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    • 71. 发明授权
    • Integrated circuit memory array with fast test mode utilizing multiple word line selection and method therefor
    • 具有快速测试模式的集成电路存储器阵列,利用多种字线选择及其方法
    • US06768685B1
    • 2004-07-27
    • US09990894
    • 2001-11-16
    • Roy E. Scheuerlein
    • Roy E. Scheuerlein
    • G11C700
    • G11C29/34G11C2029/1202G11C2029/2602
    • In a programmable memory array, multiple memory cells on a single bit line may be tested in parallel for the unprogrammed state by simultaneously selecting multiple word lines associated with a selected bit line within a sub-array. A read current flowing through each selected memory cell is added on the selected bit line, and may be sensed using the same bit line sense circuits used for normal read operations. In the test mode, the sense circuit preferably indicates a pass/fail condition for all N simultaneously selected memory cells, which may be directly conveyed as an output signal, or may be combined with other similar pass/fail signals from other selected bit line sense circuits to generate a combined pass/fail output signal. Multiple bit lines may be simultaneously selected within the same sub-array. In addition, multiple sub-arrays may be simultaneously selected, each having one or more simultaneously selected bit lines, and the respective pass/fail signals conveyed directly or combined into fewer numbers of such signals.
    • 在可编程存储器阵列中,通过同时选择与子阵列内的所选位线相关联的多个字线,可以对未编程状态并行测试单个位线上的多个存储器单元。 流经每个所选择的存储单元的读取电流被添加到所选择的位线上,并且可以使用用于正常读取操作的相同位线检测电路来感测。 在测试模式中,感测电路优选地表示可以直接作为输出信号传送的所有N个同时选择的存储器单元的通过/失败条件,或者可以与来自其他所选位线检测的其他类似的通过/失败信号组合 生成组合的通过/失败输出信号的电路。 可以在同一子阵列内同时选择多个位线。 此外,可以同时选择多个子阵列,每个子阵列具有一个或多个同时选择的位线,并且相应的通过/失败信号被直接传送或组合成较少数量的这种信号。
    • 72. 发明授权
    • Memory device and method for temperature-based control over write and/or read operations
    • 用于对写入和/或读取操作进行温度控制的存储器件和方法
    • US06735546B2
    • 2004-05-11
    • US09944613
    • 2001-08-31
    • Roy E. Scheuerlein
    • Roy E. Scheuerlein
    • G06F1500
    • G11C7/04G01K3/005
    • The preferred embodiments described herein provide a memory device and method for temperature-based control over write and/or read operations. In one preferred embodiment, the temperature of a memory array is monitored, and a write operation to the memory array is prevented in response to the monitored temperature reaching a threshold temperature. In another preferred embodiment, the temperature of a memory array is monitored, and a read operation from the memory array is prevented in response to the monitored temperature reaching a threshold temperature. Other preferred embodiments are provided, and each of the preferred embodiments can be used alone or in combination with one another.
    • 本文所述的优选实施例提供了一种用于基于写入和/或读取操作的基于温度的控制的存储器件和方法。 在一个优选实施例中,监视存储器阵列的温度,并且响应于所监视的温度达到阈值温度来防止对存储器阵列的写入操作。 在另一优选实施例中,监视存储器阵列的温度,并且响应于所监视的温度达到阈值温度来防止来自存储器阵列的读取操作。 提供了其它优选实施方案,并且每个优选实施方案可以单独使用或彼此组合使用。
    • 74. 发明授权
    • Method and apparatus for discharging memory array lines
    • 用于放电存储器阵列线的方法和装置
    • US06504753B1
    • 2003-01-07
    • US09897784
    • 2001-06-29
    • Roy E. ScheuerleinMatthew P. Crowley
    • Roy E. ScheuerleinMatthew P. Crowley
    • G11C1136
    • G11C8/08G11C7/062G11C7/067G11C7/18G11C2207/063
    • A passive element memory array preferably biases selected X-lines to an externally received VPP voltage and selected Y-lines to ground. Unselected Y-lines are preferably biased to VPP minus a first offset voltage, and unselected X-lines biased to a second offset voltage (relative to ground). The first and second offset voltages preferably are identical and have a value of about 0.5 to 2 volts. The VPP voltage depends upon the memory cell technology used, and preferably falls within the range of 5 to 20 volts. The area otherwise required for an on-chip VPP generator and saves the power that would be consumed by such a generator. In addition, the operating temperature of the integrated circuit during the programming operation decreases, which further decreases power dissipation. When discharging the memory array, the capacitance between layers is preferably discharged first, then the layers are discharged to ground.
    • 无源元件存储器阵列优选地将所选择的X线偏置到外部接收的VPP电压,并将选定的Y线偏置到地。 未选择的Y线优选地偏置到VPP减去第一偏移电压,并且偏置到第二偏移电压(相对于地)的未选择的X线。 第一和第二偏移电压优选地相同并且具有约0.5至2伏特的值。 VPP电压取决于所使用的存储器单元技术,优选落在5至20伏的范围内。 片上VPP发生器所需的区域,并节省了这种发电机将消耗的功率。 此外,编程操作期间集成电路的工作温度降低,这进一步降低了功耗。 当放电存储器阵列时,层间的电容最好首先放电,然后将这些层放电到地。
    • 78. 发明授权
    • Multi-bit resistance-switching memory cell
    • 多位电阻切换存储单元
    • US08649206B2
    • 2014-02-11
    • US13396489
    • 2012-02-14
    • Roy E. Scheuerlein
    • Roy E. Scheuerlein
    • G11C11/00
    • G11C13/0007G11C11/5685G11C13/0069G11C2013/0078G11C2213/32G11C2213/34G11C2213/71G11C2213/72
    • A non-volatile storage apparatus comprises a set of Y lines, a set of X lines and a plurality of memory cells in communication with the set of X lines and the set of Y lines. Each memory cell of the plurality of memory cells includes a resistance element in a static resistance condition and two or more reversible resistance-switching elements. The resistance element in the static resistance condition and the two or more reversible resistance-switching elements are connected to different Y lines of the set of Y lines. The resistance element in the low resistance state and the two or more reversible resistance-switching elements are connected to a common X line of the set of X lines. One or multiple bits of data are programmed into a particular memory cell of the plurality of memory cells by causing current flow between Y lines connected to the particular memory cell.
    • 非易失性存储装置包括一组Y线,一组X线和与该X线组和Y线组通信的多个存储单元。 多个存储单元的每个存储单元包括静态电阻状态的电阻元件和两个或多个可逆电阻切换元件。 静态电阻状态下的电阻元件和两个以上的可逆电阻切换元件被连接到该Y线组的不同Y线。 低电阻状态下的电阻元件和两个或更多个可逆电阻切换元件连接到该X线组的公共X线。 一个或多个数据位通过在连接到特定存储单元的Y线之间引起电流而编程到多个存储单元的特定存储单元中。