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    • 72. 发明申请
    • Liquid crystal display device
    • 液晶显示装置
    • US20080136987A1
    • 2008-06-12
    • US12007691
    • 2008-01-14
    • Sang Hyun Kim
    • Sang Hyun Kim
    • G02F1/1368
    • G02F1/136227
    • A method of fabricating a liquid crystal display device includes forming a data bus line on a substrate, forming a preliminary interlayer insulating layer having a first thickness on the substrate including the data bus line, forming an interlayer insulating layer by etching the preliminary interlayer insulating layer to a second thickness less than the first thickness, the interlayer insulating layer having a planarized surface, sequentially forming a semiconductor layer, a gate insulating layer, and a gate electrode on the interlayer insulating layer, forming a passivation layer on the substrate, forming a plurality of contact holes exposing portions of the data bus line and the semiconductor layer by etching portions of the passivation layer, and forming a pixel electrode on the passivation layer.
    • 一种液晶显示装置的制造方法,其特征在于,在基板上形成数据总线,在包括所述数据总线的基板上形成具有第一厚度的预备层间绝缘层,通过蚀刻所述初始层间绝缘层 所述层间绝缘层具有平坦化表面,在所述层间绝缘层上依次形成半导体层,栅极绝缘层和栅电极,在所述基板上形成钝化层,形成所述第一厚度, 多个接触孔通过蚀刻钝化层的部分而暴露数据总线和半导体层的部分,以及在钝化层上形成像素电极。
    • 73. 发明授权
    • Liquid crystal display device and method of fabricating the same
    • 液晶显示装置及其制造方法
    • US07342631B2
    • 2008-03-11
    • US10863235
    • 2004-06-09
    • Sang Hyun Kim
    • Sang Hyun Kim
    • G02F1/1343
    • G02F1/136227
    • A method of fabricating a liquid crystal display device includes forming a data bus line on a substrate, forming a preliminary interlayer insulating layer having a first thickness on the substrate including the data bus line, forming an interlayer insulating layer by etching the preliminary interlayer insulating layer to a second thickness less than the first thickness, the interlayer insulating layer having a planarized surface, sequentially forming a semiconductor layer, a gate insulating layer, and a gate electrode on the interlayer insulating layer, forming a passivation layer on the substrate, forming a plurality of contact holes exposing portions of the data bus line and the semiconductor layer by etching portions of the passivation layer, and forming a pixel electrode on the passivation layer.
    • 一种液晶显示装置的制造方法,其特征在于,在基板上形成数据总线,在包括所述数据总线的基板上形成具有第一厚度的预备层间绝缘层,通过蚀刻所述初始层间绝缘层 所述层间绝缘层具有平坦化表面,在所述层间绝缘层上依次形成半导体层,栅极绝缘层和栅电极,在所述基板上形成钝化层,形成所述第一厚度, 多个接触孔通过蚀刻钝化层的部分而暴露数据总线和半导体层的部分,以及在钝化层上形成像素电极。
    • 75. 发明授权
    • Method for fabricating MOS transistor having dual gate
    • 制造具有双栅极的MOS晶体管的方法
    • US06326252B1
    • 2001-12-04
    • US09481321
    • 2000-01-11
    • Sang Hyun KimNam Hoon ChoJae Sung RohJeong Mo Hwang
    • Sang Hyun KimNam Hoon ChoJae Sung RohJeong Mo Hwang
    • H01L218238
    • H01L21/76218H01L21/823842
    • Methods of forming a MOS transistor having dual gates minimizes impurity channeling and diffusion that can occur during impurity injection and activating processes. A method of fabricating the transistor includes the steps of forming a first conduction type well and a second conduction type well in a semiconductor substrate having an isolation region and an active region formed therein. Then, a gate oxide film is formed on an entire surface of the substrate, and a polysilicon layer is deposited on the gate oxide film preferably at a temperature of about 660° C. to about 700° C. and a pressure of about 10 to about 300 Torr. Next, portions of the polysilicon layer and the gate oxide film are selectively removed to form a gate electrode on each of the wells. Impurity ions are injected, having a conduction type opposite a conduction type of the corresponding well, into an exposed surface of each of the wells, to form lightly doped impurity regions. Insulating film sidewalls are formed at sides of each of the gates. Then, first conduction type impurity ions are heavily injected into a surface of the exposed first conduction type well and into the gate electrode formed on the first conduction type well. Also, second conduction type impurity ions are heavily injected into a surface of the exposed second conduction type well and into the gate electrode formed on the second conduction type well. Next, a first heat treatment is conducted in an oxygen ambient and a second heat treatment is conducted in a nitrogen ambient, to diffuse the impurities.
    • 形成具有双栅极的MOS晶体管的方法使杂质注入和激活过程中可能发生的杂质沟道和扩散最小化。 制造晶体管的方法包括以下步骤:在其中形成有隔离区域和有源区域的半导体衬底中形成第一导电类型阱和第二导电类型阱。 然后,在基板的整个表面上形成栅极氧化膜,优选在约660℃〜约700℃的温度和约10〜10℃的压力下,在栅极氧化膜上沉积多晶硅层 约300乇。 接下来,选择性地去除多晶硅层和栅极氧化物膜的部分以在每个阱上形成栅电极。 将具有与相应的阱的导电类型相反的导电类型的杂质离子注入每个阱的暴露表面,以形成轻掺杂杂质区。 绝缘膜侧壁形成在每个栅极的侧面。 然后,第一导电型杂质离子被重度地注入到暴露的第一导电类型阱的表面中并进入形成在第一导电类型阱上的栅电极中。 此外,第二导电型杂质离子被严重地注入到暴露的第二导电类型阱的表面中并进入形成在第二导电类型阱上的栅电极中。 接下来,在氧环境中进行第一热处理,并且在氮气环境中进行第二热处理以扩散杂质。