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71. 发明申请

US20070097625A1 Printed circuit board with a heat dissipation device 失效
标题翻译：具有散热装置的印刷电路板
公开(公告)号：US20070097625A1
公开(公告)日：2007-05-03
申请号：US11265367
申请日：2005-11-01
申请人： Yong-Dong Chen , Guang Yu , Shin-Hsuu Wung , Chun-Chi Chen , Hsieh-Kun Lee
发明人： Yong-Dong Chen , Guang Yu , Shin-Hsuu Wung , Chun-Chi Chen , Hsieh-Kun Lee
IPC分类号： H05K7/20
CPC分类号： H05K7/205 , H05K1/0203 , H05K1/181 , H05K3/0061 , H05K2201/0209 , H05K2201/09909
摘要： An electronic assembly includes a printed circuit aboard, a CPU, an electronic component and a thermal pad attached to the printed circuit board. The CPU and the electronic component are located on a first face of the printed circuit board. The electronic component is located near the CPU. The thermal pad is attached to a second face opposite to the first face of the printed circuit board and located just below the electronic component.
摘要翻译：电子组件包括印刷电路板，CPU，电子部件和附接到印刷电路板的散热垫。 CPU和电子部件位于印刷电路板的第一面上。电子元件位于CPU附近。散热焊盘安装在与印刷电路板的第一面相对的第二面上，并位于电子部件正下方。

72. 发明授权

US07190588B2 Heat-dissipating fin assembly for heat sink 失效
标题翻译：散热片散热片组件
公开(公告)号：US07190588B2
公开(公告)日：2007-03-13
申请号：US11135171
申请日：2005-05-23
申请人： Hsieh-Kun Lee , Wan-Lin Xia , Bao-Chun Chen , Neng-Bin Li
发明人： Hsieh-Kun Lee , Wan-Lin Xia , Bao-Chun Chen , Neng-Bin Li
IPC分类号： H05K7/20
CPC分类号： H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A heat-dissipating fin assembly (1) includes a plurality of individual fin plates (12) arranged side by side. Each fin plate includes a main body (14). First and second flanges (16, 18) extend perpendicularly from opposite edges of the main body of each fin plate. A pair of spaced first bridge-shaped tabs (20) extends perpendicularly from the first flange toward the second flange. A pair of spaced second bridge-shaped tabs (24) extends perpendicularly from the second flange toward the first flange. Projections (28) are stamped from the main body opposing to the first and second bridge-shaped tabs. The tabs of each fin plate are interlocked with the projections of an adjacent fin plate. In this manner, all the fin plates are assembled together. The heat-dissipating fin assembly is thus formed.
摘要翻译：散热翅片组件（1）包括并排布置的多个单独翅片板（12）。每个翅板包括主体（14）。第一和第二凸缘（16,18）从每个翅板的主体的相对边缘垂直延伸。一对隔开的第一桥形突片（20）从第一凸缘朝向第二凸缘垂直延伸。一对间隔开的第二桥形突片（24）从第二凸缘垂直地朝向第一凸缘延伸。突起（28）从与第一和第二桥形突片相对的主体冲压。每个翅板的突片与相邻翅片的突起互锁。以这种方式，将所有翅片组装在一起。由此形成散热翅片组件。

73. 发明授权

US07190584B2 Retaining device for heat sink 失效
标题翻译：散热器固定装置
公开(公告)号：US07190584B2
公开(公告)日：2007-03-13
申请号：US11019769
申请日：2004-12-21
申请人： Hsieh-Kun Lee , Dong-Yun Li , Hong-Bo Shi , Min Li
发明人： Hsieh-Kun Lee , Dong-Yun Li , Hong-Bo Shi , Min Li
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A retainer (20) for a heat sink includes a supporting member (22), a bracket member (24), a pair of locking members (26) and an operating member (28). The supporting member defines a pair of openings (222) at opposite ends thereof. The bracket member is located above the supporting member and has a pair of abutting portions (246) extending therefrom. The locking members respectively pass through the openings of the supporting member and are pivotably attached to the bracket member. Each locking member has a spring portion (264) depressed on one of said abutting portions to maintain the locking member at a releasing position. The operating member is pivotable relative to the bracket member to cause the bracket member and the associated locking members to move upward and the supporting member to drive the locking members to turn toward each other to a locking position.
摘要翻译：用于散热器的保持器（20）包括支撑构件（22），支架构件（24），一对锁定构件（26）和操作构件（28）。支撑构件在其相对端部处限定一对开口（222）。托架构件位于支撑构件的上方，并且具有从其延伸的一对邻接部分（246）。锁定构件分别穿过支撑构件的开口并且可枢转地附接到支架构件。每个锁定构件具有在所述邻接部分之一上压下的弹簧部分（264），以将锁定构件保持在释放位置。操作构件相对于支架构件可枢转，以使支架构件和相关联的锁定构件向上移动，并且支撑构件驱动锁定构件朝向彼此转动到锁定位置。

74. 发明申请

US20060245162A1 Heat dissipation device for heat-generating electronic component 失效
标题翻译：用于发热电子部件的散热装置
公开(公告)号：US20060245162A1
公开(公告)日：2006-11-02
申请号：US11268079
申请日：2005-11-07
申请人： Hsieh-Kun Lee , Wan-Lin Xia , Tao Li , Min-Qi Xiao
发明人： Hsieh-Kun Lee , Wan-Lin Xia , Tao Li , Min-Qi Xiao
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a first heat sink (10), a second heat sink (20), a pair of heat pipes (30) connecting the first heat sink and the second heat sink and a fan assembly (40) located between the first heat sink and the second heat sink. The first heat sink comprises a base (12), a cover (14) and a plurality of heat dissipating fins (16) sandwiched between the base and the cover. The second heat sink comprises a plurality of cooling fins (22). Each heat pipe comprises three portions, respectively orderly sandwiched between the base and the heat dissipating fins, sandwiched between the cover and the heat dissipating fins and thermally extending in the cooling fins.
摘要翻译：散热装置包括第一散热器（10），第二散热器（20），连接第一散热器和第二散热器的一对热管（30）和位于第一散热器之间的风扇组件（40）散热片和第二个散热片。第一散热器包括基座（12），盖（14）和夹在基座和盖之间的多个散热翅片（16）。第二散热器包括多个散热片（22）。每个热管包括三个部分，分别有序地夹在基部和散热片之间，夹在盖子和散热翅片之间并在散热片中热延伸。

75. 发明授权

US07116556B2 Heat sink mounting apparatus 失效
标题翻译：散热片安装装置
公开(公告)号：US07116556B2
公开(公告)日：2006-10-03
申请号：US10974040
申请日：2004-10-26
申请人： Hsieh-Kun Lee , Chun-Chi Chen , Liang-Hui Zhao
发明人： Hsieh-Kun Lee , Chun-Chi Chen , Liang-Hui Zhao
IPC分类号： H05K7/20 , A41F1/00
CPC分类号： H01L23/4093 , H01L2924/0002 , Y10T24/42 , Y10T24/44026 , H01L2924/00
摘要： A mounting apparatus (1) includes a locking pin (10) and an operation member (20) attaching to the locking pin. Resilient prongs (13) are formed at a first end of the locking pin. A detent (16) is formed at a periphery of the locking pin. The operation member comprises a compressing portion (21) capable of compressing the prongs radially to a predetermined compressed state when the operation member moves axially in a first direction from the second end to the first end and capable of releasing the prongs when the operation member moves axially in an opposite second direction to allow the prongs to return to their original states, and a catch (24) to engage with the detent to prevent movement of the operation member in the second direction to maintain the prongs at the predetermined compressed state.
摘要翻译：安装装置（1）包括锁定销（10）和附接到锁定销的操作构件（20）。弹性插脚（13）形成在锁定销的第一端。棘爪（16）形成在锁定销的周边。操作构件包括压缩部分（21），其能够在操作构件沿第一方向从第二端向第一端轴向移动时径向地压缩到预定的压缩状态，并且当操作构件移动时能够释放插脚轴向地在相反的第二方向上以允许叉头返回到它们的初始状态;以及卡扣（24），以与止动件接合，以防止操作件沿第二方向移动，以将叉头保持在预定的压缩状态。

76. 发明授权

US07102890B2 Heat sink retention device 失效
标题翻译：散热片保持装置
公开(公告)号：US07102890B2
公开(公告)日：2006-09-05
申请号：US10990078
申请日：2004-11-16
申请人： Hsieh-Kun Lee , Dong-Yun Li , Hong-Bo Shi , Min Li
发明人： Hsieh-Kun Lee , Dong-Yun Li , Hong-Bo Shi , Min Li
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： The retention device comprises a clip and a back plate engaging the clip, the clip comprises pressing members for press the heat sink onto the processor and at least a pair of hooks, the back plate is placed below a printed circuit board on which the processor is mounted, and comprises a body and at least a pair of retaining rings mounted thereof. The retaining rings travel through mounting holes in the printed circuit board and beyond the top surface thereof for catching the hooks of the clip.
摘要翻译：保持装置包括夹子和接合夹子的后板，夹子包括用于将散热器压入处理器和至少一对钩子的按压构件，该后板放置在印刷电路板的下方，处理器并且包括主体和至少一对安装的保持环。保持环穿过印刷电路板中的安装孔并超过其顶表面以捕获夹子的钩。

77. 发明申请

US20060018097A1 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US20060018097A1
公开(公告)日：2006-01-26
申请号：US11168068
申请日：2005-06-28
申请人： Hsieh-Kun Lee , Wan-Lin Xia , Bao-Chun Chen , Neng-Bin Li
发明人： Hsieh-Kun Lee , Wan-Lin Xia , Bao-Chun Chen , Neng-Bin Li
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation assembly includes a heat sink, a retention module and a clip for securing the heat sink to the retention module. The heat sink includes a base for contacting with a heat generating device. The retention module includes a bottom wall and a first sidewall defining a slot therein and extending from the bottom wall. The clip includes a connecting portion pivotably connected to the retention module. The heat sink rests on the bottom wall of the retention module with an end thereof fitting in the slot, and an opposite end thereof being pressed by the clip. The clip can be in a released position that the clip is pivotable, so that the heat sink is removable from the retention module, and a locked position that the clip presses the heat sink. Thus, the heat sink can be secured to the heat generating device expediently.
摘要翻译：散热组件包括散热器，保持模块和用于将散热器固定到保持模块的夹子。散热器包括用于与发热装置接触的基座。保持模块包括底壁和在其中限定槽并从底壁延伸的第一侧壁。夹具包括可枢转地连接到保持模块的连接部分。散热片搁置在保持模块的底壁上，其一端装配在槽中，其相对端由夹子按压。夹子可以处于释放位置，夹子可枢转，使得散热器可从保持模块移除，以及夹子按压散热器的锁定位置。因此，散热器可以方便地固定到发热装置。

78. 发明申请

US20050152119A1 Locking device for heat dissipating device 审中-公开
标题翻译：散热装置锁紧装置
公开(公告)号：US20050152119A1
公开(公告)日：2005-07-14
申请号：US10952688
申请日：2004-09-29
申请人： Hsieh-Kun Lee , Cui-Jun Lu
发明人： Hsieh-Kun Lee , Cui-Jun Lu
IPC分类号： G06F1/20 , H01L23/40 , H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A locking device for mounting a heat sink to a CPU mounted on a printed circuit board, includes a back plate mounted below the circuit board and having a plurality of posts extending upwardly through the circuit board and the heat sink, and a plurality of retainers. Each retainer includes a pressing section resting on the heat sink, a locking section extending from the pressing section, and an operating section extending from the pressing section and opposing the locking section. Each post is extendable through the pressing section of a corresponding retainer to engage with the locking section.
摘要翻译：一种用于将散热器安装到安装在印刷电路板上的CPU的锁定装置，包括安装在电路板下方并具有向上延伸穿过电路板和散热器的多个支柱的背板和多个保持器。每个保持器包括搁置在散热器上的按压部分，从按压部分延伸的锁定部分和从按压部分延伸并与锁定部分相对的操作部分。每个柱可通过相应保持器的按压部分延伸以与锁定部分接合。

79. 发明申请

US20050111193A1 Clip for heat sink 失效
标题翻译：夹子为散热片
公开(公告)号：US20050111193A1
公开(公告)日：2005-05-26
申请号：US10975575
申请日：2004-10-28
申请人： Hsieh-Kun Lee , Cui-Jun Lu , Ling-Bo Cao
发明人： Hsieh-Kun Lee , Cui-Jun Lu , Ling-Bo Cao
IPC分类号： G06F1/16 , H01L23/40 , H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , Y10T24/44026 , H01L2924/00
摘要： A clip for heat sink comprises an inverted T-shaped retaining member and an L-shaped operation member pivotably connected to the retaining member. The retaining member has a detaining portion defining several openings and a connecting portion extending from the detaining portion. The operation member has a press portion for bearing against the heat sink and a holding portion for being grasped extending from the press portion. The operation member is capable of being driven to rotate from a first position to a second position to cause the detaining portion to interlock with a retention module provided on a printed circuit board, thereby securing the heat sink to an electronic element package on the printed circuit board.
摘要翻译：用于散热器的夹具包括倒置的T形保持构件和可枢转地连接到保持构件的L形操作构件。保持构件具有限定几个开口的拘留部分和从扣留部分延伸的连接部分。操作构件具有用于抵靠散热器的按压部分和用于从按压部分延伸的夹持部分。操作构件能够被驱动从第一位置旋转到第二位置，以使得扣留部分与设置在印刷电路板上的保持模块互锁，从而将散热器固定在印刷电路上的电子元件封装板。

80. 发明授权

US06724632B2 Heat sink assembly with adjustable clip 失效
标题翻译：散热器组件带可调节夹
公开(公告)号：US06724632B2
公开(公告)日：2004-04-20
申请号：US10300232
申请日：2002-11-19
申请人： Hsieh-Kun Lee , Dong-Yun Lee , Zhi-Jie Zhang
发明人： Hsieh-Kun Lee , Dong-Yun Lee , Zhi-Jie Zhang
IPC分类号： H05K720
CPC分类号： H01L23/4093 , H01L2023/405 , H01L2023/4081 , H01L2924/0002 , Y10T24/44017 , Y10T24/44026 , H01L2924/00
摘要： A heat sink assembly includes a back plate (10), a clip (20) and a heat sink (50). The back plate is attached below a motherboard (60) on which a CPU (63) is mounted. The heat sink is attached on the CPU. Two posts (13) of the back plate extend through the motherboard and the heat sink. The heat sink includes a base (51) and fins (55). A longitudinal channel (57) is transversely defined through the fins. The base defines a recess (53) under the channel fittingly receiving an annular disc (58) therein. The clip includes a pressing portion (22) received in the channel, and two locking portions (29) engaging with the corresponding posts. A bolt (40) is screwed through the pressing portion to abut against the disc. By adjusting a depth to which the bolt is screwed, the clip can provide adjustable pressure acting on the heat sink.
摘要翻译：散热器组件包括背板（10），夹子（20）和散热器（50）。背板安装在其上安装有CPU（63）的母板（60）的下方。散热器安装在CPU上。背板的两个支柱（13）延伸穿过主板和散热片。散热器包括基座（51）和散热片（55）。纵向通道（57）通过翅片横向地限定。底座在通道下方限定一个凹槽（53），该凹槽在其内装配有环形盘（58）。夹子包括容纳在通道中的按压部分（22）和与相应柱接合的两个锁定部分（29）。螺栓（40）通过按压部分旋拧以抵靠盘。通过调节螺栓拧入的深度，夹子可以提供作用在散热器上的可调压力。

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