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    • 72. 发明申请
    • High-throughput printing of semiconductor precursor layer by use of chalcogen-containing vapor and inter-metallic material
    • 通过使用含硫属元素的蒸气和金属间材料对半导体前体层进行高通量打印
    • US20070163644A1
    • 2007-07-19
    • US11395668
    • 2006-03-30
    • Jeroen Van DurenMatthew RobinsonBrian Sager
    • Jeroen Van DurenMatthew RobinsonBrian Sager
    • B05D3/00
    • H01L31/0322C23C18/1204H01L31/02008H01L31/048H01L31/0749H01L31/18Y02E10/541
    • A high-throughput method of forming a semiconductor precursor layer by use of a chalcogen-containing vapor is disclosed. In one embodiment, the method comprises forming a precursor material comprising group IB and/or group IIIA particles of any shape. The method may include forming a precursor layer of the precursor material over a surface of a substrate. The method may further include heating the particle precursor material in a substantially oxygen-free chalcogen atmosphere to a processing temperature sufficient to react the particles and to release chalcogen from the chalcogenide particles, wherein the chalcogen assumes a liquid form and acts as a flux to improve intermixing of elements to form a group IB-IIIA-chalcogenide film at a desired stoichiometric ratio. The chalcogen atmosphere may provide a partial pressure greater than or equal to the vapor pressure of liquid chalcogen in the precursor layer at the processing temperature.
    • 公开了一种通过使用含硫属原子的蒸气形成半导体前体层的高通量方法。 在一个实施方案中,该方法包括形成包含任何形状的IB族和/或IIIA族颗粒的前体材料。 该方法可以包括在衬底的表面上形成前体材料的前体层。 该方法还可以包括将基本上无氧的硫属元素气氛中的颗粒前体材料加热到足以使颗粒反应并从硫族化物颗粒中释放硫属元素的处理温度,其中硫族元素呈现液体形式并用作助熔剂以改善 元素的混合以期望的化学计量比形成IB-IIIA族硫族化合物膜。 硫属化合物气氛可以在处理温度下提供大于或等于前体层中液态硫属元素的蒸气压的分压。
    • 73. 发明申请
    • High-throughput printing of semiconductor precursor layer from inter-metallic microflake articles
    • 半金属微片制品半导体前体层的高通量印刷
    • US20070163642A1
    • 2007-07-19
    • US11395426
    • 2006-03-30
    • Jeroen Van DurenMatthew RobinsonBrian Sager
    • Jeroen Van DurenMatthew RobinsonBrian Sager
    • H01L31/00
    • H01L31/0322C23C18/1229C23C18/127C23C18/1275C23C18/1283C23C18/14H01L31/06H01L31/0749H01L31/18Y02E10/541Y02P70/521
    • Methods and devices are provided for high-throughput printing of semiconductor precursor layer from microflake particles. In one embodiment, the method comprises of transforming non-planar or planar precursor materials in an appropriate vehicle under the appropriate conditions to create dispersions of planar particles with stoichiometric ratios of elements equal to that of the feedstock or precursor materials, even after settling. In particular, planar particles disperse more easily, form much denser coatings (or form coatings with more interparticle contact area), and anneal into fused, dense films at a lower temperature and/or time than their counterparts made from spherical nanoparticles. These planar particles may be microflakes that have a high aspect ratio. The resulting dense film formed from microflakes are particularly useful in forming photovoltaic devices. In one embodiment, at least one set of the particles in the ink may be inter-metallic flake particles (microflake or nanoflake) containing at least one group IB-IIIA inter-metallic alloy phase.
    • 提供了用于从微片微粒高通量印刷半导体前体层的方法和装置。 在一个实施方案中,该方法包括在合适的条件下,在合适的载体中转化非平面或平面前体材料,以产生具有等于原料或前体材料的化学计量比的化学计量比的平面颗粒的分散体,即使在沉降之后。 特别地,平面颗粒更容易分散,形成更致密的涂层(或形成具有更多颗粒间接触面积的涂层),并在比球形纳米颗粒制成的对应物更低的温度和/或时间下退火成熔融的致密膜。 这些平面颗粒可以是具有高纵横比的微片。 由微片形成的所得致密膜在形成光伏器件中特别有用。 在一个实施方案中,油墨中的至少一组颗粒可以是含有至少一种IB-IIIA族金属间合金相的金属间薄片(微花纹或纳米薄片)。
    • 75. 发明授权
    • Manufacturing of optoelectronic devices
    • 制造光电器件
    • US07122398B1
    • 2006-10-17
    • US10810072
    • 2004-03-25
    • Karl Pichler
    • Karl Pichler
    • H01L21/00H01L31/042
    • H01L31/1876H01L31/02167H01L31/0445H01L31/0475H01L31/0504H01L31/0508Y02E10/50Y02P70/521
    • A method for manufacturing optoelectronic devices is disclosed. A layered structure may be formed with a plurality of layers including a bottom electrode layer, a top electrode layer, and one or more active layers between the top and bottom electrode layers. The layered structure is divided into one or more separate device module sections by cutting through one or more of the layers of the layered structure. At least one of the layers is an unpatterned layer at the time of cutting. Each of the resulting device module sections generally includes a portion of the active layer disposed between portions of the top and bottom electrode layers. An edge of a device section may optionally be protected against undesired electrical contact between two or more of the bottom electrode, top electrode and active layer portions. Two or more device module sections may be assembled into a device and connected in series by electrically connecting the bottom electrode layer portion of one device section to the top electrode layer portion of another device module section.
    • 公开了一种制造光电器件的方法。 层状结构可以形成有包括底电极层,顶电极层和顶电极层和底电极层之间的一个或多个有源层的多个层。 通过切割分层结构的一个或多个层,分层结构被分成一个或多个单独的设备模块部分。 在切割时,至少一层是无图案层。 每个所得到的器件模块部分通常包括设置在顶部和底部电极层的部分之间的有源层的一部分。 设备部分的边缘可以可选地被保护以防止底部电极,顶部电极和有源层部分中的两个或更多个之间的不期望的电接触。 两个或多个器件模块部分可以组装成器件并且通过将一个器件部分的底部电极层部分电连接到另一个器件模块部分的顶部电极层部分而串联连接。
    • 80. 发明授权
    • Thin-film devices formed from solid group IIIA alloy particles
    • 由固体IIIA族合金颗粒形成的薄膜器件
    • US08617640B2
    • 2013-12-31
    • US11762056
    • 2007-06-12
    • Matthew R. RobinsonChris EberspacherJeroen K. J. Van Duren
    • Matthew R. RobinsonChris EberspacherJeroen K. J. Van Duren
    • B05D5/06
    • H01L31/0322Y02E10/541
    • Methods and devices are provided for forming thin-films from solid group IIIA-based particles. In one embodiment, a method is provided for creating solid alloy particles. The method may include providing a first material containing at least one alloy comprising of: a) a group IIIA element, b) at least one group IB, IIIA, and/or VIA element different from the group IIIA element of a), and c) a group IA-based material. The group IA-based material may be included in an amount sufficient so that no liquid phase of the alloy is present in a temperature range between room temperature and a deposition temperature higher than room temperature, wherein the group IIIA element is otherwise liquid in that temperature range. The method may involve formulating a precursor material comprising of: a) particles of the first material and b) particles containing at least one element from one of the following: a group IB element, a group IIIA element, a group VIA element, alloys containing any of the foregoing elements, or combinations thereof.
    • 提供了用于从基于固体IIIA的颗粒形成薄膜的方法和装置。 在一个实施例中,提供了一种用于产生固体合金颗粒的方法。 该方法可以包括提供包含至少一种合金的第一材料,其包含:a)IIIA族元素,b)至少一种不同于a)的IIIA族元素的IB,IIIA和/或VIA元素,c )一组基于IA的材料。 基于IA族的材料可以包括足够的量,使得在室温和高于室温的沉积温度之间的温度范围内不存在合金的液相,其中IIIA族元素在该温度下为液体 范围。 该方法可以包括配制前体材料,其包括:a)第一材料的颗粒,和b)含有至少一种元素的颗粒,如下列之一:IB族元素,IIIA族元素,VIA族元素,含 任何上述要素,或其组合。