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    • 72. 发明授权
    • Laser processing nozzle
    • 激光加工喷嘴
    • US08642919B2
    • 2014-02-04
    • US12750853
    • 2010-03-31
    • Roger Hogan
    • Roger Hogan
    • B23K26/14
    • B23K26/066B23K26/127B23K26/142B23K26/1476B23K26/361
    • A laser ablation nozzle including a main pressure chamber centered on an area of a substrate to be ablated and arranged to push a stream of gas through the main pressure chamber onto the substrate. A vacuum chamber surrounds the main pressure chamber and is arranged to vacuum away the process gas and ablation debris. To attempt to address uneven pressure and flow, flow restrictors can be provided at one or both of the process gas inlet and the vacuum chamber. The vacuum flow restrictor is intended to create constriction in a channel to generate a uniform vacuum induced flow around substantially the entire circumference of the nozzle opening. Similarly, the process gas flow restrictor is intended to generate substantially uniform gas flow into the main pressure chamber.
    • 一种激光烧蚀喷嘴,包括以要消融的基板的区域为中心的主压力室,并将其布置成将气流通过主压力室推到基板上。 真空室围绕主压力室并且被布置成真空去除工艺气体和消融碎屑。 为了解决不均匀的压力和流量,可以在工艺气体入口和真空室中的一个或两个处设置限流器。 真空限流器旨在在通道中产生收缩,以在喷嘴开口的基本上整个圆周周围产生均匀的真空诱导流。 类似地,工艺气体流量限制器旨在产生基本均匀的气流进入主压力室。
    • 79. 发明申请
    • SYSTEMS AND METHODS FOR HANDLING WAFERS
    • 处理波形的系统和方法
    • US20100272544A1
    • 2010-10-28
    • US12750095
    • 2010-03-30
    • Frederic RivollierRyan Chubb
    • Frederic RivollierRyan Chubb
    • H01L31/18H01L21/677H01L21/683B65G65/00
    • H01L21/67781H01L21/67383H01L21/67766Y10S414/137
    • A system for handling wafers comprising: at least one unload station; at least one intermediate station designed to hold the wafers at an angle; a processing station; and a transfer device configured to move the wafers between the stations. The intermediate station may be configured to receive the wafers in a back-to-back arrangement. An apparatus for handling wafers comprising: on one side, a vacuum gripper configured to grip individual wafers; and, on the other side, a gravity gripper configured to support one or more wafers when positioned beneath the wafers and lifted. A method for handling wafers, comprising: unloading wafers; transferring the wafers to an intermediate station; transferring the wafers from the intermediate station to a processing station; treating the wafers; unloading the wafers from the processing station; and reloading the wafers in a carrier, wherein the wafers are unloaded, transferred and reloaded by a transfer device.
    • 一种用于处理晶片的系统,包括:至少一个卸载站; 设置成以一定角度保持晶片的至少一个中间站; 处理站; 以及配置成在所述站之间移动所述晶片的转移装置。 中间站可以被配置为以背靠背布置接收晶片。 一种用于处理晶片的设备,包括:一方面,构造成夹持单个晶片的真空夹具; 另一方面,重力夹持器构造成在位于晶片下方并支撑一个或多个晶片并提升时。 一种处理晶片的方法,包括:卸载晶片; 将晶片转移到中间站; 将晶片从中间站传送到处理站; 处理晶片; 从处理站卸载晶片; 并将晶片重新装载在载体中,其中晶片由转移装置卸载,转移和重新装载。
    • 80. 发明授权
    • Optical fiber gripping and positioning apparatus
    • 光纤夹持定位装置
    • US5506928A
    • 1996-04-09
    • US453384
    • 1995-05-30
    • David C. EvansPeter J. Schnurr
    • David C. EvansPeter J. Schnurr
    • G02B6/36G02B6/00
    • G02B6/362G02B6/3612
    • The apparatus uses a gripper mounted on a moveable arm to pick up an optical fiber at a pickup location, with the free end of the optical fiber extending from the gripper. The arm is moved to position the free end generally in the region of the target location, but slightly displaced therefrom. An image of the region of the target location is obtained from a camera directed to receive the image, where the region is backlit by diffused light from a light source. Where the target is a component on a translucent substrate, the substrate may act as the diffuser for the light source. The image from the camera is analyzed to determine the position of the free end in relation to the target location, and the arm is moved to accurately position the free end at the target location based on the determination of relative positions. The gripper has a downwardly-opening inverted V-shaped groove running longitudinally, to which a vacuum is supplied.
    • 该装置使用安装在可移动臂上的夹持器在拾取位置拾取光纤,光纤的自由端从夹持器延伸。 移动臂以将自由端大致定位在目标位置的区域中,但是稍微从其移位。 目标位置的区域的图像从指向接收图像的照相机获得,其中该区域被来自光源的漫射光背光。 在目标是半透明基板上的部件的情况下,基板可以用作光源的漫射器。 分析来自相机的图像以确定自由端相对于目标位置的位置,并且基于相对位置的确定,使臂移动以将自由端准确地定位在目标位置。 夹具具有向下开口的倒V形槽,纵向延伸,供应真空。