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    • 77. 发明授权
    • Methods for fabricating semiconductor devices with charge storage patterns
    • 用于制造具有电荷存储模式的半导体器件的方法
    • US08232170B2
    • 2012-07-31
    • US13011607
    • 2011-01-21
    • Young-Woo ParkJung-Dal ChoiJae-Sung Sim
    • Young-Woo ParkJung-Dal ChoiJae-Sung Sim
    • H01L29/792
    • H01L27/11568
    • Provided are methods for fabricating semiconductor devices. A method may include forming a device isolation layer to define active regions on a semiconductor substrate. The active regions may protrude above an upper surface of the device isolation layer. The method may also include forming tunnel insulating layers on upper and side surfaces of corresponding ones of the active regions. The method may further include forming charge storage patterns on corresponding ones of the tunnel insulating layers. The charge storage patterns may be separated from each other. The method may also include forming a blocking insulating layer on the charge storage patterns and the device isolation layer. The method may further include forming a gate electrode on the blocking insulating layer. The blocking insulating layer may cover the device isolation layer such that the gate electrode is precluded from contact with the device isolation layer and the tunnel insulating layers.
    • 提供制造半导体器件的方法。 一种方法可以包括形成器件隔离层以限定半导体衬底上的有源区。 有源区可以突出在器件隔离层的上表面上方。 该方法还可以包括在对应的活性区域的上表面和侧表面上形成隧道绝缘层。 该方法还可以包括在相应的隧道绝缘层上形成电荷存储模式。 电荷存储图案可以彼此分离。 该方法还可以包括在电荷存储图案和器件隔离层上形成阻挡绝缘层。 该方法还可以包括在阻挡绝缘层上形成栅电极。 阻挡绝缘层可以覆盖器件隔离层,使得栅电极不被阻止与器件隔离层和隧道绝缘层接触。
    • 80. 发明授权
    • Nonvolatile memory devices
    • 非易失性存储器件
    • US08629489B2
    • 2014-01-14
    • US13357350
    • 2012-01-24
    • Chang-Hyun LeeJung-Dal Choi
    • Chang-Hyun LeeJung-Dal Choi
    • H01L29/76
    • H01L27/1052G11C16/0483H01L27/11521H01L27/11524
    • A nonvolatile memory device includes a string selection transistor, a plurality of memory cell transistors, and a ground selection transistor electrically connected in series to the string selection transistor and to the pluralities of memory cell transistors. First impurity layers are formed at boundaries of the channels and the source/drain regions of the memory cell transistors. The first impurity layers are doped with opposite conductivity type impurities relative to the source/drain regions of the memory cell transistors. Second impurity layers are formed at boundaries between a channel and a drain region of the string selection transistor and between a channel and a source region of the ground selection transistor. The second impurity layers are doped with the same conductivity type impurities as the first impurity layers and have a higher impurity concentration than the first impurity layers.
    • 非易失性存储器件包括串选择晶体管,多个存储单元晶体管和与串选择晶体管和多个存储单元晶体管串联电连接的接地选择晶体管。 在存储单元晶体管的沟道和源极/漏极区的边界处形成第一杂质层。 相对于存储单元晶体管的源/漏区,第一杂质层掺杂有相反导电类型的杂质。 第二杂质层形成在串选择晶体管的沟道和漏极区之间的边界处,并且在地选择晶体管的沟道和源极区之间形成。 第二杂质层掺杂有与第一杂质层相同的导电类型杂质,并且具有比第一杂质层更高的杂质浓度。