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71. 发明授权

US07420995B2 Simultaneously mode-locked, Q-switched laser 失效
标题翻译：同时锁模Q开关激光器
公开(公告)号：US07420995B2
公开(公告)日：2008-09-02
申请号：US11567150
申请日：2006-12-05
申请人： Yunlong Sun
发明人： Yunlong Sun
IPC分类号： H01S3/11
CPC分类号： H01S3/1118 , B23K26/0624 , B23K26/083 , B23K26/40 , B23K2101/40 , B23K2103/50 , H01S3/0602 , H01S3/0816 , H01S3/09415 , H01S3/11 , H01S3/117 , H01S3/1643
摘要： A simultaneously mode-locked, Q-switched laser is configured to prevent loss of mode lock during laser operation. A preferred embodiment prevents loss of mode lock by operating the laser between the Q-switched pulses with a residual level of laser power sufficient to maintain a mode-locked state. The residual laser power output can be blocked by a pulse picking device.
摘要翻译：同时锁模的Q开关激光器被配置为防止激光器操作期间模式锁定的损失。优选实施例通过在具有足以维持锁模状态的激光功率的剩余水平的Q开关脉冲之间操作激光来防止模式锁定的损失。剩余激光功率输出可以被脉冲拾取装置阻挡。

72. 发明授权

US07396706B2 Synchronization technique for forming a substantially stable laser output pulse profile having different wavelength peaks 有权
标题翻译：用于形成具有不同波长峰值的基本稳定的激光输出脉冲分布的同步技术
公开(公告)号：US07396706B2
公开(公告)日：2008-07-08
申请号：US11067299
申请日：2005-02-25
申请人： Yunlong Sun , Richard Harris , William J. Jordens , Lei Sun
发明人： Yunlong Sun , Richard Harris , William J. Jordens , Lei Sun
IPC分类号： B23K26/36 , H01L35/34 , H01L21/30
CPC分类号： H01L23/5258 , B23K26/0604 , B23K26/0613 , B23K26/0622 , B23K26/067 , B23K26/361 , B23K26/40 , B23K2103/08 , B23K2103/10 , B23K2103/12 , B23K2103/14 , B23K2103/172 , B23K2103/26 , B23K2103/50 , H01L2924/0002 , H01S3/10046 , H01S3/2383 , Y10S438/94 , H01L2924/00
摘要： A specially shaped laser pulse energy profile characterized by different laser wavelengths at different times of the profile provides reduced, controlled jitter to enable semiconductor device micromachining that achieves high quality processing and a smaller possible spot size.
摘要翻译：在轮廓不同时刻，不同激光波长的特殊形状的激光脉冲能量分布提供了减少的受控抖动，从而能够实现高质量处理和较小可能光斑尺寸的半导体器件微机械加工。

73. 发明授权

US07348516B2 Methods of and laser systems for link processing using laser pulses with specially tailored power profiles 有权
标题翻译：使用激光脉冲进行链接处理的特殊定制功率曲线的方法和激光系统
公开(公告)号：US07348516B2
公开(公告)日：2008-03-25
申请号：US10921481
申请日：2004-08-18
申请人： Yunlong Sun , Richard Harris , Ho Wai Lo , Brian Baird , Jay Johnson , Robert F. Hainsey
发明人： Yunlong Sun , Richard Harris , Ho Wai Lo , Brian Baird , Jay Johnson , Robert F. Hainsey
IPC分类号： B23K26/00 , B23K26/14 , B23K26/16
CPC分类号： H01L23/5258 , B23K26/0613 , B23K26/0622 , B23K2101/40 , H01L2924/0002 , H01L2924/00
摘要： A laser pulse with a specially tailored temporal power profile, instead of a conventional temporal shape or substantially square shape, severs an IC link. The specially tailored laser pulse preferably has either an overshoot at the beginning of the laser pulse or a spike peak within the duration of the laser pulse. The timing of the spike peak is preferably set ahead of the time when the link is mostly removed. A specially tailored laser pulse power profile allows the use of a wider laser pulse energy range and shorter laser wavelengths, such as the green and UV, to sever the links without appreciable damage to the substrate and passivation structure material located on either side of and underlying the links.
摘要翻译：具有特别定制的时间功率分布的激光脉冲代替传统的时间形状或基本上正方形的形状来切断IC连接。特别定制的激光脉冲优选地在激光脉冲的开始处具有过冲，或者在激光脉冲的持续时间内具有尖峰。尖峰的定时优先设置在链路被大部分去除的时间之前。特别定制的激光脉冲功率轮廓允许使用更宽的激光脉冲能量范围和更短的激光波长（例如绿色和紫外线）来切断连接，而不会对基板和钝化结构材料的任何一侧和底层链接。

74. 发明授权

US07289549B2 Lasers for synchronized pulse shape tailoring 有权
标题翻译：激光同步脉冲形状裁剪
公开(公告)号：US07289549B2
公开(公告)日：2007-10-30
申请号：US11067470
申请日：2005-02-25
申请人： Yunlong Sun , Lei Sun
发明人： Yunlong Sun , Lei Sun
IPC分类号： H01S3/082
CPC分类号： H01S3/082 , B23K26/0622 , H01S3/07 , H01S3/0805 , H01S3/08086 , H01S3/083 , H01S3/10038 , H01S3/10046 , H01S3/109 , H01S3/117 , H01S3/127 , H01S3/1611
摘要： A plurality of subresonators (12, 14), having different design configurations, share a common resonator section (18) such that the lasing action can be substantially synchronized to provide coherent laser pulses that merge the different respective pulse energy profile and/or pulse width characteristics imparted by the configurations of the subresonators (12, 14). The subresonators (12, 14) may share a laser medium (42) in the common section, or each distinct subresonator section (28, 36) may have its own laser medium (42). Exemplary long and short subresonators (12, 14) generate specially tailored laser pulses having a short rise time and a long pulse width at one wavelength or two different wavelengths that may be beneficial for a variety of laser and micromachining applications including memory link processing.
摘要翻译：具有不同设计配置的多个子共振器（12,14）共享公共谐振器部分（18），使得激光作用可以基本上同步，以提供合并不同的相应脉冲能量分布和/或脉冲宽度的相干激光脉冲通过子共振器（12,14）的构造赋予的特性。子共振器（12,14）可以在公共部分中共享激光介质（42），或者每个不同的子谐振器部分（28,36）可以具有其自己的激光介质（42）。示例性的长和短子谐振器（12,14）产生特定定制的激光脉冲，其具有在一个波长或两个不同波长处具有短的上升时间和长脉冲宽度，这可能对于包括存储器链路处理的各种激光和微加工应用有利。

75. 发明申请

US20070153841A1 Multi-output harmonic laser and methods employing same 审中-公开
标题翻译：多输出谐波激光器及其使用方法
公开(公告)号：US20070153841A1
公开(公告)日：2007-07-05
申请号：US11603969
申请日：2006-11-21
申请人： Yunlong Sun
发明人： Yunlong Sun
IPC分类号： H01S3/11 , H01S3/10
CPC分类号： H01S3/109 , H01S3/005 , H01S3/07 , H01S3/0813 , H01S3/09415 , H01S3/117
摘要： A solid-state laser (10) has a laser resonator (20) with output ports (22) at both ends to provide two separate laser micromachining beams (42). A set of wavelength converters (26) can be employed to convert the laser machining beams (42) to harmonic wavelength outputs, thus reducing the risk of damage to the wavelength converters and enabling higher total average harmonic power to be generated from a single laser. The laser machining beams (42) can be different to perform different laser operations independently or can be adapted to have substantially identical parameters to permit simultaneous parallel high-quality laser operations on substantially identical workpieces (54), or the laser machining beams (42) can be combined to provide a single laser system output (42e). The two laser machining beams (42) can be further split or multiplexed to suit particular applications.
摘要翻译：固体激光器（10）具有在两端具有输出端口（22）的激光谐振器（20），以提供两个单独的激光微加工光束（42）。可以使用一组波长转换器（26）将激光加工光束（42）转换成谐波波长输出，从而降低损坏波长转换器的风险，并且能够从单个激光器产生更高的总平均谐波功率。激光加工光束（42）可以不同，以独立地执行不同的激光操作，或者可以适于具有基本上相同的参数，以允许在基本上相同的工件（54）上的同时并行的高质量激光操作或激光加工光束（42）可以组合提供单个激光系统输出（42e）。两个激光加工光束（42）可进一步分割或多路复用以适合特定应用。

76. 发明申请

US20060285571A1 Diode-pumped, solid-state laser with chip-shaped laser medium and heat sink 审中-公开
标题翻译：二极管泵浦，固态激光器与芯片形激光介质和散热片
公开(公告)号：US20060285571A1
公开(公告)日：2006-12-21
申请号：US11157271
申请日：2005-06-20
申请人： Yunlong Sun , Brian Baird
发明人： Yunlong Sun , Brian Baird
IPC分类号： H01S3/04 , H01S3/16 , H01S3/091
CPC分类号： H01S3/0941 , H01S3/0405 , H01S3/042 , H01S3/0604 , H01S3/0612 , H01S3/0627 , H01S3/07 , H01S3/094084 , H01S3/1611 , H01S3/1673
摘要： A chip-shaped laser medium (12) is side pumped to improve mode matching between the pumping energy (50) and lasing mode volume (36). The chip thickness (44) and laser medium doping level can be designed and controlled to ensure adequate pumping coupling efficiency. The chip shape can also be employed to provide greater chip surface areas (22) for cooling the laser medium (12). The laser pumping package (70), gain module (101), and chip-shaped design can be scalable to offer higher pumping power and high output power. Different orientations of the gain modules (101) with respect to each other can be used to provide better lasing mode quality.
摘要翻译：侧面泵浦芯片状激光介质（12）以改善泵送能量（50）和激光模式体积（36）之间的模式匹配。可以设计和控制芯片厚度（44）和激光介质掺杂水平，以确保足够的泵浦耦合效率。也可以使用芯片形状来提供用于冷却激光介质（12）的更大的芯片表面积（22）。激光泵浦封装（70），增益模块（10 1 1）和芯片形设计可以是可扩展的，以提供更高的泵浦功率和高输出功率。可以使用增益模块（10 SUB）相对于彼此的不同取向来提供更好的激光模式质量。

77. 发明授权

US07139294B2 Multi-output harmonic laser and methods employing same 有权
标题翻译：多输出谐波激光器及其使用方法
公开(公告)号：US07139294B2
公开(公告)日：2006-11-21
申请号：US10893148
申请日：2004-07-16
申请人： Yunlong Sun
发明人： Yunlong Sun
IPC分类号： H01S3/11 , H01S3/10 , B23K26/00
CPC分类号： H01S3/109 , H01S3/005 , H01S3/07 , H01S3/0813 , H01S3/09415 , H01S3/117
摘要： A solid-state laser (10) has a laser resonator (20) with output ports (22) at both ends to provide two separate laser micromachining beams (42). A set of wavelength converters (26) can be employed to convert the laser machining beams (42) to harmonic wavelength outputs, thus reducing the risk of damage to the wavelength converters and enabling higher total average harmonic power to be generated from a single laser. The laser machining beams (42) can be different to perform different laser operations independently or can be adapted to have substantially identical parameters to permit simultaneous parallel high-quality laser operations on substantially identical workpieces (54), or the laser machining beams (42) can be combined to provide a single laser system output (42e). The two laser machining beams (42) can be further split or multiplexed to suit particular applications.
摘要翻译：固体激光器（10）具有在两端具有输出端口（22）的激光谐振器（20），以提供两个单独的激光微加工光束（42）。可以使用一组波长转换器（26）将激光加工光束（42）转换成谐波波长输出，从而降低了损坏波长转换器的风险，并且使得能够从单个激光器产生更高的总平均谐波功率。激光加工光束（42）可以不同，以独立地执行不同的激光操作，或者可以适于具有基本上相同的参数，以允许在基本上相同的工件（54）上的同时并行的高质量激光操作或激光加工光束（42）可以组合提供单个激光系统输出（42e）。两个激光加工光束（42）可进一步分割或多路复用以适合特定应用。

78. 发明申请

US20060141681A1 Processing a memory link with a set of at least two laser pulses 审中-公开
公开(公告)号：US20060141681A1
公开(公告)日：2006-06-29
申请号：US11360965
申请日：2006-02-22
申请人： Yunlong Sun , Edward Swenson , Richard Harris
发明人： Yunlong Sun , Edward Swenson , Richard Harris
IPC分类号： H01L21/82
CPC分类号： H01S3/2383 , B23K26/04 , B23K26/0604 , B23K26/0613 , B23K26/0622 , B23K26/0624 , B23K26/067 , B23K26/361 , G03F7/70041 , G03F7/70725 , H01L21/76894 , H01L23/5254 , H01L23/5258 , H01L2924/0002 , H01S3/005 , H01S3/0057 , H01S3/0085 , H01S3/0092 , H01S3/1118 , H01S5/4012 , H01L2924/00
摘要： A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.

79. 发明申请

US20060140230A1 Processing a memory link with a set of at least two laser pulses 审中-公开
公开(公告)号：US20060140230A1
公开(公告)日：2006-06-29
申请号：US11359215
申请日：2006-02-21
申请人： Yunlong Sun , Edward Swenson , Richard Harris
发明人： Yunlong Sun , Edward Swenson , Richard Harris
IPC分类号： H01S3/10
CPC分类号： B23K26/04 , B23K26/0604 , B23K26/0613 , B23K26/0622 , B23K26/0624 , B23K26/067 , B23K26/361 , G03F7/70041 , G03F7/70725 , H01L21/76894 , H01L23/5258 , H01L2924/0002 , H01S3/005 , H01S3/0057 , H01S3/0085 , H01S3/0092 , H01S3/1118 , H01S3/2383 , H01S5/4012 , Y10S438/94 , H01L2924/00
摘要： A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.

80. 发明申请

US20060138109A1 Processing a memory link with a set of at least two laser pulses 审中-公开
公开(公告)号：US20060138109A1
公开(公告)日：2006-06-29
申请号：US11360962
申请日：2006-02-22
申请人： Yunlong Sun , Edward Swenson , Richard Harris
发明人： Yunlong Sun , Edward Swenson , Richard Harris
IPC分类号： B23K26/16
CPC分类号： B23K26/04 , B23K26/0604 , B23K26/0613 , B23K26/0622 , B23K26/0624 , B23K26/067 , B23K26/361 , G03F7/70041 , G03F7/70725 , H01L21/76894 , H01L23/5258 , H01L2924/0002 , H01S3/005 , H01S3/0057 , H01S3/0085 , H01S3/0092 , H01S3/1118 , H01S3/2383 , H01S5/4012 , Y10S438/94 , H01L2924/00
摘要： A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.

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