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    • 73. 发明申请
    • Thin film transistors and semiconductor constructions
    • 薄膜晶体管和半导体结构
    • US20070102705A1
    • 2007-05-10
    • US11644863
    • 2006-12-21
    • Gurtej SandhuShubneesh BatraPierre Fazan
    • Gurtej SandhuShubneesh BatraPierre Fazan
    • H01L29/04H01L29/786
    • H01L29/78678H01L27/1214H01L27/127H01L29/04H01L29/6675H01L29/66757H01L29/66765H01L29/78672H01L29/78675
    • A method of forming a thin film transistor relative to a substrate includes, a) providing a thin film transistor layer of polycrystalline material on a substrate, the polycrystalline material comprising grain boundaries; b) providing a fluorine containing layer adjacent the polycrystalline thin film layer; c) annealing the fluorine containing layer at a temperature and for a time period which in combination are effective to drive fluorine from the fluorine containing layer into the polycrystalline thin film layer and incorporate fluorine within the grain boundaries to passivate said grain boundaries; and d) providing a transistor gate operatively adjacent the thin film transistor layer. The thin film transistor can be fabricated to be bottom gated or top gated. A buffering layer can be provided intermediate the thin film transistor layer and the fluorine containing layer, with the buffering layer being transmissive of fluorine from the fluorine containing layer during the annealing. Preferably, the annealing temperature is both sufficiently high to drive fluorine from the fluorine containing layer into the polycrystalline thin film layer and incorporate fluorine within the grain boundaries to passivate said grain boundaries, but sufficiently low to prevent chemical reaction of the fluorine containing layer with the polycrystalline thin film layer.
    • 相对于衬底形成薄膜晶体管的方法包括:a)在衬底上提供多晶材料的薄膜晶体管层,所述多晶材料包括晶界; b)在多晶薄膜层附近提供含氟层; c)在一段温度和一段时间内退火含氟层,所述时间段有效地将氟从含氟层驱动到多晶薄膜层中,并且在晶界内引入氟以钝化所述晶界; 以及d)提供与所述薄膜晶体管层可操作地相邻的晶体管栅极。 薄膜晶体管可以被制造为底部门控或顶部门控。 可以在薄膜晶体管层和含氟层之间设置缓冲层,缓冲层在退火期间从含氟层透过氟。 优选地,退火温度足够高以将氟从含氟层驱动到多晶薄膜层中并且在晶界内引入氟以使所述晶界钝化,但是足够低以防止含氟层与 多晶薄膜层。
    • 75. 发明申请
    • Low power programming technique for a floating body memory transistor, memory cell, and memory array
    • 用于浮体存储晶体管,存储单元和存储器阵列的低功耗编程技术
    • US20060114717A1
    • 2006-06-01
    • US11334338
    • 2006-01-17
    • Pierre FazanSerguei Okhonin
    • Pierre FazanSerguei Okhonin
    • G11C11/34
    • G11C11/404G11C2211/4016H01L27/108H01L27/10802H01L29/7841
    • There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a memory cell, architecture, and/or array and/or technique of writing or programming data into the memory cell (for example, a technique to write or program a logic low or State “0” in a memory cell employing an electrically floating body transistor. In this regard, the present invention programs a logic low or State “0” in the memory cell while the electrically floating body transistor is in the “OFF” state or substantially “OFF” state (for example, when the device has no (or practically no) channel and/or channel current between the source and drain). In this way, the memory cell may be programmed whereby there is little to no current/power consumption by the electrically floating body transistor and/or from memory array having a plurality of electrically floating body transistors.
    • 这里描述和说明了许多发明。 在一个方面,本发明涉及将数据写入或编程到存储器单元中的存储器单元,架构和/或阵列和/或技术(例如,写入或编程逻辑低或状态“0”的技术 在这方面,本发明在电浮动体晶体管处于“关”状态或基本上“关”的情况下,在存储单元中编程逻辑低或状态“0” 状态(例如,当器件在源极和漏极之间没有(或几乎不存在)通道和/或沟道电流)时,可以对存储器单元进行编程,由此存储器单元的电流/功耗很少 电浮体晶体管和/或具有多个电浮体晶体管的存储器阵列。
    • 80. 发明申请
    • Thin film transistors and semiconductor constructions
    • 薄膜晶体管和半导体结构
    • US20050156240A1
    • 2005-07-21
    • US11021651
    • 2004-12-22
    • Gurtej SandhuShubneesh BatraPierre Fazan
    • Gurtej SandhuShubneesh BatraPierre Fazan
    • H01L21/336H01L21/77H01L21/84H01L29/04H01L29/786H01L21/00H01L21/8242
    • H01L29/78678H01L27/1214H01L27/127H01L29/04H01L29/6675H01L29/66757H01L29/66765H01L29/78672H01L29/78675
    • A method of forming a thin film transistor relative to a substrate includes, a) providing a thin film transistor layer of polycrystalline material on a substrate, the polycrystalline material comprising grain boundaries; b) providing a fluorine containing layer adjacent the polycrystalline thin film layer; c) annealing the fluorine containing layer at a temperature and for a time period which in combination are effective to drive fluorine from the fluorine containing layer into the polycrystalline thin film layer and incorporate fluorine within the grain boundaries to passivate said grain boundaries; and d) providing a transistor gate operatively adjacent the thin film transistor layer. The thin film transistor can be fabricated to be bottom gated or top gated. A buffering layer can be provided intermediate the thin film transistor layer and the fluorine containing layer, with the buffering layer being transmissive of fluorine from the fluorine containing layer during the annealing. Preferably, the annealing temperature is both sufficiently high to drive fluorine from the fluorine containing layer into the polycrystalline thin film layer and incorporate fluorine within the grain boundaries to passivate said grain boundaries, but sufficiently low to prevent chemical reaction of the fluorine containing layer with the polycrystalline thin film layer.
    • 相对于衬底形成薄膜晶体管的方法包括:a)在衬底上提供多晶材料的薄膜晶体管层,所述多晶材料包括晶界; b)在多晶薄膜层附近提供含氟层; c)在一段温度和一段时间内退火含氟层,所述时间段有效地将氟从含氟层驱动到多晶薄膜层中,并且在晶界内引入氟以钝化所述晶界; 以及d)提供与所述薄膜晶体管层可操作地相邻的晶体管栅极。 薄膜晶体管可以被制造为底部门控或顶部门控。 可以在薄膜晶体管层和含氟层之间设置缓冲层,缓冲层在退火期间从含氟层透过氟。 优选地,退火温度足够高以将氟从含氟层驱动到多晶薄膜层中并且在晶界内引入氟以使所述晶界钝化,但是足够低以防止含氟层与 多晶薄膜层。