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    • 73. 发明申请
    • SEMICONDUCTOR LIGHT EMITTING DEVICE
    • 半导体发光器件
    • US20110215363A1
    • 2011-09-08
    • US12875632
    • 2010-09-03
    • Shigeya KimuraTaisuke SatoToshihide ItoToshiyuki OkaShinya Nunoue
    • Shigeya KimuraTaisuke SatoToshihide ItoToshiyuki OkaShinya Nunoue
    • H01L33/36
    • H01L33/36H01L33/38
    • According to one embodiment, a semiconductor light emitting device includes a stacked structural body, a first electrode, and a second electrode. The stacked structural body includes a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, and a light emitting portion. The stacked structural body has a first major surface on a side of the second semiconductor layer. The first electrode is provided on the first semiconductor. The second electrode is provided on the second semiconductor layer. The first electrode includes a first pad portion and a first extending portion that extends from the first pad portion along a first extending direction. The first extending portion includes a first width-increasing portion. A width of the first width-increasing portion along a direction orthogonal to the first extending direction is increased from the first pad portion toward an end of the first extending portion.
    • 根据一个实施例,半导体发光器件包括层叠结构体,第一电极和第二电极。 层叠结构体包括第一导电类型的第一半导体层,第二导电类型的第二半导体层和发光部分。 层叠结构体在第二半导体层的一侧具有第一主表面。 第一电极设置在第一半导体上。 第二电极设置在第二半导体层上。 第一电极包括第一焊盘部分和从第一焊盘部分沿着第一延伸方向延伸的第一延伸部分。 第一延伸部分包括第一宽度增加部分。 第一宽度增加部分沿着与第一延伸方向正交的方向的宽度从第一焊盘部分朝向第一延伸部分的端部增加。
    • 74. 发明申请
    • SEMICONDUCTOR LIGHT-EMITTING DEVICE
    • 半导体发光器件
    • US20110215291A1
    • 2011-09-08
    • US12873586
    • 2010-09-01
    • Toshihide ItoKoichi TachibanaShinya Nunoue
    • Toshihide ItoKoichi TachibanaShinya Nunoue
    • H01L31/0256H01L31/0352
    • H01L31/022466B82Y20/00H01L31/035236H01L33/42
    • According to one embodiment, a semiconductor light-emitting device using an ITON layer for a transparent conductor and realizing low drive voltage, high luminance efficiency, and uniformed light emission intensity distribution is provided. The semiconductor light-emitting device includes: a substrate; an n-type semiconductor layer formed on the substrate; an active layer formed on the n-type semiconductor layer; a p-type semiconductor layer formed on the active layer and whose uppermost part is a p-type GaN layer; an ITON (Indium Tin Oxynitride) layer formed on the p-type GaN layer; an ITO (Indium Tin Oxide) layer formed on the ITON layer; a first metal electrode formed on a part on the ITO layer; and a second metal electrode formed in contact with the n-type semiconductor layer.
    • 根据一个实施例,提供了一种使用用于透明导体的ITON层并实现低驱动电压,高亮度效率和均匀的发光强度分布的半导体发光器件。 半导体发光器件包括:衬底; 在该基板上形成的n型半导体层; 形成在所述n型半导体层上的有源层; 在有源层上形成的p型半导体层,其最上部是p型GaN层; 形成在p型GaN层上的ITON(铟锡氧氮化物)层; 形成在ITON层上的ITO(氧化铟锡)层; 形成在所述ITO层的一部分上的第一金属电极; 以及形成为与n型半导体层接触的第二金属电极。
    • 77. 发明申请
    • SEMICONDUCTOR LIGHT-EMITTING DEVICE
    • 半导体发光器件
    • US20110215370A1
    • 2011-09-08
    • US12873753
    • 2010-09-01
    • Taisuke SatoToshiyuki OkaKoichi TachibanaShinya NunoueKazufumi ShiozawaTakayoshi Fujii
    • Taisuke SatoToshiyuki OkaKoichi TachibanaShinya NunoueKazufumi ShiozawaTakayoshi Fujii
    • H01L33/26
    • H01L33/20H01L33/46
    • According to one embodiment, a semiconductor light-emitting device having high light extraction efficiency is provided. The semiconductor light-emitting device includes a light transmissive substrate; a nitride semiconductor layer of a first conduction type formed on or above a top face side of the light transmissive substrate; an active layer made of nitride semiconductor formed on a top face of the nitride semiconductor layer of the first conduction type; a nitride semiconductor layer of a second conduction type formed on a top face of the active layer; a dielectric layer formed on a bottom face of the light transmissive substrate and having a refractive index lower than that of the light transmissive substrate; and a metal layer formed on a bottom face of the dielectric layer. And an interface between the light transmissive substrate and the dielectric layer is a uneven face, and an interface between the dielectric layer and the metal layer is a flat face.
    • 根据一个实施例,提供了具有高光提取效率的半导体发光器件。 半导体发光器件包括透光衬底; 形成在所述透光基板的顶面侧上方或上方的第一导电型氮化物半导体层; 形成在第一导电型氮化物半导体层的顶面上的由氮化物半导体制成的有源层; 形成在有源层的顶面上的第二导电类型的氮化物半导体层; 介电层,其形成在所述透光性基板的底面上,折射率低于所述透光性基板的折射率; 以及形成在电介质层的底面上的金属层。 并且透光基板和电介质层之间的界面是不平坦的面,并且介电层和金属层之间的界面是平坦的面。
    • 78. 发明授权
    • Optical semiconductor device
    • 光半导体器件
    • US08604496B2
    • 2013-12-10
    • US13214690
    • 2011-08-22
    • Tomonari ShiodaHisashi YoshidaKoichi TachibanaNaoharu SugiyamaShinya Nunoue
    • Tomonari ShiodaHisashi YoshidaKoichi TachibanaNaoharu SugiyamaShinya Nunoue
    • H01L33/00
    • H01L33/06H01L33/32
    • According to one embodiment, an optical semiconductor device includes an n-type semiconductor layer, a p-type semiconductor layer, and a functional part. The functional part is provided between the n-type semiconductor layer and the p-type semiconductor layers. The functional part includes a plurality of active layers stacked in a direction from the n-type semiconductor layer toward the p-type semiconductor layer. At least two of the active layers include a multilayer stacked body, an n-side barrier layer, a well layer and a p-side barrier layer. The multilayer stacked body includes a plurality of thick film layers and a plurality of thin film layers alternately stacked in the direction. The n-side barrier layer is provided between the multilayer stacked body and the p-type layer. The well layer is provided between the n-side barrier layer and the p-type layer. The p-side barrier layer is provided between the well layer and the p-type layer.
    • 根据一个实施例,光学半导体器件包括n型半导体层,p型半导体层和功能部件。 功能部件设置在n型半导体层和p型半导体层之间。 功能部件包括在从n型半导体层朝向p型半导体层的方向上堆叠的多个有源层。 至少两个有源层包括多层堆叠体,n侧阻挡层,阱层和p侧势垒层。 多层堆叠体包括沿该方向交替堆叠的多个厚膜层和多个薄膜层。 n侧阻挡层设置在多层叠层体和p型层之间。 阱层设置在n侧阻挡层和p型层之间。 p侧阻挡层设置在阱层和p型层之间。
    • 80. 发明申请
    • OPTICAL SEMICONDUCTOR DEVICE
    • 光学半导体器件
    • US20120132940A1
    • 2012-05-31
    • US13214690
    • 2011-08-22
    • Tomonari ShiodaHisashi YoshidaKoichi TachibanaNaoharu SugiyamaShinya Nunoue
    • Tomonari ShiodaHisashi YoshidaKoichi TachibanaNaoharu SugiyamaShinya Nunoue
    • H01L33/32
    • H01L33/06H01L33/32
    • According to one embodiment, an optical semiconductor device includes an n-type semiconductor layer, a p-type semiconductor layer, and a functional part. The functional part is provided between the n-type semiconductor layer and the p-type semiconductor layers. The functional part includes a plurality of active layers stacked in a direction from the n-type semiconductor layer toward the p-type semiconductor layer. At least two of the active layers include a multilayer stacked body, an n-side barrier layer, a well layer and a p-side barrier layer. The multilayer stacked body includes a plurality of thick film layers and a plurality of thin film layers alternately stacked in the direction. The n-side barrier layer is provided between the multilayer stacked body and the p-type layer. The well layer is provided between the n-side barrier layer and the p-type layer. The p-side barrier layer is provided between the well layer and the p-type layer.
    • 根据一个实施例,光学半导体器件包括n型半导体层,p型半导体层和功能部件。 功能部件设置在n型半导体层和p型半导体层之间。 功能部件包括在从n型半导体层朝向p型半导体层的方向上堆叠的多个有源层。 至少两个有源层包括多层堆叠体,n侧阻挡层,阱层和p侧势垒层。 多层堆叠体包括沿该方向交替堆叠的多个厚膜层和多个薄膜层。 n侧阻挡层设置在多层叠层体和p型层之间。 阱层设置在n侧阻挡层和p型层之间。 p侧阻挡层设置在阱层和p型层之间。