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    • 71. 发明授权
    • High performance MTJ elements for STT-RAM and method for making the same
    • 用于STT-RAM的高性能MTJ元件和制作相同的方法
    • US08436437B2
    • 2013-05-07
    • US12803191
    • 2010-06-21
    • Cheng T. HorngRu-Ying TongChyu-Jiuh TorngWitold Kula
    • Cheng T. HorngRu-Ying TongChyu-Jiuh TorngWitold Kula
    • H01L29/82
    • H01L43/08B82Y25/00B82Y40/00G11C11/161H01F10/3272H01F10/329H01F10/3295H01F41/307H01L43/10H01L43/12
    • A STT-MTJ MRAM cell that utilizes transfer of spin angular momentum as a mechanism for changing the magnetic moment direction of a free layer includes an IrMn pinning layer, a SyAP pinned layer, a naturally oxidized, crystalline MgO tunneling barrier layer that is formed on an Ar-ion plasma smoothed surface of the pinned layer and a free layer that comprises an amorphous layer of Co60Fe20B20 of approximately 20 angstroms thickness or an amorphous ferromagnetic layer of Co40Fe40B20 of approximately 15 angstroms thickness formed between two crystalline layers of Fe of 3 and 6 angstroms thickness respectively. The free layer is characterized by a low Gilbert damping factor and by very strong polarizing action on conduction electrons. The resulting cell has a low critical current, a high dR/R and a plurality of such cells will exhibit a low variation of both resistance and pinned layer magnetization angular dispersion.
    • 利用自旋角度动量的转移作为改变自由层的磁矩方向的机构的STT-MTJ MRAM单元包括IrMn钉扎层,SyAP钉扎层,自然氧化的结晶的MgO隧穿势垒层,其形成于 被钉扎层的Ar离子等离子体平滑表面和包含大约20埃厚度的Co60Fe20B20的非晶层的自由层或者在3和6的Fe的两个结晶层之间形成约15埃厚度的Co40Fe40B20的非晶铁磁层 埃厚度。 自由层的特征在于低吉尔伯特阻尼因子和对传导电子的非常强的偏振作用。 所得到的电池具有低临界电流,高dR / R,并且多个这样的电池将呈现电阻和钉扎层磁化角分散的低变化。
    • 77. 发明申请
    • Method of double patterning and etching magnetic tunnel junction structures for spin-transfer torque MRAM devices
    • 双重图案化和蚀刻用于自旋转移转矩MRAM器件的磁性隧道结结构的方法
    • US20100240151A1
    • 2010-09-23
    • US12383298
    • 2009-03-23
    • Rodolfo BelenTom ZhongWitold KulaChyu-Jiuh Torng
    • Rodolfo BelenTom ZhongWitold KulaChyu-Jiuh Torng
    • H01L21/04
    • H01L27/228H01L43/12
    • A method for forming a MTJ in a STT-MRAM is disclosed in which the easy-axis CD is determined independently of the hard-axis CD. One approach involves two photolithography steps each followed by two plasma etch steps to form a post in a hard mask which is transferred through a MTJ stack of layers. The hard mask has an upper Ta layer with a thickness of 300 to 400 Angstroms and a lower NiCr layer less than 50 Angstroms thick. The upper Ta layer is etched with a fluorocarbon etch while lower NiCr layer and underlying MTJ layers are etched with a CH3OH. Preferably, a photoresist mask layer is removed by oxygen plasma between the fluorocarbon and CH3OH plasma etches. A lower hard mask layer made of NiCr or the like is inserted to prevent formation and buildup of Ta etch residues that can cause device shunting.
    • 公开了一种用于在STT-MRAM中形成MTJ的方法,其中容易轴CD独立于硬轴CD来确定。 一种方法涉及两个光刻步骤,每个步骤分别采用两个等离子体蚀刻步骤,以在通过MTJ堆叠层传送的硬掩模中形成柱。 硬掩模具有厚度为300至400埃的上层Ta层和小于50埃厚的较低NiCr层。 用氟碳蚀刻蚀刻上层Ta层,同时用CH3OH蚀刻下层NiCr层和下层MTJ层。 优选地,在碳氟化合物和CH 3 OH等离子蚀刻之间的氧等离子体去除光致抗蚀剂掩模层。 插入由NiCr等制成的下部硬掩模层以防止可能导致器件分流的Ta蚀刻残留物的形成和积累。
    • 79. 发明申请
    • Composite hard mask for the etching of nanometer size magnetic multilayer based device
    • 复合硬掩模用于蚀刻纳米尺寸磁性多层器件
    • US20090078927A1
    • 2009-03-26
    • US11901999
    • 2007-09-20
    • Rongfu XiaoChyu-Jiuh TorngTom ZhongWitold KulaAdam Zhong
    • Rongfu XiaoChyu-Jiuh TorngTom ZhongWitold KulaAdam Zhong
    • H01L29/06H01L21/02
    • H01L43/12Y10T428/24736
    • A composite hard mask is disclosed that enables sub-100 nm sized MTJ cells to be formed for advanced devices such as spin torque MRAMs. The hard mask has a lower non-magnetic metallic layer such as Ru to magnetically isolate an overlying middle metallic spacer such as MnPt from an underlying free layer. The middle metallic spacer provides a height margin during subsequent processing to avoid shorting between a bit line and the MTJ cell in the final device. An upper conductive layer may be made of Ta and is thin enough to allow a MTJ pattern in a thin overlying photoresist layer to be transferred through the Ta during a fluorocarbon etch without consuming all of the photoresist. The MTJ pattern is transferred through the remaining hard mask layers and underlying MTJ stack of layers with a second etch step using a C, H, and O etch gas composition.
    • 公开了一种复合硬掩模,其能够为高级装置(例如自旋扭矩MRAM)形成次100nm大小的MTJ电池。 硬掩模具有较低的非磁性金属层,例如Ru,以将下层的中间金属间隔物(例如MnPt)与下层的自由层磁隔离。 中间金属间隔件在后续处理期间提供高度余量以避免位线和最终装置中的MTJ单元之间的短路。 上导电层可以由Ta制成,并且足够薄以使氟薄膜蚀刻中的薄覆盖光致抗蚀剂层中的MTJ图案能够通过Ta Ta传输而不消耗所有的光致抗蚀剂。 使用C,H和O蚀刻气体组合物,通过第二蚀刻步骤将MTJ图案转移通过剩余的硬掩模层和下面的MTJ堆叠层。