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71. 发明申请

US20050227379A1 Laser patterning of light emitting devices and patterned light emitting devices 有权
标题翻译：发光器件和图案化发光器件的激光图案化
公开(公告)号：US20050227379A1
公开(公告)日：2005-10-13
申请号：US10815293
申请日：2004-04-01
申请人： Matthew Donofrio
发明人： Matthew Donofrio
IPC分类号： B23K26/00 , B23K26/06 , B23K26/40 , H01L21/027 , H01L21/04 , H01L33/00 , H01L33/20 , H01L33/32 , H01L21/00 , H01L29/06 , H01L31/0328 , H01L31/0336 , H01L31/072 , H01L31/109
CPC分类号： H01L33/20 , B23K26/066 , B23K26/40 , B23K2101/40 , B23K2103/50 , B23K2103/52 , H01L33/0095 , H01L33/32 , Y10S438/94
摘要： Light extraction features are provided for a light emitting device having a substrate and a semiconductor light emitting element on the substrate by shaping a surface of a layer of semiconductor material utilizing a laser to define three dimensional patterns in the layer of semiconductor material. The layer of semiconductor material may be the substrate. In particular embodiments of the present invention, the surface of the layer of semiconductor material is shaped by applying laser light to the layer of semiconductor material at an energy sufficient to remove material from the layer of semiconductor material. The laser light may also by applied in a blanket manner at a level below the ablation threshold. The application of laser light to the layer of semiconductor material may be followed by etching the substrate. The layer of semiconductor material may be anisotropically etched. A mask could also be patterned utilizing laser light and the layer of semiconductor material etched using the mask. Light emitting devices have three dimensional patterns in a layer of semiconductor material of the device are also provided.
摘要翻译：通过使用激光对半导体材料层的表面进行成形以在半导体材料层中形成三维图案，为具有衬底和半导体发光元件的发光器件提供光提取特征。半导体材料层可以是衬底。在本发明的特定实施例中，半导体材料层的表面通过以足以从半导体材料层去除材料的能量将激光施加到半导体材料层而成形。也可以以低于消融阈值的水平以橡皮布方式施加激光。将激光应用于半导体材料层之后可以蚀刻基板。可以各向异性地蚀刻半导体材料层。也可以使用激光对掩模进行图案化，并使用掩模蚀刻半导体材料层。还提供了发光器件在器件的半导体材料层中具有三维图案。

72. 发明申请

US20050151138A1 Methods of processing semiconductor wafer backsides having light emitting devices (LEDS) thereon and leds so formed 有权
标题翻译：处理其上具有发光器件（LEDS）的半导体晶片背面和如此形成的LED的方法
公开(公告)号：US20050151138A1
公开(公告)日：2005-07-14
申请号：US10987135
申请日：2004-11-12
申请人： David Slater , Matthew Donofrio
发明人： David Slater , Matthew Donofrio
IPC分类号： H01L21/78 , H01L33/00 , H01L33/20 , H01L21/00 , H01L27/15 , H01L29/26 , H01L31/12
CPC分类号： H01L33/0095 , H01L21/78 , H01L33/20
摘要： Processing a semiconductor wafer can include forming a plurality of Light Emitting Devices (LED) on a semiconductor wafer having a first thickness. The plurality of LEDs on the wafer are brought into contact with a surface of a carrier to couple the wafer to the carrier. The first thickness of the wafer is reduced to a second thickness that is less than the first thickness by processing the backside of the wafer. The carrier is separated from the plurality of LEDs on the wafer and the wafer is cut to separate the plurality of LEDs from one another. Related devices are also disclosed.
摘要翻译：处理半导体晶片可以包括在具有第一厚度的半导体晶片上形成多个发光器件（LED）。使晶片上的多个LED与载体的表面接触以将晶片耦合到载体。通过处理晶片的背面，将晶片的第一厚度减小到小于第一厚度的第二厚度。载体与晶片上的多个LED分离，并且切割晶片以将多个LED彼此分离。还公开了相关设备。

73. 发明授权

US09754926B2 Light emitting diode (LED) arrays including direct die attach and related assemblies 有权
公开(公告)号：US09754926B2
公开(公告)日：2017-09-05
申请号：US13027006
申请日：2011-02-14
申请人： Matthew Donofrio , John Adam Edmond , Hua-Shuang Kong , Peter S. Andrews , David Todd Emerson
发明人： Matthew Donofrio , John Adam Edmond , Hua-Shuang Kong , Peter S. Andrews , David Todd Emerson
IPC分类号： H01L27/15 , H01L25/075 , H01L33/50 , H01L33/62
CPC分类号： H01L25/0753 , H01L33/505 , H01L33/62 , H01L2224/16
摘要： An electronic device may include a packaging substrate having a packaging substrate face with a plurality of electrically conductive pads on the packaging substrate face. A first light emitting diode die may bridge first and second ones of the electrically conductive pads. More particularly, the first light emitting diode die may include first anode and cathode contacts respectively coupled to the first and second electrically conductive pads using metallic bonds. Moreover, widths of the metallic bonds between the first anode contact and the first pad and between the first cathode contact and the second pad may be at least 60 percent of a width of the first light emitting diode die. A second light emitting diode die may bridge third and fourth ones of the electrically conductive pads. The second light emitting diode die may include second anode and cathode contacts respectively coupled to the third and fourth electrically conductive pads using metallic bonds. Widths of the metallic bonds between the second anode contact and the second pad and between the second cathode contact and the third pad may be at least 60 percent of a width of the first light emitting diode die.

74. 发明授权

US09053958B2 Light emitting diode (LED) arrays including direct die attach and related assemblies 有权
标题翻译：发光二极管（LED）阵列，包括直接芯片连接和相关组件
公开(公告)号：US09053958B2
公开(公告)日：2015-06-09
申请号：US13463267
申请日：2012-05-03
申请人： Matthew Donofrio , Christopher P. Hussell , John Adam Edmond
发明人： Matthew Donofrio , Christopher P. Hussell , John Adam Edmond
IPC分类号： H01L33/62 , H01L25/075 , H01L33/20 , H01L33/50 , H01L33/54
CPC分类号： H01L25/0753 , H01L33/20 , H01L33/505 , H01L33/54 , H01L2924/0002 , H01L2924/00
摘要： An electronic device may include a packaging substrate having a packaging face and first and second pluralities of light emitting diodes electrically and mechanically coupled to the packaging face of the packaging substrate. The packaging substrate may include first and second electrically conductive pads on the packaging face. The light emitting diodes of the first plurality of light emitting diodes may be electrically coupled in parallel between the first electrically conductive pad and an interconnection structure on the packaging face. The light emitting diodes of the second plurality of light emitting diodes may be electrically coupled in parallel between the interconnection structure and the second electrically conductive pad.
摘要翻译：电子设备可以包括具有封装面的封装基板，以及电气和机械耦合到封装基板的封装面的第一和第二多个发光二极管。包装衬底可以包括在包装面上的第一和第二导电垫。第一多个发光二极管的发光二极管可以并联在第一导电焊盘和封装面上的互连结构之间电耦合。第二多个发光二极管的发光二极管可以在互连结构和第二导电焊盘之间并联电耦合。

75. 发明授权

US08692267B2 High efficiency Group III nitride LED with lenticular surface 有权
标题翻译：高效率III型氮化物LED带透镜表面
公开(公告)号：US08692267B2
公开(公告)日：2014-04-08
申请号：US13188361
申请日：2011-07-21
申请人： John Adam Edmond , David Beardsley Slater, Jr. , Jayesh Bharathan , Matthew Donofrio
发明人： John Adam Edmond , David Beardsley Slater, Jr. , Jayesh Bharathan , Matthew Donofrio
IPC分类号： H01L33/00
CPC分类号： H01L33/007 , H01L33/22 , H01L33/44
摘要： A high efficiency Group III nitride light emitting diode is disclosed. The diode includes a substrate selected from the group consisting of semiconducting and conducting materials, a Group III nitride-based light emitting region on or above the substrate, and, a lenticular surface containing silicon carbide on or above the light emitting region, and extending to said light emitting region.
摘要翻译：公开了一种高效率III族氮化物发光二极管。二极管包括选自由半导体材料和导电材料组成的组的衬底，在衬底上或衬底上的III族氮化物基发光区域，以及在发光区域上或上方含有碳化硅的透镜表面，并延伸到所述发光区域。

76. 外观设计

USD691569S1 LED chip 有权
公开(公告)号：USD691569S1
公开(公告)日：2013-10-15
申请号：US29388240
申请日：2011-03-25
申请人： John A. Edmond , Michael J. Bergmann , Matthew Donofrio , Winston T. Parker
设计人： John A. Edmond , Michael J. Bergmann , Matthew Donofrio , Winston T. Parker

77. 外观设计

USD689210S1 Lamp packages 有权
标题翻译：灯包装
公开(公告)号：USD689210S1
公开(公告)日：2013-09-03
申请号：US29402573
申请日：2011-09-23
申请人： Matthew Donofrio , John Adam Edmond , Hua Shuang Kong , Peter S. Andrews , David Todd Emerson
设计人： Matthew Donofrio , John Adam Edmond , Hua Shuang Kong , Peter S. Andrews , David Todd Emerson

78. 外观设计

USD689209S1 Lamp packages 有权
公开(公告)号：USD689209S1
公开(公告)日：2013-09-03
申请号：US29402571
申请日：2011-09-23
申请人： Matthew Donofrio , John Adam Edmond , Hua-Shuang Kong , Peter S. Andrews , David Todd Emerson
设计人： Matthew Donofrio , John Adam Edmond , Hua-Shuang Kong , Peter S. Andrews , David Todd Emerson

79. 外观设计

USD675580S1 Light emitting diode 有权
公开(公告)号：USD675580S1
公开(公告)日：2013-02-05
申请号：US29386077
申请日：2011-02-24
申请人： John Adam Edmond , Matthew Donofrio
设计人： John Adam Edmond , Matthew Donofrio

80. 发明申请

US20120305949A1 Light Emitting Diode (LED) Arrays Including Direct Die Attach And Related Assemblies 有权
标题翻译：发光二极管（LED）阵列包括直接贴片和相关组件
公开(公告)号：US20120305949A1
公开(公告)日：2012-12-06
申请号：US13463267
申请日：2012-05-03
申请人： Matthew Donofrio , Christopher P. Hussell , John Adam Edmond
发明人： Matthew Donofrio , Christopher P. Hussell , John Adam Edmond
IPC分类号： H01L33/08
CPC分类号： H01L25/0753 , H01L33/20 , H01L33/505 , H01L33/54 , H01L2924/0002 , H01L2924/00
摘要： An electronic device may include a packaging substrate having a packaging face and first and second pluralities of light emitting diodes electrically and mechanically coupled to the packaging face of the packaging substrate. The packaging substrate may include first and second electrically conductive pads on the packaging face. The light emitting diodes of the first plurality of light emitting diodes may be electrically coupled in parallel between the first electrically conductive pad and an interconnection structure on the packaging face. The light emitting diodes of the second plurality of light emitting diodes may be electrically coupled in parallel between the interconnection structure and the second electrically conductive pad.
摘要翻译：电子设备可以包括具有封装面的封装基板，以及电气和机械耦合到封装基板的封装面的第一和第二多个发光二极管。包装衬底可以包括在包装面上的第一和第二导电垫。第一多个发光二极管的发光二极管可以并联在第一导电焊盘和封装面上的互连结构之间电耦合。第二多个发光二极管的发光二极管可以在互连结构和第二导电焊盘之间并联电耦合。

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