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71. 发明申请

US20090057864A1 INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING AN OFFSET STACKED CONFIGURATION 有权
标题翻译：集成电路封装系统采用偏移堆叠配置
公开(公告)号：US20090057864A1
公开(公告)日：2009-03-05
申请号：US12201896
申请日：2008-08-29
申请人： DaeSik Choi , BumJoon Hong , Sang-Ho Lee , Jong-Woo Ha , Soo-San Park
发明人： DaeSik Choi , BumJoon Hong , Sang-Ho Lee , Jong-Woo Ha , Soo-San Park
IPC分类号： H01L23/488 , H01L21/58
CPC分类号： H01L24/81 , H01L23/552 , H01L24/14 , H01L24/17 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L25/03 , H01L25/105 , H01L2224/1134 , H01L2224/131 , H01L2224/16225 , H01L2224/32014 , H01L2224/32145 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/81194 , H01L2224/81801 , H01L2224/83 , H01L2224/8592 , H01L2225/06562 , H01L2225/1023 , H01L2225/1058 , H01L2225/1088 , H01L2924/00013 , H01L2924/01013 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/3511 , H01L2924/00014 , H01L2224/13099 , H01L2924/00012 , H01L2924/00011 , H01L2924/00
摘要： A method for manufacturing an integrated circuit package system includes: providing a base package including a first integrated circuit coupled to a base substrate by an electrical interconnect formed on one side; and mounting an offset package over the base package, the offset package electrically coupled to the base substrate via a system interconnect.
摘要翻译：一种用于制造集成电路封装系统的方法，包括：通过在一侧形成的电互连，提供包括耦合到基底基板的第一集成电路的基底封装; 以及将偏移封装安装在所述基底封装上，所述偏移封装通过系统互连电耦合到所述基底衬底。

72. 发明申请

US20080242053A1 INTEGRATED CIRCUIT SYSTEM WITH A DEBRIS TRAPPING SYSTEM 有权
标题翻译：集成电路系统与DEBRIS TRAPPING系统
公开(公告)号：US20080242053A1
公开(公告)日：2008-10-02
申请号：US11694933
申请日：2007-03-30
申请人： Taewoo Lee , Sang-Ho Lee , BoHan Yoon
发明人： Taewoo Lee , Sang-Ho Lee , BoHan Yoon
IPC分类号： H01L21/00
CPC分类号： H01L21/78 , H01L21/3043 , H01L21/67132 , H01L21/6835 , H01L21/6836 , H01L2221/68327 , H01L2221/6834
摘要： An integrated circuit system including: providing an integrated circuit wafer having an integrated circuit side and a backside; mounting a protective adhesive on the integrated circuit side of the integrated circuit wafer; removing material from the backside of the integrated circuit wafer; and dicing the integrated circuit wafer through the protective adhesive to form an integrated circuit die.
摘要翻译：一种集成电路系统，包括：提供具有集成电路侧和背面的集成电路晶片; 在集成电路晶片的集成电路侧上安装保护性粘合剂; 从集成电路晶片的背面去除材料; 并且通过保护性粘合剂对集成电路晶片进行切割以形成集成电路管芯。

73. 发明申请

US20080006921A1 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ULTRA-THIN DIE 有权
标题翻译：集成电路包装系统超薄薄膜
公开(公告)号：US20080006921A1
公开(公告)日：2008-01-10
申请号：US11456554
申请日：2006-07-10
申请人： Soo-San Park , Sang-Ho Lee , Jong-Woo Ha
发明人： Soo-San Park , Sang-Ho Lee , Jong-Woo Ha
IPC分类号： H01L23/02 , H01L23/52
CPC分类号： H01L25/0657 , H01L23/3128 , H01L24/03 , H01L24/05 , H01L24/48 , H01L25/50 , H01L2224/0401 , H01L2224/04042 , H01L2224/05556 , H01L2224/05599 , H01L2224/06183 , H01L2224/16 , H01L2224/2919 , H01L2224/32225 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/85399 , H01L2224/85444 , H01L2225/06506 , H01L2225/0651 , H01L2225/06527 , H01L2225/06551 , H01L2924/00014 , H01L2924/01014 , H01L2924/01079 , H01L2924/014 , H01L2924/10253 , H01L2924/1305 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/30107 , H01L2924/0665 , H01L2224/45099 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit packaging system with ultra-thin die is provided including providing an ultra-thin integrated circuit stack, having a vertical sidewall contact, including providing a semiconductor wafer having an active side, forming a solder bump on the active side of the semiconductor wafer, forming a support layer over the solder bump and the active side of the semiconductor wafer, forming an ultra-thin wafer from the semiconductor wafer and singulating the ultra-thin integrated circuit stack for exposing the vertical sidewall contact, mounting the ultra-thin integrated circuit stack on a substrate, and coupling the substrate to the vertical sidewall contact.
摘要翻译：提供一种具有超薄管芯的集成电路封装系统，包括提供具有垂直侧壁接触的超薄集成电路堆叠，包括提供具有有源侧的半导体晶片，在半导体晶片的有源侧上形成焊料凸块在焊料凸块和半导体晶片的有源侧上形成支撑层，从半导体晶片形成超薄晶片，并且对超薄集成电路堆叠进行单片化，以暴露垂直侧壁接触，安装超薄集成电路堆叠，并将衬底耦合到垂直侧壁接触。

74. 发明申请

US20070263194A1 METHOD OF EXPOSING A WAFER TO A LIGHT, AND RETICLE, RETICLE ASSEMBLY AND EXPOSING APPARATUS FOR PERFORMING THE SAME 审中-公开
标题翻译：将光照射到灯的方法，以及用于实施其的反射装置和曝光装置
公开(公告)号：US20070263194A1
公开(公告)日：2007-11-15
申请号：US11830439
申请日：2007-07-30
申请人： Byong-Cheol Park , Dong-Hwa Shin , Seung-Ki Chae , Sang-Ho Lee
发明人： Byong-Cheol Park , Dong-Hwa Shin , Seung-Ki Chae , Sang-Ho Lee
IPC分类号： G03F1/00
CPC分类号： G03F7/70425 , G03B27/42 , G03F7/70466
摘要： A method of exposing a wafer to a light comprises transferring an image onto a plurality of shot areas by irradiating a projection light, each of the plurality of shot areas including at least one die area defined on the wafer on which a photoresist film is formed, and scanning the at least one die area adjacent to an edge portion of the wafer by irradiating a scanning light.
摘要翻译：将晶片暴露于光的方法包括通过照射投影光将图像转印到多个照射区域上，所述多个照射区域中的每一个包括限定在其上形成有光致抗蚀剂膜的晶片上的至少一个管芯区域，并通过照射扫描光来扫描与晶片的边缘部分相邻的至少一个管芯区域。

75. 发明授权

US07264008B2 Apparatus for cleaning a wafer 失效
标题翻译：清洁晶片的装置
公开(公告)号：US07264008B2
公开(公告)日：2007-09-04
申请号：US10608074
申请日：2003-06-30
申请人： Dong-Hyun Kim , Sang-Ho Lee
发明人： Dong-Hyun Kim , Sang-Ho Lee
IPC分类号： B08B3/00
CPC分类号： H01L21/67051 , B08B3/02 , Y10S134/902
摘要： An apparatus for cleaning a wafer includes a plurality of holders for contacting and securing peripheral portions of a wafer, and for rotating the wafer, a first plate disposed to face a first surface of the wafer, the first plate having a plurality of first nozzles for spraying a first cleaning solution onto the first surface of the wafer, and a second plate disposed to face a second surface of the wafer that is opposite to the first surface, the second plate having a plurality of second nozzles for spraying a second cleaning solution onto the second surface of the wafer. In operation, the first and second plates and the wafer are rotated in opposite directions. The opposite rotation causes the cleaning solutions to flow abruptly thereby increasing a frictional force between the surfaces on the wafer and the cleaning solutions to improve the efficiency of the cleaning process.
摘要翻译：一种用于清洁晶片的设备包括多个保持器，用于接触和固定晶片的周边部分，并且用于旋转晶片，设置成面对晶片的第一表面的第一板，所述第一板具有多个第一喷嘴，将第一清洗溶液喷射到晶片的第一表面上，以及设置成面对与第一表面相对的晶片的第二表面的第二板，第二板具有多个第二喷嘴，用于将第二清洁溶液喷射到晶片的第二表面。在操作中，第一和第二板和晶片沿相反的方向旋转。相反的旋转导致清洁溶液突然流动，从而增加了晶片表面和清洁溶液之间的摩擦力，以提高清洁过程的效率。

76. 发明申请

US20070158833A1 INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING STACKED DIE 有权
标题翻译：集成电路封装系统，包括堆叠式DIE
公开(公告)号：US20070158833A1
公开(公告)日：2007-07-12
申请号：US11306627
申请日：2006-01-04
申请人： Soo-San Park , Hyeog Kwon , Sang-Ho Lee , Jong-Woo Ha
发明人： Soo-San Park , Hyeog Kwon , Sang-Ho Lee , Jong-Woo Ha
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L25/0657 , H01L21/561 , H01L23/3128 , H01L25/03 , H01L25/50 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2225/0651 , H01L2225/06555 , H01L2924/14 , H01L2924/15311 , H01L2924/00014 , H01L2924/00
摘要： An integrated circuit package system is provided including providing a wafer with bond pads formed on the wafer. A solder bump is deposited on one or more bond pads. The bond pads and the solder bump are embedded within a mold compound formed on the wafer. A groove is formed in the mold compound to expose a portion of the solder bump. The wafer is singulated into individual die structures at the groove.
摘要翻译：提供了一种集成电路封装系统，其包括在晶片上提供形成有接合焊盘的晶片。焊料凸块沉积在一个或多个焊盘上。接合焊盘和焊料凸块嵌入在晶片上形成的模具化合物中。在模具化合物中形成凹槽以暴露焊料凸块的一部分。将晶片在凹槽处分成单独的模具结构。

77. 发明申请

US20070153685A1 Wireless communication system and method for managing service flow identifier in the same 有权
标题翻译：用于管理业务流标识符的无线通信系统和方法
公开(公告)号：US20070153685A1
公开(公告)日：2007-07-05
申请号：US11636784
申请日：2006-12-11
申请人： Jung-Mo Moon , Sang-Ho Lee
发明人： Jung-Mo Moon , Sang-Ho Lee
IPC分类号： H04L12/26 , H04Q7/00
CPC分类号： H04W8/26 , H04W36/08
摘要： The present invention relates to a wireless communication system and a service flow identifier method of the system. The wireless communication system includes a plurality of PARs that provides wireless communication services to a plurality of access terminals through a plurality of access points for separate management of service flow identifiers. The PARs include a service flow identifier controller for managing a service flow identifier used for identifying a connection service of each access terminal. The service flow identifier controller manages a service flow identifier generated by a home PAR and a service flow identifier generated by another PAR among service flow identifiers of an access terminal that has performed handoff from the other PAR to the home PAR. The wireless communication system manages service flow identifiers by using a separate control method, thereby preventing interruption of the entire system network operation due to a signal system error.
摘要翻译：本发明涉及一种系统的无线通信系统和服务流识别方法。无线通信系统包括多个PAR，其通过多个接入点向多个接入终端提供无线通信服务，用于单独管理业务流标识符。 PAR包括用于管理用于识别每个接入终端的连接服务的服务流标识符的服务流标识符控制器。服务流标识符控制器管理由家庭PAR产生的服务流标识符和由另一个PAR生成的服务流标识符，该服务流标识符已经执行了从其他PAR到家庭PAR的切换的接入终端的服务流标识符。无线通信系统通过使用单独的控制方法来管理服务流标识符，从而防止由于信号系统错误而导致的整个系统网络操作的中断。

78. 发明授权

US07220863B2 Process for preparing 2-aminopyridine derivatives 失效
标题翻译： 2-氨基吡啶衍生物的制备方法
公开(公告)号：US07220863B2
公开(公告)日：2007-05-22
申请号：US11209919
申请日：2005-08-23
申请人： Tae-Ho Park , Long-Xuan Zhao , Sang-Ho Lee
发明人： Tae-Ho Park , Long-Xuan Zhao , Sang-Ho Lee
IPC分类号： C07D211/72
CPC分类号： C07D213/73 , C07D213/77
摘要： A method for preparing 2-aminopyridine derivatives, which comprises substituting of fluorine for hydrazine moiety and reducing with hydrogen using 3-substituted-2,5,6-trifluoropyridine as a starting material, provides 2-aminopyridine derivatives having a purity over 98% under a mild reaction condition.
摘要翻译：制备2-氨基吡啶衍生物的方法，其包括用氟取代肼部分并用3-取代-2,5,6-三氟吡啶作为起始原料用氢还原，得到纯度为98％以上的2-氨基吡啶衍生物，反应条件温和。

79. 发明申请

US20060001852A1 Method and apparatus for exposing semiconductor substrates 有权
标题翻译：曝光半导体衬底的方法和装置
公开(公告)号：US20060001852A1
公开(公告)日：2006-01-05
申请号：US11168527
申请日：2005-06-29
申请人： Sang-Ho Lee , Jin-Phil Choi , Dong-Hwa Shin , Seung-Ki Chae , Byong-Cheol Park
发明人： Sang-Ho Lee , Jin-Phil Choi , Dong-Hwa Shin , Seung-Ki Chae , Byong-Cheol Park
IPC分类号： G03B27/42
CPC分类号： G03B27/42 , G03F7/70275
摘要： Provided are methods and apparatus for exposing multiple substrates within a single exposing apparatus using only a single light source wherein a first substrate is exposed in a series of steps or shots during which light transmitted along a primary optical path is directed onto a primary surface of the substrate with the substrate being repositioned between sequential shots. A second substrate is exposed during the period of time while the first substrate is being repositioned by altering the optical path to divert the light from the light source into a secondary optical path that will expose a region on the second substrate. When the first substrate has been repositioned, the diversion of the light is terminated so that the light will again be transmitted along the primary optical path in order to expose the next sequential shot on the primary surface of the first substrate.
摘要翻译：提供了用于仅使用单个光源在单个曝光设备中曝光多个基板的方法和设备，其中第一基板以一系列步骤或照射曝光，在此期间沿主要光学路径传输的光被引导到衬底，其中衬底在连续镜头之间重新定位。第二衬底在一段时间期间被曝光，同时通过改变光路来重新定位第一衬底，以将来自光源的光转移到将暴露第二衬底上的区域的次级光路。当第一衬底被重新定位时，光的转向被终止，使得光将再次沿着主光路传播，以便暴露第一衬底的主表面上的下一个顺序射击。

80. 发明申请

US20050142439A1 Pouch type lithium secondary battery 审中-公开
标题翻译：袋型锂二次电池
公开(公告)号：US20050142439A1
公开(公告)日：2005-06-30
申请号：US11020697
申请日：2004-12-27
申请人： Sang-Ho Lee , Sang-Do Heo
发明人： Sang-Ho Lee , Sang-Do Heo
IPC分类号： H01M2/02 , H01M2/06 , H01M2/08 , H01M2/10 , H01M10/38
CPC分类号： H01M2/0275 , H01M2/021 , H01M2/0217 , H01M2/0267 , H01M2/0287 , H01M2/08 , H01M10/425 , H01M2200/106
摘要： The present invention is related to a pouch type lithium secondary battery. The pouch type lithium secondary battery according to the present invention may comprise an electrode assembly including a positive electrode, a separator and a negative electrode, and a pouch having a groove for receiving the electrode assembly and upper and lower portions of which are fused to each other around the groove to form flange-shaped edges. In particular, the edges may be at least partially covered at ends thereof with insulating material. As a result, a short circuit between a metal foil of the pouch and the negative electrode of the battery can be prevented, and corrosion of the battery may be also prevented.
摘要翻译：本发明涉及袋型锂二次电池。根据本发明的袋型锂二次电池可以包括包括正电极，隔膜和负电极的电极组件和具有用于容纳电极组件的槽的袋，其上部和下部与每个其他围绕凹槽形成法兰形边。特别地，边缘可以在其端部至少部分地用绝缘材料覆盖。结果，可以防止袋的金属箔与电池的负极之间的短路，并且还可以防止电池的腐蚀。

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