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    • 72. 发明授权
    • Method and apparatus of inspecting foreign matters during mass
production start-up and mass production line in semiconductor
production process
    • 在半导体生产过程中批量生产启动和批量生产线中检查异物的方法和装置
    • US5233191A
    • 1993-08-03
    • US679317
    • 1991-04-02
    • Minori NoguchiYukio KemboHiroshi MoriokaHiroshi YamaguchiMakiko KohnoYoshimasa Ohshima
    • Minori NoguchiYukio KemboHiroshi MoriokaHiroshi YamaguchiMakiko KohnoYoshimasa Ohshima
    • G01N21/94G01N21/956G01Q10/00G01Q30/02G01Q30/04G01Q30/14G01Q60/10G01R31/311H01J37/256H01L21/00H01L21/66
    • H01L21/67253G01R31/311H01J37/256H01L21/67276H01L21/67288H01L22/20B82Y35/00G01N2021/8822G01N21/94G01N21/95623
    • Method and apparatus of detecting, analyzing and evaluating the content of foreign matters such as dusts and impurities contained in various materials, units, processes and environment standing for constituting components of a mass production line during mass production start-up and during mass production, in order to manage a semiconductor production process. A mass production off-line system including an apparatus for detecting, analyzing and evaluating the content of foreign matters during the mass production start-up is separated from the production line and installed independently thereof. Monitors for detection of foreign matters are provided at necessary locations in the production line and monitor data is evaluated through various units to manage the content of foreign matters in the production line, permitting efficient and economical mass production start-up and mass production. The kind of element of a foreign matter on sampling wafer detected in the mass production line is analyzed by means of STM/STS and the results are compared with a data base to effect identification. A foreign matter or a contaminant is detected by detecting a scatttered beam, of a light spot which scans the surface of a substrate. The detection of the scattered beam is carried out under the condition that Rayleigh scattering of the light spot on the light spot irradiation and reflection paths and Rayleigh scattering of the scattered beam on the scattered beam detection path are suppressed to a minimum. For the suppression of Rayleigh scattering, a low-pressure or low-temperature atmosphere may be used.
    • 检测,分析和评估大规模生产启动期间和批量生产期间大规模生产线组成部件的各种材料,单位,工艺和环境中所含的灰尘和杂质等杂质的含量, 为了管理半导体生产过程。 包括用于在批量生产启动期间检测,分析和评估异物含量的装置的批量生产离线系统与生产线分离并独立安装。 在生产线必需的位置提供检测异物的监测器,通过各种单位对监测数据进行评估,对生产线内的异物含量进行管理,实现高效,经济的批量生产启动和批量生产。 通过STM / STS分析在大规模生产线上检测到的采样晶圆上的异物元素的种类,并将结果与​​数据库进行比较以进行识别。 通过检测扫描基板表面的光斑的光斑光束来检测异物或污染物。 在光点照射和反射路径上的光斑的瑞利散射和散射光束检测路径上的散射光束的瑞利散射被抑制到最小的条件下进行散射光束的检测。 为了抑制瑞利散射,可以使用低压或低温气氛。
    • 74. 发明授权
    • Apparatus and method for inspecting defect on object surface
    • 检测物体表面缺陷的装置和方法
    • US08482728B2
    • 2013-07-09
    • US12244958
    • 2008-10-03
    • Sachio UtoHidetoshi NishiyamaMinori Noguchi
    • Sachio UtoHidetoshi NishiyamaMinori Noguchi
    • G01N21/00
    • H01L21/02334B08B6/00G01B11/0625G01B11/303G01N3/04G01N21/15G01N21/94G01N21/9501G01N21/95623G01N2021/9563H01L21/02057H01L21/02082
    • An aspect of the invention provides a defect inspection apparatus being able to accurately inspect a micro foreign matter or defect at a high speed for an inspection target substrate in which a repetitive pattern and a non-repetitive pattern are mixed. In a foreign matter anti-adhesive means 180, a transparent plate 187 is placed on a placement table 34 through a frame 185. In the foreign matter anti-adhesive means 180, a shaft 181 which is rotatably supported by two columnar supports 184 fixed onto a base 186 is coupled to a motor 182 by a coupling 183. The shaft 181 is inserted into a part of a frame 185 between the two columnar supports 184 such that the frame 185 and the transparent plate 187 are turnable about the shaft 181. Therefore, the whole of the frame 185 is opened and closed in a Z-direction about the shaft 181, and a wafer 1 on the placement table 34 can be covered with the frame 185 and the transparent plate 187.
    • 本发明的一个方面提供了一种缺陷检查装置,其能够精确地检查混合有重复图案和非重复图案的检查对象基板的高速微细异物或缺陷。 在异物防粘连装置180中,通过框架185将透明板187放置在放置台34上。在异物防粘装置180中,轴181可旋转地由两个柱状支撑件184支撑固定到 基座186通过联轴器183联接到马达18.轴181插入到两个柱状支撑件184之间的框架185的一部分中,使得框架185和透明板187围绕轴181可转动。因此 ,整个框架185围绕轴181沿Z方向打开和关闭,并且放置台34上的晶片1可以被框架185和透明板187覆盖。
    • 80. 发明授权
    • Pattern defect inspection apparatus and method
    • 图案缺陷检查装置及方法
    • US07746453B2
    • 2010-06-29
    • US12113781
    • 2008-05-01
    • Hidetoshi NishiyamaKei ShimuraSachio UtoMinori Noguchi
    • Hidetoshi NishiyamaKei ShimuraSachio UtoMinori Noguchi
    • G01N21/00
    • G01N21/95607G01N21/94G01N21/9501G01N2021/4711
    • A pattern defect inspection apparatus capable of detecting minute defects on a sample with high sensitivity without generating speckle noise in signals is realized. Substantially the same region on a surface of a wafer is detected by using two detectors at mutually different timings. Output signals from the two detectors are summed and averaged to eliminate noise. Since a large number of rays of illumination light are not simultaneously irradiated to the same region on the wafer, a pattern defect inspection apparatus capable of suppressing noise resulting from interference of a large number of rays, eliminating noise owing to other causes and detecting with high sensitivity minute defects on the sample without the occurrence of speckle noise in the signal can be accomplished.
    • 实现能够以高灵敏度检测样品上的微小缺陷而不产生信号中的斑点噪声的图案缺陷检查装置。 通过在相互不同的定时使用两个检测器来检测晶片表面上的基本上相同的区域。 来自两个检测器的输出信号被相加和平均以消除噪声。 由于大量的照明光线不能同时照射到晶片上的相同区域,所以能够抑制由于大量光线的干扰而产生的噪声的图案缺陷检查装置,消除由于其它原因引起的噪声和高检测 可以实现样品上的灵敏度微小缺陷,而不会在信号中发生斑点噪声。