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    • 73. 发明授权
    • Multi-layered unit
    • 多层单位
    • US06930875B2
    • 2005-08-16
    • US10460763
    • 2003-06-12
    • Yukio Sakashita
    • Yukio Sakashita
    • H01G4/10H01L21/02H01L21/316H01G4/228
    • H01G4/10H01L21/02197H01L21/02293H01L21/31691H01L28/55H01L28/65
    • A multi-layered unit according to the present invention includes a support substrate formed of a material which has conductivity and on which a dielectric material containing a bismuth layer structured compound can be epitaxially grown, at least the surface thereof being oriented in the [001] direction, and a dielectric layer formed by epitaxially growing a dielectric material containing a bismuth layer structured compound on the support substrate and formed of a dielectric material containing a bismuth layer structured compound oriented in the [001] direction. Since the thus constituted multi-layered unit includes the dielectric layer containing a bismuth layer structured compound oriented in the c axis direction, in the case of, for example, providing an upper electrode on the dielectric layer to form a thin film capacitor and applying a voltage between the electrode layer and the upper electrode, the direction of the electric field substantially coincides with the c axis of the bismuth layer structured compound contained in the dielectric layer. As a result, since the ferroelectric property of the bismuth layer structured compound contained in the dielectric layer can be suppressed and the paraelectric property thereof can be fully exhibited, it is possible to fabricate a thin film capacitor having a small size, large capacitance and an excellent dielectric characteristic.
    • 根据本发明的多层单元包括由具有导电性的材料形成的支撑衬底,并且其上可以外延生长含有铋层结构化合物的电介质材料,至少其表面取向为[001] 方向,以及通过在支撑基板上外延生长含有铋层结构化合物的电介质材料形成的电介质层,并由包含沿[001]方向取向的铋层结构化合物的电介质材料形成。 由于如此构成的多层单元包括在c轴方向上包含铋层结构化合物的电介质层,例如在电介质层上设置上电极以形成薄膜电容器并施加 电极层与上部电极之间的电压,电场方向基本上与包含在电介质层中的铋层结构化合物的c轴重合。 结果,由于可以抑制包含在电介质层中的铋层结构化合物的铁电性能并且可以充分发挥其顺电特性,所以可以制造具有小尺寸,大电容的薄膜电容器和 优良的介电特性。
    • 74. 发明授权
    • Multi-layered unit including electrode and dielectric layer
    • 多层单元包括电极和电介质层
    • US06891714B2
    • 2005-05-10
    • US10375919
    • 2003-02-26
    • Yukio Sakashita
    • Yukio Sakashita
    • B32B15/00C01G29/00H01G4/005H01G4/12H01G4/228H01G4/30H01G4/33H01L27/01H01L27/04
    • H01G4/33H01G4/005H01G4/228H01L27/016H01L28/56H01L28/65Y10T428/12493Y10T428/12535
    • A multi-layered unit according to the present invention includes a support substrate formed of a silicon single crystal, a barrier layer formed on the support substrate of silicon oxide, an electrode layer formed on the barrier layer of platinum, a buffer layer formed on the electrode layer of a dielectric material containing a bismuth layer structured compound having a composition represented by Bi4Ti3O12, having an excellent orientation characteristic and oriented in the c axis direction, and a dielectric layer formed on the buffer layer of a dielectric material containing a bismuth layer structured compound having a composition represented by Bi4Ti3O12, having an excellent capacitor characteristic and oriented in the c axis direction. Since the thus constituted multi-layered unit includes a dielectric layer containing a bismuth layer structured compound oriented in the c axis direction, in the case of, for example, providing an upper electrode on the dielectric layer, thereby fabricating a thin film capacitor and applying a voltage between the electrode layer and the upper electrode, the direction of the electric field substantially coincides with the c axis of the bismuth layer structured compound contained in the dielectric layer. As a result, since the ferroelectric property of the bismuth layer structured compound contained in the dielectric layer can be suppressed and the paraelectric property thereof can be fully exhibited, it is possible to fabricate a semiconductor device by incorporating a thin film capacitor having a small size, large capacitance and an excellent dielectric characteristic into the support substrate of a silicon single crystal together with other devices such as a field effect transistor, a CPU and the like.
    • 根据本发明的多层单元包括由硅单晶形成的支撑衬底,形成在氧化硅支撑衬底上的阻挡层,形成在铂阻挡层上的电极层,形成在该衬底上的缓冲层 电介质材料的电极层,该电介质材料含有具有优良取向特性的由Bi 4 Si 3 N 12 O 12组成的铋层结构化合物 并且在c轴方向上定向,并且形成在包含具有由Bi 4 Si 3 N 3表示的组成的铋层结构化合物的介电材料的缓冲层上的介电层, 具有优异的电容器特性并且沿c轴方向取向。 由于如此构成的多层单元包括在c轴方向上含有铋层结构化合物的电介质层,例如在电介质层上设置上电极的情况下,由此制造薄膜电容器并施加 电极层和上部电极之间的电压,电场的方向基本上与包含在电介质层中的铋层结构化合物的c轴重合。 结果,由于可以抑制包含在电介质层中的铋层结构化合物的铁电性能并且可以充分发挥其顺电特性,所以可以通过结合具有小尺寸的薄膜电容器来制造半导体器件 与诸如场效应晶体管,CPU等的其它器件一起在硅单晶的支撑衬底中具有大的电容和优异的介电特性。
    • 75. 发明授权
    • Multi-layered unit including electrode and dielectric layer
    • 多层单元包括电极和电介质层
    • US06788522B1
    • 2004-09-07
    • US10375924
    • 2003-02-26
    • Yukio Sakashita
    • Yukio Sakashita
    • H01G432
    • H01G4/008H01G4/1218H01G4/33H01L23/5223H01L27/016H01L27/0688H01L28/55H01L28/60H01L2924/0002H01L2924/3011H01L2924/00
    • A multi-layered unit according to the present invention includes a support substrate formed of fused quartz, a buffer layer formed on the support substrate and formed of a dielectric material containing a bismuth layer structured compound oriented in the c axis direction, an electrode layer formed by epitaxially growing crystals of a conductive material on the buffer layer and oriented in the c axis direction, and a dielectric layer formed by epitaxially growing a dielectric material containing a bismuth layer structured compound on the electrode layer and oriented in the c axis direction. Since the thus constituted multi-layered unit includes the dielectric layer containing the bismuth layer structured compound oriented in the c axis direction, in the case of, for example, providing an upper electrode on the dielectric layer to form a thin film capacitor and applying a voltage between the electrode layer and the upper electrode, the direction of the electric field substantially coincides with the c axis of the bismuth layer structured compound contained in the dielectric layer. As a result, since the ferroelectric property of the bismuth layer structured compound contained in the dielectric layer can be suppressed and the paraelectric property thereof can be fully exhibited, it is possible to fabricate a thin film capacitor having a small size and large capacitance.
    • 根据本发明的多层单元包括由熔融石英形成的支撑基板,形成在支撑基板上并由包含在c轴方向上取向的铋层结构化合物的电介质材料形成的缓冲层,形成的电极层 通过在缓冲层上外延生长导电材料的晶体并沿c轴方向定向,并且通过在电极层上外延生长含有铋层结构化合物的介电材料并沿c轴方向取向而形成的电介质层。 由于如此构成的多层单元包括在c轴方向上包含铋层结构化合物的电介质层,所以在例如在电介质层上设置上电极以形成薄膜电容器并施加 电极层与上部电极之间的电压,电场方向基本上与包含在电介质层中的铋层结构化合物的c轴重合。 结果,由于可以抑制包含在电介质层中的铋层结构化合物的铁电性能并且可以充分发挥其顺电特性,所以可以制造具有小尺寸和大电容的薄膜电容器。