , G03B2215/0582 , G03B2215/0589 , H01L33/58
摘要： Disclosed herein is an LED flash lens unit which prevents occurrence of yellow bands or yellow rings if LED light is concentrated through an LED flash lens improving manufacturing ability and mass production to have high performance and high efficiency.
摘要翻译：这里公开了一种LED闪光透镜单元，其防止如果LED灯通过LED闪光镜片集中来改善制造能力和批量生产以具有高性能和高效率的黄色带或黄色环的发生。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式