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    • 72. 发明申请
    • Heated substrate support and method of fabricating same
    • 加热衬底支架及其制造方法
    • US20070090516A1
    • 2007-04-26
    • US11341297
    • 2006-01-27
    • John White
    • John White
    • H01L23/12
    • C23C16/4586H01L21/67103
    • A method and apparatus for forming a substrate support is provided herein. In one embodiment, the substrate support is fabricated by a process that includes forming a groove in a body, disposing a heater element in the groove, and welding the groove to enclose the heater element, wherein the welding forces at least a portion of the body into intimate contact with the heater element. In another embodiment, a method of forming a substrate support is provided that includes forming a groove in a body, disposing a heater element in the groove and stir welding the groove closed to encase the heater element.
    • 本文提供了一种用于形成衬底支撑件的方法和装置。 在一个实施例中,衬底支撑件通过包括在主体中形成凹槽,在槽中设置加热器元件并且焊接凹槽以封闭加热器元件的工艺来制造,其中焊接力至少部分身体 与加热器元件紧密接触。 在另一个实施例中,提供了一种形成衬底支撑件的方法,其包括在主体中形成凹槽,将加热器元件设置在凹槽中,并且将封闭的加热器元件的凹槽搅拌焊接。
    • 73. 发明申请
    • Endoluminal delivery system
    • 腔内输送系统
    • US20070060998A1
    • 2007-03-15
    • US11445952
    • 2006-06-01
    • Alexander ButterwickAshish MitraMartin NgJohn White
    • Alexander ButterwickAshish MitraMartin NgJohn White
    • A61F2/06
    • A61F2/064A61F2/0077A61F2/07A61F2/90A61F2/958A61F2002/30448A61F2220/005A61F2250/0068A61L29/16A61L31/16A61L2300/62
    • An endoluminal delivery system is provided having an endoluminal prosthesis sized to fit through a body lumen in a first unexpanded state, where a second state is an expanded relative to the first state. At least one delivery capsule is incorporated to the outer wall of the endoluminal prosthesis, where each one of the delivery capsules has a predetermined delivery pressure. There is at least one reactant in the delivery capsule, where the endoluminal prosthesis is expanded from the first state to the second state to expand the endoluminal prosthesis against the body lumen and induce the predetermined delivery pressure to the delivery capsule, and deliver the reactants to the body lumen according to desired positioning and timing. At least one containment band incorporated to the outer wall of the endoluminal prosthesis and positioned near the delivery capsules to localize the reactants.
    • 提供了一种腔内递送系统,其具有尺寸适于穿过第一未展开状态的体腔的腔内假体,其中第二状态相对于第一状态是扩张的。 至少一个输送胶囊被并入到腔内假体的外壁,其中每个输送胶囊具有预定的输送压力。 在输送胶囊中存在至少一种反应物,其中腔内假体从第一状态扩张到第二状态,以将内腔假体膨胀抵靠体腔,并且将预定的输送压力输送到输送胶囊,并将反应物递送到 体腔根据所需的定位和定时。 至少一个容纳带,其结合到内腔假体的外壁并且定位在输送胶囊附近以使反应物定位。
    • 74. 发明申请
    • Large-area magnetron sputtering chamber with individually controlled sputtering zones
    • 具有单独控制溅射区的大面积磁控溅射室
    • US20070056850A1
    • 2007-03-15
    • US11225922
    • 2005-09-13
    • Yan YeJohn WhiteAkihiro HosokawaHienminh Le
    • Yan YeJohn WhiteAkihiro HosokawaHienminh Le
    • C23C14/00
    • C23C14/352C23C14/3407
    • The present invention generally provides an apparatus for processing a surface of a substrate in a physical vapor deposition (PVD) chamber that has a sputtering target that has separately biasable sections, regions or zones to improve the deposition uniformity. In general, aspects of the present invention can be used for flat panel display processing, semiconductor processing, solar cell processing, or any other substrate processing. In one aspect, each of the target sections of the multizone target assembly are biased at a different cathodic biases by use of one or more DC or RF power sources. In one aspect, each of the target sections of the multizone target assembly are biased at a different cathodic biases by use of one power source and one or more resistive, capacitive and/or inductive elements. In one aspect, the processing chamber contains a multizone target assembly that has one or more ports that are adapted deliver a processing gas to the processing region of the PVD chamber. In one aspect, the processing chamber contains a multizone target assembly that has one or more magnetron assemblies positioned adjacent to one or more of the target sections.
    • 本发明总体上提供了一种用于处理物理气相沉积(PVD)室中的衬底的表面的设备,其具有具有可分离的偏压部分,区域或区域以提高沉积均匀性的溅射靶。 通常,本发明的各方面可用于平板显示处理,半导体处理,太阳能电池处理或任何其它基板处理。 在一个方面,通过使用一个或多个DC或RF电源将多区域目标组件的每个目标区段偏置在不同的阴极偏压。 在一个方面,通过使用一个电源和一个或多个电阻,电容和/或电感元件,多区域目标组件的每个目标部分被偏置在不同的阴极偏压。 在一个方面,处理室包含一个多区域目标组件,其具有适于将处理气体输送到PVD室的处理区域的一个或多个端口。 在一个方面,处理室包含一个多区域目标组件,其具有邻近一个或多个目标区段定位的一个或多个磁控管组件。
    • 75. 发明申请
    • Method of processing a substrate using a large-area magnetron sputtering chamber with individually controlled sputtering zones
    • 使用具有单独控制的溅射区域的大面积磁控溅射室来处理衬底的方法
    • US20070056843A1
    • 2007-03-15
    • US11225923
    • 2005-09-13
    • Yan YeJohn WhiteAkihiro HosokawaHienminh Le
    • Yan YeJohn WhiteAkihiro HosokawaHienminh Le
    • C23C14/32
    • C23C14/3407C23C14/352
    • The present invention generally provides a method for processing a surface of a substrate in a physical vapor deposition (PVD) chamber that has a sputtering target that has separately biasable sections, regions or zones to improve the deposition uniformity. In general, aspects of the present invention can be used for flat panel display processing, semiconductor processing, solar cell processing, or any other substrate processing. In one aspect, each of the target sections of the multizone target assembly are biased at a different cathodic biases by use of one or more DC or RF power sources. In one aspect, each of the target sections of the multizone target assembly are biased at a different cathodic biases by use of one power source and one or more resistive, capacitive and/or inductive elements. In one aspect, the processing chamber contains a multizone target assembly that has one or more ports that are adapted deliver a processing gas to the processing region of the PVD chamber. In one aspect, the processing chamber contains a multizone target assembly that has one or more magnetron assemblies positioned adjacent to one or more of the target sections.
    • 本发明通常提供了一种用于处理物理气相沉积(PVD)室中的衬底的表面的方法,所述物理气相沉积(PVD)室具有分离的偏压部分,区域或区域以提高沉积均匀性的溅射靶。 通常,本发明的各方面可用于平板显示处理,半导体处理,太阳能电池处理或任何其它基板处理。 在一个方面,通过使用一个或多个DC或RF电源将多区域目标组件的每个目标区段偏置在不同的阴极偏压。 在一个方面,通过使用一个电源和一个或多个电阻,电容和/或电感元件,多区域目标组件的每个目标部分被偏置在不同的阴极偏压。 在一个方面,处理室包含一个多区域目标组件,其具有适于将处理气体输送到PVD室的处理区域的一个或多个端口。 在一个方面,处理室包含一个多区域目标组件,其具有邻近一个或多个目标区段定位的一个或多个磁控管组件。
    • 80. 发明申请
    • Linear vacuum deposition system
    • 线性真空沉积系统
    • US20060278497A1
    • 2006-12-14
    • US11176085
    • 2005-07-07
    • John WhiteWendell Blonigan
    • John WhiteWendell Blonigan
    • B23Q7/00
    • H01L21/67739C23C14/56C23C14/568C23C16/54
    • Embodiments of a vacuum conveyor system are provided herein. In one embodiment a vacuum conveyor system includes a first vacuum sleeve having a plurality of rollers that support and move substrates through the first vacuum sleeve. A port is provided for sealably coupling the first vacuum sleeve to a process chamber. A first substrate handler is disposed proximate the port. Multiple ports may be provided for sealably coupling the first vacuum sleeve to a plurality of process chambers. A dedicated substrate handler is provided for each process chamber. A second vacuum sleeve may be sealably coupled to an opposing side of the process chambers. The vacuum conveyor system may be modular with independent modules linked via load lock chambers. The plurality of rollers may compensate for any sag of the leading edge of a substrate being transported thereupon.
    • 本文提供了真空输送系统的实施例。 在一个实施例中,真空输送系统包括具有支撑并移动基板通过第一真空套筒的多个辊的第一真空套筒。 提供端口用于将第一真空套筒密封地联接到处理室。 第一衬底处理器设置在端口附近。 可以提供多个端口用于将第一真空套管密封地联接到多个处理室。 为每个处理室提供专用的基板处理器。 第二真空套筒可以密封地联接到处理室的相对侧。 真空输送系统可以是模块化的,具有通过负载锁定室连接的独立模块。 多个辊可以补偿在其上运送的基板的前缘的任何下垂。