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71. 发明授权

US07948056B2 Integrated electronic device and method of making the same 有权
公开(公告)号：US07948056B2
公开(公告)日：2011-05-24
申请号：US11509577
申请日：2006-08-25
申请人： Xiaoyu Mi , Yoshihiro Mizuno , Tsuyoshi Matsumoto , Hisao Okuda , Satoshi Ueda , Takeo Takahashi
发明人： Xiaoyu Mi , Yoshihiro Mizuno , Tsuyoshi Matsumoto , Hisao Okuda , Satoshi Ueda , Takeo Takahashi
IPC分类号： H01L29/00
CPC分类号： H01L27/0688 , H01F17/0006 , H01L23/5227 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H01L2924/00
摘要： An integrated electronic device includes a substrate, passive components, pads for external connection, and three-dimensional wiring. The passive components includes a multi-stage coil inductor provided on the substrate. The multi-stage coil inductor has a plurality of coils disposed in several layers. Mutually adjacent coil wires are spaced-apart from each other. The three-dimensional wiring includes a first wiring portion which extends on the substrate, a second wiring portion which extends off the substrate but along the substrate, and a third wiring portion connecting with the first wiring portion and the second wiring portion.

72. 发明申请

US20070158848A1 Electronic component 有权
标题翻译：电子元器件
公开(公告)号：US20070158848A1
公开(公告)日：2007-07-12
申请号：US11585877
申请日：2006-10-25
申请人： Tsuyoshi Matsumoto , Yoshihiro Mizuno , Xiaoyu Mi , Hisao Okuda , Satoshi Ueda
发明人： Tsuyoshi Matsumoto , Yoshihiro Mizuno , Xiaoyu Mi , Hisao Okuda , Satoshi Ueda
IPC分类号： H01L23/52 , H01L23/48 , H01L29/40
CPC分类号： H01G4/008 , H01G4/232 , H01G4/33 , H01L24/18 , H01L28/10 , H01L28/75
摘要： An electronic component includes a substrate, and a capacitor unit on the substrate. The capacitor unit has a laminate structure including a first electrode layer provided on the substrate, a second electrode layer opposed to the first electrode layer, and a dielectric layer disposed between the first and the second electrode layers. The first electrode layer has a multilayer structure including an adhesion metal layer joined to the dielectric layer. The adhesion metal layer is provided with an oxide coating on a side of the dielectric layer.
摘要翻译：电子部件包括基板和基板上的电容器单元。电容器单元具有包括设置在基板上的第一电极层，与第一电极层相对的第二电极层和设置在第一和第二电极层之间的电介质层的层压结构。第一电极层具有包含与电介质层接合的粘附金属层的多层结构。附着金属层在电介质层一侧设置有氧化物涂层。

73. 发明申请

US20070122992A1 Electronic component manufacturing method and electronic component 失效
标题翻译：电子元件制造方法和电子元器件
公开(公告)号：US20070122992A1
公开(公告)日：2007-05-31
申请号：US11595913
申请日：2006-11-13
申请人： Yoshihiro Mizuno , Xiaoyu Mi , Tsuyoshi Matsumoto , Hisao Okuda , Satoshi Ueda
发明人： Yoshihiro Mizuno , Xiaoyu Mi , Tsuyoshi Matsumoto , Hisao Okuda , Satoshi Ueda
IPC分类号： H01L27/108 , H01L21/20
CPC分类号： H05K1/162 , H01F17/0006 , H01L23/5223 , H01L23/5227 , H01L27/016 , H01L2924/0002 , H05K1/165 , H05K3/108 , H05K3/4644 , H05K3/4647 , H05K3/465 , H05K2201/09563 , H05K2201/09763 , H05K2201/09845 , H05K2203/0733 , H05K2203/1476 , H01L2924/00
摘要： The electronic component includes a base material, a capacitor unit, and a wiring portion. The capacitor unit has a stacked structure including a first electrode portion provided on the base material, a second electrode portion including a first surface opposing the first electrode portion and a second surface opposite to the first surface, and a dielectric portion interposed between the electrode portions. The wiring portion includes a via portion having a surface on the base material side, and joined to the second surface of the second electrode portion via the surface on the base material side. The surface of the via portion on the base material side includes an extending portion extending outward of the periphery of the second surface of the second electrode portion.
摘要翻译：电子部件包括基材，电容器单元和布线部。电容器单元具有包括设置在基材上的第一电极部分的层叠结构，包括与第一电极部分相对的第一表面和与第一表面相对的第二表面的第二电极部分和插入在电极部分之间的电介质部分。布线部包括在基材侧具有表面的通路部，经由基材侧的表面与第二电极部的第二面接合。基材侧的通孔部分的表面包括从第二电极部分的第二表面的周边向外延伸的延伸部分。

74. 发明授权

US08816452B2 Electric device and method of manufacturing the same 有权
标题翻译：电气装置及其制造方法
公开(公告)号：US08816452B2
公开(公告)日：2014-08-26
申请号：US13613424
申请日：2012-09-13
申请人： Tadashi Nakatani , Hisao Okuda , Takashi Katsuki
发明人： Tadashi Nakatani , Hisao Okuda , Takashi Katsuki
IPC分类号： H01L29/86
CPC分类号： B81B3/0067 , B81B3/0021 , B81B2203/0118 , B81B2203/04 , H01H59/0009 , H01H2057/006 , H01L41/0805 , H01L41/0933
摘要： There is provided an electric device including a base member, a beam elastically deformable to bend upward and having an outline partially defined by a slit formed in the base member, a conductive pattern provided on a top surface of the beam, a contact electrode provided above the conductive pattern, the contact electrode coming into contact with the conductive pattern, and a bridge electrode elastically deformable, the bridge electrode connecting the conductive pattern and a portion of the base member outside the outline.
摘要翻译：提供了一种电气装置，其包括基部构件，弹性变形以向上弯曲并具有由形成在基底构件中的狭缝部分限定的轮廓的梁，设置在梁的顶表面上的导电图案，设置在上述所述导电图案，所述接触电极与所述导电图案接触;以及桥接电极，其可弹性变形，所述桥接电极将所述导电图案与所述基部构件的一部分连接在所述轮廓外部。

75. 发明授权

US06262827B1 Galvano-mirror 有权
标题翻译： Galvano镜
公开(公告)号：US06262827B1
公开(公告)日：2001-07-17
申请号：US09559093
申请日：2000-04-27
申请人： Satoshi Ueda , Hisao Okuda
发明人： Satoshi Ueda , Hisao Okuda
IPC分类号： G02B2608
CPC分类号： G02B26/0841
摘要： A galvano-mirror includes a mirror substrate provided with a frame, a mirror element and torsion bars rotatably connecting the mirror element to the frame. The mirror element is provided with a body having an obverse surface and a reverse surface. A mirror surface is formed on the obverse surface, while first electrodes are formed on the reverse surface. The galvano-mirror also includes an electrode substrate provided with second electrodes arranged in facing relation to the first electrodes. The electrode substrate is formed with a through-hole extending through a thickness thereof and facing the mirror element.
摘要翻译：电流镜包括设置有框架的镜基板，镜子元件和将镜子元件可旋转地连接到框架的扭力杆。镜元件设置有具有正面和反面的主体。在正面上形成镜面，而在反面上形成第一电极。电流镜还包括设置有与第一电极相对设置的第二电极的电极基板。电极基板形成有贯穿其厚度并且面向镜子元件的通孔。

76. 发明申请

US20130134529A1 ELECTRIC DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：电气设备及其制造方法
公开(公告)号：US20130134529A1
公开(公告)日：2013-05-30
申请号：US13613424
申请日：2012-09-13
申请人： Tadashi Nakatani , Hisao Okuda , Takashi Katsuki
发明人： Tadashi Nakatani , Hisao Okuda , Takashi Katsuki
IPC分类号： H01L29/84 , H01L21/02
CPC分类号： B81B3/0067 , B81B3/0021 , B81B2203/0118 , B81B2203/04 , H01H59/0009 , H01H2057/006 , H01L41/0805 , H01L41/0933
摘要： There is provided an electric device including a base member, a beam elastically deformable to bend upward and having an outline partially defined by a slit formed in the base member, a conductive pattern provided on a top surface of the beam, a contact electrode provided above the conductive pattern, the contact electrode coming into contact with the conductive pattern, and a bridge electrode elastically deformable, the bridge electrode connecting the conductive pattern and a portion of the base member outside the outline.
摘要翻译：提供了一种电气装置，其包括基部构件，弹性变形以向上弯曲并具有由形成在基底构件中的狭缝部分限定的轮廓的梁，设置在梁的顶表面上的导电图案，设置在上述所述导电图案，所述接触电极与所述导电图案接触;以及桥接电极，其可弹性变形，所述桥接电极将所述导电图案与所述基部构件的一部分连接在所述轮廓外部。

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