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    • 75. 发明申请
    • MOLDING METHOD AND MOLDING DEVICE FOR FORMING IMPELLER
    • 用于形成叶轮的成型方法和成型装置
    • US20120104654A1
    • 2012-05-03
    • US13284225
    • 2011-10-28
    • Masami NATSUMETetsuo ShimizuTomoo Sagawa
    • Masami NATSUMETetsuo ShimizuTomoo Sagawa
    • B29C45/40
    • B29C45/4471B29L2031/08
    • A molding method for forming an impeller, includes a mold clamping process having a first mold for forming one side of blades, a second mold firmly clamped with the first mold, and a core arranged at the first mold relative to the blades, the mold clamping process clamping the first mold to the second mold in a state where the core is arranged between the first mold and the second mold, an injecting process injecting resin in a cavity obtained by the mold clamping process, and a mold removing process including the steps of releasing at least the first mold from the clamped state obtained by the mold clamping process to generate an opened portion in the first mold after the resin is hardened, rotating the core about a rotational axis toward the opened portion of the first mold, and separating the core from the resin-molded impeller.
    • 一种用于形成叶轮的成型方法,包括:模具夹紧工艺,其具有用于形成叶片的一侧的第一模具,与第一模具牢固夹紧的第二模具和相对于叶片在第一模具处布置的芯部,模具夹紧 在芯部布置在第一模具和第二模具之间的状态下,将第一模具夹紧到第二模具中,在通过模具夹紧工艺获得的模腔中注入树脂注入工艺,以及脱模工艺,包括以下步骤: 至少将第一模具从通过合模过程获得的夹紧状态释放,以在树脂硬化之后在第一模具中产生开口部分,使芯围绕旋转轴线朝向第一模具的开口部分旋转, 芯从树脂模制叶轮。
    • 76. 发明授权
    • Light source device and projector
    • 光源设备和投影机
    • US08128239B2
    • 2012-03-06
    • US12757188
    • 2010-04-09
    • Tetsuo ShimizuKaname NagataniKunihiko TakagiAkira EgawaYuji TakadoSatoshi Kinoshita
    • Tetsuo ShimizuKaname NagataniKunihiko TakagiAkira EgawaYuji TakadoSatoshi Kinoshita
    • G03B21/28
    • F21V7/0025F21V7/04G03B21/28
    • A light source device includes a light emitting tube having a light emitting section that emits light, a first sealing section on one side of the light emitting section formed integrally with the light emitting section, and a second sealing section on the other side of the light emitting section formed integrally with the light emitting section. A secondary reflecting mirror having a secondary reflecting surface covers part of a periphery of the light emitting section and reflects light emitted from the light emitting section. A primary reflecting mirror having a primary reflecting surface reflects the light emitted from the light emitting section and the light reflected by the secondary reflecting mirror. The secondary reflecting mirror has a first reference plane defined by a first boundary line as a boundary between the light emitting section and the first sealing section, which does not intersect with the secondary reflecting surface.
    • 光源装置包括具有发光部的发光部的发光管,与发光部一体形成的发光部的一侧的第一密封部和光的另一侧的第二密封部 发光部与发光部一体地形成。 具有副反射面的副反射镜覆盖发光部的周边的一部分,并且反射从发光部发射的光。 具有主反射面的主反射镜反射从发光部发射的光和由二次反射镜反射的光。 二次反射镜具有由与第二反射面不相交的第一边界线作为发光部与第一密封部之间的边界的第一基准面。
    • 80. 发明授权
    • Semiconductor fabrication system, and flow rate correction method and program for semiconductor fabrication system
    • 半导体制造系统,半导体制造系统的流量校正方法和程序
    • US07682843B2
    • 2010-03-23
    • US11817104
    • 2006-06-28
    • Shuji MoriyaTsuneyuki OkabeHiroyuki EbiTetsuo ShimizuHitoshi Kitagawa
    • Shuji MoriyaTsuneyuki OkabeHiroyuki EbiTetsuo ShimizuHitoshi Kitagawa
    • H01L21/66
    • G05D7/0658C23C16/455C23C16/45561C23C16/52
    • Zero point shift based on thermal siphon effect occurring actually when a substrate is processed is detected accurately and corrected suitably. The semiconductor fabrication system comprises a gas supply passage (210) for supplying gas into a heat treatment unit (110), an MFC (240) for comparing an output voltage from a detecting unit for detecting the gas flow rate of the gas supply passage with a set voltage corresponding to a preset flow rate and controlling the gas flow rate of the gas supply passage to the set flow rate, and a control unit (300). The control unit replaces gas in the MFC by gas which is to be used at least for processing a substrate before the substrate is processed, detects the output voltage from the MFC under a state where valves (230, 250) provided in the upstream and the downstream of the MFC are closed and stores the detected output voltage in a storage unit, corrects the set voltage corresponding to the flow rate of gas to be used for processing the substrate based on the output voltage from the MFC stored in the storage unit at the time of processing the substrate, and sets the corrected set voltage in the MFC.
    • 基于处理基板时实际发生的热虹吸效应的零点偏移被准确地检测并适当地校正。 半导体制造系统包括用于将气体供给到热处理单元(110)中的气体供给通道(210),MFC(240),用于将用于检测气体供应通道的气体流量的检测单元的输出电压与 与设定的流量对应的设定电压,将气体供给通路的气体流量控制为设定的流量,以及控制单元(300)。 控制单元通过在基板被处理之前至少用于处理基板的气体来替换MFC中的气体,在设置在上游的阀(230,250)的状态下检测来自MFC的输出电压, 关闭MFC的下游并将检测到的输出电压存储在存储单元中,基于来自存储在存储单元中的MFC的输出电压来校正与用于处理衬底的气体的流量对应的设定电压 处理基板的时间,并将校正的设定电压设置在MFC中。