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    • 71. 发明授权
    • Multilayer substrate with inner capacitors
    • 具有内部电容器的多层基板
    • US5065275A
    • 1991-11-12
    • US590085
    • 1990-09-27
    • Teruya FujisakiKatsuhiko OnitsukaYoshihiro FujiokaNobuyoshi FujikawaMasakazu YasuiAkira Hashimoto
    • Teruya FujisakiKatsuhiko OnitsukaYoshihiro FujiokaNobuyoshi FujikawaMasakazu YasuiAkira Hashimoto
    • C04B35/00B32B18/00C04B35/20C04B35/22H01B3/12H01G4/12H05K1/03H05K1/09H05K1/16H05K3/46
    • B32B18/00C04B35/20C04B35/22H05K1/162C04B2237/341C04B2237/343C04B2237/346H05K1/0306H05K1/092H05K3/4611H05K3/4629H05K3/4688
    • A multilayer substrate with inner capacitors comprising a dielectric layer sandwiched between upper and lower insulating layers, a couple of printed electrodes in desired patterns within the thickness of the dielectric layer so as to form each capacitor at the portion of the dielectric layer corresponding to the electrodes, and a couple of leading terminals on one surface of the insulating layer, which communicate with the electrodes, the multilayer substrate being characterized in that the dielectric layer is composed of a ceramic composition mainly comprising MTiO.sub.3 -based ceramics (M represents one or several of Ba, Ca, Mg, La, Sr and Nd) and the insulating layer is composed of a ceramic composition mainly comprising MgO-SiO.sub.2 -CaO-based ceramics, which is defined by an area surrounded by the lines connecting points A, B, C, D, E, F and G as shown in FIG. 1 and listed below, wherein X, Y and Z respectively represent weight percent values of MgO, SiO.sub.2 and CaO at points A, B, C, D, E, F and G.______________________________________ X Y Z ______________________________________ A 60 40 0 B 40 60 0 C 30 60 10 D 30 50 20 E 20 50 30 F 40 30 30 G 60 30 10 ______________________________________ With this multilayer substrate, the dielectric layer and the insulating layers can be co-fired. Therefore, cracking between the layers can be prevented and the superior insulation characteristics, such as insulation resistance and dielectric breakdown voltage, of the substrate can be maintained.
    • 具有内电容器的多层基板,其包括夹在上绝缘层和下绝缘层之间的电介质层,在电介质层的厚度内的所需图案中的一对印刷电极,以便在介电层对应于电极的部分处形成每个电容器 和与电极连通的绝缘层的一个表面上的一对前导端子,多层基板的特征在于,介电层由主要包含MTiO 3的陶瓷(M表示一个或多个)的陶瓷组合物构成 Ba,Ca,Mg,La,Sr和Nd),绝缘层由主要包含MgO-SiO2-CaO类陶瓷的陶瓷组合物构成,该陶瓷组合物由连接点A,B,C的线 ,D,E,F,G。 1,其中X,Y和Z分别表示A,B,C,D,E,F和G点的MgO,SiO2和CaO的重量百分比值。-XYZ -A 60 40 0 -B 40 60 0 -C 30 60 10 -D 30 50 20 -E 20 50 30 -F 40 30 30 -G 60 30 10 - 使用该多层基板,能够共烧介电层和绝缘层。 因此,可以防止层之间的龟裂,并且可以保持基板的优异的绝缘特性,例如绝缘电阻和绝缘击穿电压。