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    • 72. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
    • 半导体器件及其制造方法
    • US20080283909A1
    • 2008-11-20
    • US12122165
    • 2008-05-16
    • Miwako AkiyamaYusuke KawaguchiYoshihiro Yamaguchi
    • Miwako AkiyamaYusuke KawaguchiYoshihiro Yamaguchi
    • H01L29/78H01L21/336
    • H01L29/7813H01L21/26586H01L29/1095H01L29/41766H01L29/66727H01L29/66734
    • A semiconductor device includes a second-conductivity-type base region provided on a first-conductivity-type semiconductor layer, a first-conductivity-type source region provided on the second-conductivity-type base region, a gate insulating film covering an inner wall of a trench which passes through the second-conductivity-type base region and reaching the first-conductivity-type semiconductor layer, a gate electrode buried in the trench via the gate insulating film, and a second-conductivity-type region being adjacent to the second-conductivity-type base region below the first-conductivity-type source region, spaced from the gate insulating film, and having a higher impurity concentration than the second-conductivity-type base region. c≧d is satisfied, where d is a depth from an upper surface of the first-conductivity-type source region to a lower end of the gate electrode, and c is a depth from an upper surface of the first-conductivity-type source region to a lower surface of the second-conductivity-type base region.
    • 半导体器件包括设置在第一导电型半导体层上的第二导电型基极区域,设置在第二导电型基极区域上的第一导电型源极区域,覆盖内壁的栅极绝缘膜 通过所述第二导电型基极区域并到达所述第一导电型半导体层的沟槽,经由所述栅极绝缘膜埋设在所述沟槽中的栅电极,以及与所述第二导电型基极区相邻的第二导电型区域 与第一导电型源极区域相邻的第二导电型基极区域,与栅极绝缘膜间隔开,并且具有比第二导电型基极区域更高的杂质浓度。 c> = d,其中d是从第一导电型源极区域的上表面到栅极电极的下端的深度,c是从第一导电型源极区域的上表面开始的深度 源极区域延伸到第二导电型基极区域的下表面。
    • 76. 发明申请
    • Thermal Cutting Machine And Thermal Cutting Method
    • 热切割机和热切割方法
    • US20080029489A1
    • 2008-02-07
    • US11629283
    • 2005-06-05
    • Satoshi OhnishiYoshihiro Yamaguchi
    • Satoshi OhnishiYoshihiro Yamaguchi
    • B23K28/00B21J13/08
    • B23K37/0408B23K7/002B23K10/00B23K26/0884B23K26/16B23K26/38B23K26/702B23K37/0461B23K2101/18
    • A lattice pallet 13 having a large number of supporters for placing a plate 14 is installed to a table 12 so as to be freely fittable and removable. Bringing in of the plate 14 is performed by the method of raising the lattice pallet 13 with a crane with the plate 14 already having been loaded upon the lattice pallet 13 in a different location, transporting them over the table 12, and lowering them down onto the table 12. Directly after cutting has been completed, the lattice pallet 12 is raised and separated from the table 12 with the manufactured product and the left over material carried upon it and is taken away to a different location, and another lattice pallet 13 with another plate 14 mounted upon it is brought in with the crane upon the table 12, and the task of cutting this other plate 14 is commenced.
    • 具有用于放置板14的大量支撑器的格子托盘13被安装到桌子12上,以便可自由地装配和拆卸。 通过用起重机提升格子托盘13的方法来进行板14的进入,该起重机已将板14已经装载在不同位置的格子托盘13上,将它们运送到工作台12上,并将它们下降到 桌子12.切割完成之后,格子托盘12被升起并与工作台12分离,制成品并将剩下的材料运送到其上并被带走到不同的位置,另一个格子托盘13具有 安装在其上的另一个板14与起重机一起被放置在工作台12上,并且开始切割另一个板14的任务。
    • 78. 发明授权
    • Plasma cutting apparatus and control unit thereof
    • 等离子切割装置及其控制单元
    • US07087855B2
    • 2006-08-08
    • US10840676
    • 2004-05-07
    • Yoshihiro YamaguchiTetsuya Kabata
    • Yoshihiro YamaguchiTetsuya Kabata
    • B23K10/00
    • B23K10/006B23K10/00
    • Cutting quality of the product, in particular, hole cutting quality, in plasma arc cutting is improved. A control unit, which controls a plasma cutting apparatus for cutting a product from a plate material by moving a plasma torch at a cutting speed along a cutting path corresponding to the product shape to cut the plate material, while supplying an arc current and a plasma gas to the plasma torch and forming a plasma arc from a nozzle of the plasma torch to the plate material, conducts control so that, when a hole is cut, a cutting speed is lower, a value of the arc current value is smaller, and a plasma gas flow rate or pressure is less than those when a contour is cut.
    • 提高了等离子弧切割中产品的切割质量,特别是切孔质量。 控制单元,其控制等离子体切割设备,用于通过沿着与产品形状相对应的切割路径以切割速度移动等离子体焰炬来切割板材,同时提供电弧电流和等离子体 从等离子体焰炬的喷嘴向板材形成等离子弧的气体进行控制,使得当切割孔时切割速度较低,电弧电流值的值较小, 等离子体气体流量或压力小于切割轮廓时的流量或压力。
    • 79. 发明申请
    • Power semiconductor device
    • 功率半导体器件
    • US20060151805A1
    • 2006-07-13
    • US11194593
    • 2005-08-02
    • Kenji OotaYoshihiro YamaguchiHiroshi Yamaguchi
    • Kenji OotaYoshihiro YamaguchiHiroshi Yamaguchi
    • H01L29/45H01L29/76
    • H01L29/0661H01L29/0619H01L29/0834H01L29/74
    • A power semiconductor device comprises a semiconductor substrate, a gate electrode region (control electrode region), a cathode electrode region (first main electrode region), an anode electrode region (second main electrode region) and a guard ring. The semiconductor substrate has a side surface portion having a vertical portion formed substantially vertical to a main surface and a mesa portion connected to the vertical portion in a cross section. The gate electrode region is formed in a first main surface of the semiconductor substrate. The cathode electrode region is formed in part of a surface of the gate electrode region. The anode electrode region is formed in a second main surface of the semiconductor substrate. The guard ring is formed in the second main surface of the semiconductor substrate and annularly surrounds the anode electrode region. With this constitution provided is a power semiconductor device which makes the impurity diffusion length of the anode electrode region shallower in order to ensure reduction in recovery loss.
    • 功率半导体器件包括半导体衬底,栅电极区域(控制电极区域),阴极电极区域(第一主电极区域),阳极电极区域(第二主电极区域)和保护环。 半导体衬底具有侧表面部分,该侧表面部分具有基本上垂直于主表面的垂直部分和在横截面中连接到垂直部分的台面部分。 栅电极区域形成在半导体衬底的第一主表面中。 阴极电极区域形成在栅电极区域的一部分表面。 阳极电极区域形成在半导体衬底的第二主表面中。 保护环形成在半导体衬底的第二主表面中并且环形地围绕阳极电极区域。 通过这样构成,为了确保降低回收损失,能够使阳极电极区域的杂质扩散长度变浅的功率半导体装置。