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    • 74. 发明申请
    • Sputtering target and process for producing the same
    • 溅射目标和生产方法
    • US20060099126A1
    • 2006-05-11
    • US10547816
    • 2004-02-03
    • Hideo HosonoKazushige UedaMasataka YahagiHideo Takami
    • Hideo HosonoKazushige UedaMasataka YahagiHideo Takami
    • C01F17/00B22D7/00
    • C04B35/645C04B35/547C04B2235/3227C04B2235/446C04B2235/5409C04B2235/5436C04B2235/72C04B2235/77C04B2235/786C23C14/3414Y10T428/12
    • A manufacturing method of a sputtering target having mainly oxychalcogenide containing La and Cu by sintering at least one or more powders selected from an elementary substance of a constituent element, oxide or chalcogenide as the raw material, characterized in including a reaction step of retaining the [material] at a temperature of 850° C. or less for 1 hour or more during the sintering step, wherein this [material], after the reaction step, is subject to pressure sintering at a temperature that is higher than the reaction step temperature. In addition to increasing the density of a P-type transparent conductive material target having mainly oxychalcogenide containing La and Cu and enabling the enlargement of the target at a low manufacturing cost, the existence of unreacted matter in the target can be eliminated, the production yield can be improved by suppressing the generation of cracks in the target, and the quality of deposition formed by sputtering this kind of target can also be improved.
    • 一种溅射靶的制造方法,其特征在于,具有通过烧结选自构成元素的基本物质,氧化物或硫族化物的至少一种以上的粉末作为原料的含有含有La和Cu的氧化硫元素的溅射靶,其特征在于,包括: 材料]在烧结工序中在850℃以下的温度下保持1小时以上,其中在反应工序后,将该材料在比反应步骤温度高的温度进行加压烧结。 除了增加含有含有La和Cu的含氧硫属元素的P型透明导电材料靶的密度以外,能够以低的制造成本扩大靶,除此之外,可以消除靶中未反应物的存在,生产率 可以通过抑制靶中的裂纹的产生而得到改善,也可以提高通过溅射形成的沉积物的质量。