会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 71. 发明授权
    • Semiconductor device with perovskite capacitor
    • 具有钙钛矿电容器的半导体器件
    • US07122851B2
    • 2006-10-17
    • US10834928
    • 2004-04-30
    • Hiroshi ItokawaKoji YamakawaKatsuaki Natori
    • Hiroshi ItokawaKoji YamakawaKatsuaki Natori
    • H01L29/76H01L29/94H01L31/062H01L31/113H01L31/119
    • H01L27/11502H01L27/11507H01L28/55H01L28/65
    • A semiconductor device comprising a semiconductor substrate, and a capacitor provided above the semiconductor substrate, and including a bottom electrode, a top electrode and a dielectric film between the bottom and top electrodes, the bottom electrode including a conductive film selected from a noble metal film and a noble metal oxide film, a metal oxide film having a perovskite structure, provided between the dielectric film and the conductive film, expressed by ABO3, and containing first metal element as B-site element, and a metal film provided between the conductive film and the metal oxide film, and containing second metal element which is B-site element of a metal oxide having a perovskite structure, a decrease of Gibbs free energy when the second metal element forms oxide being larger than that when the first metal element forms oxide, a thickness of the metal oxide film being 5 nm or less.
    • 一种半导体器件,包括半导体衬底和设置在半导体衬底之上的电容器,并且在底电极和顶电极之间包括底电极,顶电极和电介质膜,底电极包括选自贵金属膜 和由ABO 3 N表示并且包含第一金属元素作为B位元素的电介质膜和导电膜之间的贵金属氧化物膜,具有钙钛矿结构的金属氧化物膜,以及 设置在导电膜和金属氧化物膜之间的金属膜,并且包含作为具有钙钛矿结构的金属氧化物的B位元素的第二金属元素,当第二金属元素形成氧化物时,吉布斯自由能的降低大于 当第一金属元素形成氧化物时,金属氧化物膜的厚度为5nm以下。
    • 73. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20060108624A1
    • 2006-05-25
    • US11024422
    • 2004-12-30
    • Hiroshi ItokawaKoji Yamakawa
    • Hiroshi ItokawaKoji Yamakawa
    • H01L29/94
    • H01L27/11507G11C11/22H01L27/11502H01L28/55H01L28/65H01L28/75
    • A semiconductor device comprises a capacitor including a bottom electrode, a top electrode, and a dielectric film, the bottom electrode comprising a first conductive film containing iridium, a second conductive film provided between the dielectric film and the first conductive film and formed of a noble metal film, a third conductive film provided between the dielectric film and the second conductive film and formed of a conductive metal oxide film having a perovskite structure, and a diffusion prevention film provided between the first conductive film and the second conductive film and including at least one of a metal film and a metal oxide film, the diffusion prevention film preventing diffusion of iridium contained in the first conductive film, the dielectric film including an insulating metal oxide film having a perovskite structure, the insulating metal oxide film being expressed by A(ZrxTi1-x)O3 (A is at least one A site element, 0
    • 一种半导体器件包括:包括底电极,顶电极和电介质膜的电容器,所述底电极包括含有铱的第一导电膜,设置在所述电介质膜和所述第一导电膜之间并由贵金属形成的第二导电膜 金属膜,设置在介电膜和第二导电膜之间并由具有钙钛矿结构的导电金属氧化物膜形成的第三导电膜,以及设置在第一导电膜和第二导电膜之间的扩散防止膜,并且至少包括 金属膜和金属氧化物膜之一,所述扩散防止膜防止包含在所述第一导电膜中的铱的扩散,所述电介质膜包括具有钙钛矿结构的绝缘金属氧化物膜,所述绝缘金属氧化物膜由A( (A是至少一个A位点元素,0
    • 75. 发明授权
    • Barrier stack with improved barrier properties
    • 阻隔层具有改善的阻隔性能
    • US07009230B2
    • 2006-03-07
    • US10604323
    • 2003-07-10
    • Bum Ki MoonGerhard BeitelNicolas NagelAndreas HilligerKoji YamakawaKeitaro Imai
    • Bum Ki MoonGerhard BeitelNicolas NagelAndreas HilligerKoji YamakawaKeitaro Imai
    • H01L29/76
    • H01L27/11502H01L21/28568H01L27/11507H01L28/55H01L28/75
    • An improved barrier stack for inhibiting diffusion of atoms or molecules, such as O2 is disclosed. The barrier stack is particularly useful in capacitor over plug structures to prevent plug oxidation which can adversely impact the reliability of the structures. The barrier stack includes first and second barrier layers. In one embodiment, the first barrier layer comprises first and second sub-barrier layers having mismatched grain boundaries. The sub-barrier layers are selected from, for example, Ir, Ru, Pd, Rh, or alloys thereof. By providing mismatched grain boundaries, the interface of the sub-barrier layers block the diffusion path of oxygen. To further enhance the barrier properties, the first barrier layer is passivated with O2 using, for example, a rapid thermal oxidation. The RTO forms a thin oxide layer on the surface of the first barrier layer. The oxide layer can advantageously promote mismatching of the grain boundaries of the first and second sub-barrier layer. The second barrier layer comprises a conductive oxide.
    • 公开了用于抑制原子或分子扩散的改进的阻挡层,例如O 2。 势垒堆叠在电容器超过插塞结构中特别有用,以防止插塞氧化,这可能不利地影响结构的可靠性。 阻挡层包括第一和第二阻挡层。 在一个实施例中,第一阻挡层包括具有失配的晶界的第一和第二子阻挡层。 亚阻挡层选自例如Ir,Ru,Pd,Rh或其合金。 通过提供错配的晶界,子阻挡层的界面阻挡氧的扩散路径。 为了进一步增强阻挡性能,使用例如快速热氧化,第一阻挡层用O 2 2钝化。 RTO在第一阻挡层的表面上形成薄的氧化物层。 氧化物层可以有利地促进第一和第二子阻挡层的晶界的失配。 第二阻挡层包括导电氧化物。