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    • 77. 发明授权
    • Manufacturing method of semiconductor integrated circuit device
    • 半导体集成电路器件的制造方法
    • US07387867B2
    • 2008-06-17
    • US10967277
    • 2004-10-19
    • Norio HasegawaKatsuya HayanoShoji Hotta
    • Norio HasegawaKatsuya HayanoShoji Hotta
    • G03F7/00
    • H01L21/76808G03F1/30G03F1/32G03F1/50H01L21/31144
    • In a massed region of each of a plurality of transfer areas of a mask a plurality of light transmission patterns are formed by opening a half-tone film. A phase shifter is disposed in each of the light transmission patterns so that a 180° phase inversion occurs between the lights that transmit through adjacent light transmission patterns. In a sparse region of the plurality of transfer areas a solitary light transmission pattern is formed by opening the half-tone film. Both shape and size are the same among the light transmission patterns, which are disposed symmetrically in both the massed and sparse regions about the center between the transfer areas. The phase shifters in the massed regions are disposed so that the phase of each phase shifter in one of the transfer areas comes to be opposed to that of its counterpart in the other transfer area. In the exposure process, those transfer areas are overlaid one upon another in the same chip region.
    • 在掩模的多个转印区域的每一个的质量区域中,通过打开半色调膜形成多个透光图案。 在每个透光图案中设置移相器,使得在通过相邻光传输图案传输的光之间发生180°的相位反转。 在多个转印区域的稀疏区域中,通过打开半色调膜形成单独的透光图案。 在透光图案之间的形状和尺寸都相同,所述光透射图案在转印区域之间的中心周围的质量和稀疏区域中对称地设置。 配置区域中的移相器被布置成使得其中一个传送区域中的每个移相器的相位与其它传送区域中的相应部件的相位相反。 在曝光处理中,这些传送区域在相同的芯片区域中彼此重叠。