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    • 76. 发明授权
    • Design layout for a dense memory cell structure
    • 密集存储单元结构的设计布局
    • US06396096B1
    • 2002-05-28
    • US09597401
    • 2000-06-21
    • Young-Jin ParkCarl J. Radens
    • Young-Jin ParkCarl J. Radens
    • H01L27108
    • H01L27/10855H01L27/10808H01L27/10891Y10S257/908Y10S257/909
    • A design layout for a memory cell structure is provided that achieves maximized channel length on the active areas, while not constricting the contact area of the capacitor contacts is provided. Specifically, the layout design provides a semiconductor memory structure that includes wordlines, bitlines, and sub-8F2 memory cells in a semiconductor substrate, said memory cells comprising a transfer gate transistor having a source region and a drain region formed in said substrate and a gate electrode, a memory cell stacked storage capacitor, a wordline conductor portion contacting said gate electrode, said wordline gate conductor portion forming part of one of said wordlines, a bitline contact to said source region, said bitline contact connecting said source region to one of said bitlines, and a capacitor contact between said capacitor and said drain region, wherein for at least one of said cells, said bitline contact and said capacitor contact are positioned at a distance from each other greater than from said bitline contact to a closest contact of another of said cells and greater than from said capacitor contact to a closest contact of another of said cells.
    • 提供了一种用于存储单元结构的设计布局,其在有源区域上实现最大化的通道长度,同时不限制电容器触点的接触面积。 具体来说,布局设计提供半导体存储器结构,其包括半导体衬底中的字线,位线和子-8F2存储器单元,所述存储单元包括具有形成在所述衬底中的源极区和漏极区的转移栅极晶体管和栅极 存储单元堆叠存储电容器,与所述栅电极接触的字线导体部分,形成所述字线之一的所述字线栅极导体部分,与所述源极区域的位线接触,所述位线接触件将所述源极区域连接到所述 位线和所述电容器与所述漏极区域之间的电容器接触,其中对于所述单元中的至少一个,所述位线接触和所述电容器触点彼此间隔一定距离大于从所述位线接触到另一个的最接近的接触 并且大于从所述电容器接触到另一个所述电池的最接近的接触。
    • 78. 发明授权
    • Crystal-axis-aligned vertical side wall device
    • 水晶轴对齐垂直侧壁装置
    • US06320215B1
    • 2001-11-20
    • US09359292
    • 1999-07-22
    • Gary BronnerUlrike GrueningJack A. MandelmanCarl J. Radens
    • Gary BronnerUlrike GrueningJack A. MandelmanCarl J. Radens
    • H01L27108
    • H01L27/10864H01L27/1087H01L27/10876
    • A dynamic random access memory (DRAM) cell comprising a deep trench storage capacitor having an active transistor device partially disposed on a side wall of the trench. The side wall is aligned to a first crystallographic plane having a crystallographic orientation along a single crystal axis. A process for manufacturing such a DRAM cell comprises: (a) forming a deep trench in a substrate, (b) forming a faceted crystal region along the trench side wall having a single crystallographic orientation, and (c) forming a transistor device partially disposed on the faceted crystal region in the side wall. The faceted crystal region may be formed by growing an oxide collar, such as by local thermal oxidation under oxidation conditions selected to promote a higher oxidation rate along a first family of crystallographic axes than along a second family of crystallographic axes.
    • 一种动态随机存取存储器(DRAM)单元,其包括具有部分地设置在沟槽的侧壁上的有源晶体管器件的深沟槽存储电容器。 侧壁与具有沿着单晶轴的结晶取向的第一结晶平面对准。 制造这种DRAM单元的方法包括:(a)在衬底中形成深沟槽,(b)沿着具有单晶取向的沟槽侧壁形成刻面晶体区域,以及(c)形成部分设置的晶体管器件 在侧壁上的刻面晶体区域上。 小面晶体区域可以通过生长氧化物环形成,例如通过局部热氧化在选择的氧化条件下,以促进沿着第一晶体轴系的较高的氧化速率而不是第二晶体轴系。