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    • 72. 发明申请
    • Method for controlling programming voltage levels of non-volatile memory cells, the method tracking the cell features, and corresponding voltage regulator
    • US20050068803A1
    • 2005-03-31
    • US10651019
    • 2003-08-28
    • Paolo RolandiLuigi Pascucci
    • Paolo RolandiLuigi Pascucci
    • G11C11/00G11C11/34G11C16/12
    • G11C16/12
    • A method for controlling programming voltage levels of non-volatile memory cells comprises: providing a resistive divider connected to a programming voltage reference and effective to generate at least one programming voltage level; and providing a reference cell crossed by a cell current. Advantageously according to an embodiment of the invention the cell current is applied to the resistive divider to correlate the programming voltage level to the intrinsic features of the reference cell. A programming voltage regulator of non-volatile memory cells comprises at least an input stage inserted between a first and a second voltage reference and connected to a reference memory cell, as well as, in correspondence with its output terminal, to a resistive divider, inserted in turn between a programming voltage reference and the second voltage reference and connected to at least an output terminal of the regulator, effective to supply the programming voltage to the non-volatile memory cells. Advantageously according to an embodiment of the invention, the output terminal of the input stage is connected to a first circuit node of the resistive divider in correspondence with an end of a resistive element comprised in the resistive divider and having a further end connected to the programming voltage reference. In such a way, a voltage value obtained by shunting the programming voltage reference is applied at the first circuit node. The voltage regulator according to embodiments of the invention can be used in two-level contexts and in multilevel contexts, even for parallel programming of several multilevel memory cells.
    • 73. 发明授权
    • String programmable nonvolatile memory with NOR architecture
    • 具有NOR架构的字符串可编程非易失性存储器
    • US06683808B2
    • 2004-01-27
    • US10179553
    • 2002-06-24
    • Paolo Rolandi
    • Paolo Rolandi
    • G11C1604
    • G11C16/08G11C8/10
    • A nonvolatile memory having a NOR architecture has a memory array including a plurality of memory cells arranged in rows and columns in NOR configuration, the memory cells arranged on a same column being connected to one of a plurality of bit lines; and a column decoder. The column decoder comprises a plurality of selection stages, each of which is connected to respective bit lines and receives first bit line addressing signals. The selection stages comprise word programming selectors controlled by the first bit line addressing signals and supplying a programming voltage to only one of the bit lines of each selection stage. Each selection stage moreover comprises a string programming selection circuit controlled by second bit line addressing signals thereby simultaneously supplying the programming voltage to a plurality of the bit lines of each selection stage.
    • 具有NOR结构的非易失性存储器具有存储器阵列,其包括以NOR形状排列成行和列的多个存储单元,布置在同一列上的存储单元连接到多个位线之一; 和列解码器。 列解码器包括多个选择级,每个选择级连接到相应的位线并且接收第一位线寻址信号。 选择级包括由第一位线寻址信号控制的字编程选择器,并将编程电压提供给每个选择级的仅一位位线。 每个选择级还包括由第二位线寻址信号控制的串编程选择电路,从而同时将编程电压提供给每个选择级的多个位线。
    • 74. 发明授权
    • EEPROM having a peripheral integrated transistor with thick oxide
    • EEPROM具有具有厚氧化物的外围集成晶体管
    • US06570216B1
    • 2003-05-27
    • US09675753
    • 2000-09-29
    • Paolo Rolandi
    • Paolo Rolandi
    • H01L29792
    • H01L27/11526H01L27/105H01L27/11543
    • A process for manufacturing an integrated circuit provides for the formation of a matrix of floating-gate non-volatile memory cells having dual polysilicon levels, with the two polysilicon levels being isolated by a gate dielectric layer (4) and an interpoly dielectric layer (9) therebetween, and for the concurrent formation of one type of thick-oxide transistor (21) having an active area (7) in regions peripheral to the matrix. The process of the invention provides for removal, during the step of defining the first-level polysilicon (5), the polysilicon (5) from the active area (7) of the thick-oxide transistor (21), so that the gate oxide of the transistor (21) results from the superposition of the first (4) and second (9) dielectric layers.
    • 一种用于制造集成电路的工艺提供了形成具有双重多晶硅层级的浮栅非易失性存储单元矩阵,其中两个多晶硅层由栅极介电层(4)和多晶硅间介电层(9)隔离 ),并且用于在基体周边的区域中同时形成具有有源区(7)的一种类型的厚氧化物晶体管(21)。 本发明的方法提供了在从厚氧化物晶体管(21)的有源区域(7)定义第一级多晶硅(5),多晶硅(5)的步骤期间去除栅极氧化物 晶体管(21)由第一(4)和第二(9)电介质层的叠加产生。
    • 75. 发明授权
    • Method and circuit for testing memory cells in a multilevel memory device
    • 用于测试多电平存储器件中的存储单元的方法和电路
    • US06301157B1
    • 2001-10-09
    • US09415024
    • 1999-10-07
    • Marco RivaPaolo RolandiMassimo Montanaro
    • Marco RivaPaolo RolandiMassimo Montanaro
    • G11C1606
    • G11C29/50G06F2201/81G11C11/56G11C11/5642G11C2029/5006G11C2211/5634
    • A method for testing memory cells, and in particular virgin memory cells, in a multilevel memory device having a plurality of memory cells. The method includes reading the individual memory cells that constitute a memory device and comparing each one of these memory cells with at least one reference memory cell at a time, so as to determine whether the threshold of the memory cells is lower than the threshold of the at least one reference memory cell or not; determining the number of the memory cells whose threshold is higher than the threshold of the at least one reference cell; the at least one reference memory cell being chosen with a gradually higher threshold; when the number of memory cells whose threshold is higher than a given reference threshold is found to be sufficiently lower than the number of redundancy memory cells provided in the memory device, assuming the given reference threshold as lower reference threshold for the memory device, determining a statistical distribution of the thresholds of the memory cells.
    • 一种用于在具有多个存储器单元的多电平存储器件中测试存储器单元,特别是处理存储器单元的方法。 该方法包括读取构成存储器件的各个存储器单元,并且每次将这些存储器单元中的每一个与至少一个参考存储器单元进行比较,以便确定存储器单元的阈值是否低于 至少一个参考存储器单元; 确定其阈值高于所述至少一个参考小区的阈值的存储器单元的数量; 所述至少一个参考存储器单元被选择为具有逐渐更高的阈值; 当阈值高于给定参考阈值的存储单元的数量被发现足够低于设置在存储器件中的冗余存储单元的数量时,假定给定参考阈值为存储器件的较低参考阈值,则确定 存储单元阈值的统计分布。
    • 76. 发明授权
    • Synchronous multilevel non-volatile memory and related reading method
    • 同步多级非易失性存储器及相关读取方式
    • US06198660B1
    • 2001-03-06
    • US09572127
    • 2000-05-17
    • Paolo Rolandi
    • Paolo Rolandi
    • G11C1604
    • G11C7/1072G11C5/025G11C8/00G11C11/56G11C11/5621G11C11/5642G11C16/08
    • The memory and method for reading include a synchronous multilevel non-volatile memory with cell addresses which define a pair of memory cells on different planes of the multilevel memory and plane addresses which define the plane on which the memory cell defined by a memory cell address is to be read. The memory and method include switching the plane address at a preset time interval after the switching of a memory address and at the highest possible switching frequency, and reading the content of a memory location, from the memory, which corresponds to the memory address on planes alternatively indicated by the switching of the plane address.
    • 用于读取的存储器和方法包括具有单元地址的同步多电平非易失性存储器,其定义多层存储器的不同平面上的一对存储器单元和限定由存储器单元地址定义的存储器单元的平面的平面地址 要读 存储器和方法包括在切换存储器地址并且以最高可能的切换频率之后以预设的时间间隔切换平面地址,并且从存储器读取对应于平面上的存储器地址的存储器位置的内容 或者通过切换飞机地址来指示。
    • 77. 发明授权
    • Process for manufacturing an EEPROM having a peripheral transistor with
thick oxide
    • 用于制造具有厚氧化物的外围晶体管的EEPROM的工艺
    • US6156610A
    • 2000-12-05
    • US840327
    • 1997-04-28
    • Paolo Rolandi
    • Paolo Rolandi
    • H01L21/8247H01L27/105H01L21/8238H01L21/336H01L29/792
    • H01L27/11526H01L27/105H01L27/11543
    • A process for manufacturing an integrated circuit provides for the formation of a matrix of floating-gate non-volatile memory cells having dual polysilicon levels, with the two polysilicon levels being isolated by a gate dielectric layer (4) and an interpoly dielectric layer (9) therebetween, and for the concurrent formation of one type of thick-oxide transistor (21) having an active area (7) in regions peripheral to the matrix. The process of the invention provides for removal, during the step of defining the first-level polysilicon (5), the polysilicon (5) from the active area (7) of the thick-oxide transistor (21), so that the gate oxide of the transistor (21) results from the superposition of the first (4) and second (9) dielectric layers.
    • 一种用于制造集成电路的工艺提供了形成具有双重多晶硅层级的浮栅非易失性存储单元矩阵,其中两个多晶硅层由栅极介电层(4)和多晶硅间介电层(9)隔离 ),并且用于在基体周边的区域中同时形成具有有源区(7)的一种类型的厚氧化物晶体管(21)。 本发明的方法提供了在从厚氧化物晶体管(21)的有源区域(7)定义第一级多晶硅(5),多晶硅(5)的步骤期间去除栅极氧化物 晶体管(21)由第一(4)和第二(9)电介质层的叠加产生。
    • 78. 发明授权
    • Device and method for increasing the internal address of a memory device
using multifunctional terminals
    • 使用多功能终端增加存储设备的内部地址的设备和方法
    • US6115801A
    • 2000-09-05
    • US49858
    • 1998-03-27
    • Paolo Rolandi
    • Paolo Rolandi
    • G11C5/06G06F12/00
    • G11C5/066
    • A semiconductor integrated, storage circuit device having at least a first enable terminal for enabling the device, and a first number of address terminals for inputting an external address formed of a corresponding first number of bits. The device comprises a plurality of data storage elements which are addressable by an internal address formed of a second number of bits larger than said first number, and further comprises address storage elements which are coupleable with their inputs to the first enable terminal for storing additional address bits. Thus, the internal address is comprised of the external address and the additional address bits.
    • 一种半导体集成存储电路装置,具有至少一个用于启用该装置的第一使能端子以及用于输入由相应的第一位数形成的外部地址的第一数量的地址端子。 所述设备包括多个数据存储元件,所述多个数据存储元件可由通过大于所述第一数量的第二数量位形成的内部地址寻址,并且还包括可与其输入耦合到所述第一使能端的地址存储元件,用于存储附加地址 位。 因此,内部地址由外部地址和附加地址位构成。